Journal of SMT Article
Stencil and Solder Paste Inspection Evaluation for Miniaturized SMT Components
Company: Benchmark Electronics and Shea Engineering Services
Date Published: 4/1/2014 Volume: 27-2
The test also evaluated two methods of automated solder paste inspection to determine the accuracy and repeatability of the different machines and technologies at feature sizes of 10 mil or less. The novel accuracy test printed solder paste on paper labels and weighed the labels, then used the mass of the paste to determine the average volumes of the deposits and compared them to the machine readings.
Additional testing of the aperture surface roughness was also studied too investigate potential correlations between wall roughness and transfer efficiency. Setup, execution and results of all tests are presented and discussed.
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