Journal of SMT Article

OPTOELECTRONIC PACKAGING TECHNOLOGIES FOR FUTURE TELECOMMUNICATION SYSTEMS IN JAPAN

Author: Hideyuki Takahara
Company: NTT Telecommunications
Date Published: 7/1/2001   Volume: 14-3

Abstract: This paper describes current research and development of optical packaging technologies in Japan to overcome the electrical bottleneck for large-throughput hardware systems. Compact, low-cost, and reliable parallel optical interconnection modules for board-to-board or inter-cabinet interconnection have been developed with total throughput of over 15 Gbit/s. Japan's five-year Electronics System Integration Technology Research project was started in August 1999 to develop over-100-Gbit/s OE-MCM packaging technologies and over-Tbit/s OE subsystem packaging technologies. The key technologies include large throughput OE substrate fabrication and defect-free self-aligned, mechanically reliable microsolder bump bonding.

Key words: Optoelectronic packaging, parallel optical interconnection module, OE-MCM, OE-board, flip-chip bonding.



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