Journal of SMT Article
IMPACT OF COMPONENT TERMINAL FINISH ON THE RELIABILITY OF Pb-FREE SOLDER JOINTS
Company: Hewlett-Packard Co.
Date Published: 10/1/2002 Volume: 15-4
In this study, we investigated the reliability of SMT solder joints made with Sn/3.8Ag/0.7Cu solder and leaded components with a variety of surface finishes: pure Sn, Sn3Cu, and Sn alloyed with Bi in concentrations of 1, 3 and 6 weight percent. This investigation included metallographic examination and lead pull testing of aged and unaged joints. Accelerated thermal cycling of surface mount joints also has been initiated and preliminary results are described. The results of a limited study on the quality of wave soldered, through-hole joints with SnBi and SnPb platings are also presented. Our findings suggest that all of the Pb-free terminal finishes investigated produce joints with SnAgCu solder that perform at least as well as conventional, fully SnPb joints.
Key words: Pb-free solder, terminal finish, reliability.
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