Journal of SMT Article
FLUX-LESS / VOID-FREE: AN ENVIRONMENT-FRIENDLY SOLDERING PROCESS FOR OPTOELECTRONICS ASSEMBLIES
Company: SST International
Date Published: 4/1/2003 Volume: 16-2
A typical optoelectronics system is made up of laser and photo diodes, light transmitters, optical fibers, switches, detector and signal conditioners (see Figure 1). Packaging of these devices is becoming more complex because of the need to protect the devices from environments, to dissipate internally generated heat, to maintain long-term functionality when subject to operating temperatures, and to withstand shock due to environmental conditions or power cycling.
The presence of voids reduces the reliability of the device when subjected to mechanical and thermal stresses. Improved advancements were developed where flux-less and void-free results were achieved using a technique referred to as the "pressure variation" method.
Traditional "hermeticity levels" for protection of microelectronic devices may not apply to all optoelectronics devices. Getter firing as part of the package seal process means higher yields, total control of the internal atmosphere of the package, improved quality and reliability.
The purpose of this paper is to propose a soldering system that:
Key words: flux-less, void-free, pressure variation, hermeticity, getter pumps.
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