Journal of SMT Article
IMPACT OF HIGHER MELTING LEAD-FREE SOLDERS ON THE RELIABILITY OF PRINTED WIRING ASSEMBLIES
Company: University of Toronto (CMAP)
Date Published: 10/1/2000 Volume: 13-4
In this paper, we present evidence for an additional reliability concern for lead-free soldered electronic product. Conductive anodic filament (CAF) formation is a failure mode associated with boards, which either operate or are stored in a humid environment. This paper compares the number of CAF formed on boards reflowed at 201 degrees Celsius vs. 241 degrees Celsius after aging under 100V bias at 85 degrees Celsium/85% RH for 28 days. The incidence of CAF under the higher reflow conditions was typically 1-2 orders of magnitude greater than at the lower reflow conditions. The data provide additional reliability concerns for lead-free soldering.
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