Journal of SMT Article
A SMORGASBORD OF PACKAGES – PETITE AND LIGHT
Company: Cookson Electronics
Date Published: 7/1/2001 Volume: 14-3
The flex-based packaging arena has also gained stature by losing height and shedding weight with 25-micron materials that produce lines and spaces approaching but a few microns with vacuum-deposited metal. Flex-BGAs are gaining share as they reach for the high-density and lightweight titles.
And just when the industry could almost take a rest, there came a new assault from an unexpected camp. MEMS (micro-electro-mechanical systems) was thrust onto center stage as Internet giants embraced lightwaves and sought photonic switching solutions. The MEMS devices that “move, breathe, see, hear and think”, require totally new packaging. Then came the second volley from the same camp when optics was added to bring MOEMS (micro-opto-electro-mechanical systems) into focus. The Internet seeks to catch the wave with magical micro mirrors that would snatch a light beam and route it into cyberspace. The opto devices now demand windows in their package along with other new and challenging amenities.
This paper will review and update the exciting Package Revolution describing packages that were, those that are and some that are only dreams.
Key Words: Bluetooth, MEMS, MOEMS, photonics, wireless.
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