Journal of SMT Article


Author: Marie S. Cole
Company: IBM Microelectronics
Date Published: 1/1/2002   Volume: 15-1

Abstract: The ceramic column grid array (CCGA) package is used today for an increasing number of microelectronic products due to its many advantages: interconnection density, number of interconnections, compatibility with standard surface mount technology (SMT) assembly techniques, and excellent thermal and electrical performance. CCGA packages are commonly used for logic and microprocessor applications and can be found in a variety of systems, including work station, server and network applications.

As interest in CCGA packaging has increased, so have the challenges in meeting the interconnection and system application requirements. Increasing numbers of interconnects are required for network applications. The 1657 I/O provided on a 42.5 mm, 1.0 mm pitch CCGA are no longer sufficient for new applications. The industry is driving to more than 1500 signals for these I/O intensive applications, resulting in over 2000 total connections. Manufacturability constraints limit the cost effectiveness of the printed circuit board (PCB) to 1.0 mm pitch packages for high interconnection applications. Thus, increasing the body size while maintaining 1.0 mm pitch is preferred over decreasing the pitch to 0.8 mm and maintaining the body size at 42.5 mm.

Key words: CCGA, ball grid array, high I/O, card assembly reliability.

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