Journal of SMT Article
EFFECT OF THERMAL CYCLING RAMP RATES ON SOLDER JOINT FATIGUE LIFE
Company: Lucent Technologies
Date Published: 1/1/2001 Volume: 14-1
The objective of this work is to determine the effect of ramp rate on the failure mechanism and the fatigue life of solder joints. Thermal cycling tests were conducted with chip scale packages (CSPs) using varying ramp rates and dwell times.
For the ramp rate range of 10 degrees C/min to 20 degrees C/min, there was no difference in either the failure location or the failure mode. It can be concluded that, for the BGA/CSP family of packages, all three thermal cycles can be used without impacting the nature of the results. Also, the 20 minute 0 degrees C to 100 degrees C thermal cycles produced essentially identical results to the 30 minute 0 degrees C to 100 degrees C thermal cycles, with a 30% savings in test duration.
Key words: Attachment reliability testing.
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