Journal of SMT Article

CIRCUIT CONSTRUCTIONS AND MATERIAL SELECTIONS OF FLEX CIRCUITS FOR HIGH DENSITY INTERCONNECTS

Author: Dominique Numakura
Company: Parlex Corporation
Date Published: 4/1/2001   Volume: 14-2

Abstract: In the past three years, numerous new electronics applications have utilized high density flex circuits. In 1999, the high density flex circuit market was over $2.0 billion. By 2004, it is expected that this market, which is increasing more rapidly than the traditional flex circuit industry, will be greater than $6.0 billion. The extreme miniaturization of portable electronics products, such as mobile phones and personal digital assistants (PDA’s), are examples of devices that are driving the market’s growth.

A single high density circuit can replace numerous wires and connectors, which makes it a cost-effective interconnect solution. The key to the whole design package, however, is suitable termination.



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