Journal of SMT Article
Corrosion Study of Lead-Free Solders Exposed to Artificial Sweat
Company: University of Waterloo and BlackBerry
Date Published: 7/31/2013 Volume: 26-3
The intent of this research was to investigate the corrosion behavior and shear strength of various lead free solder alloys after exposure to different artificial sweat solutions. The alloys tested – Sn-3.0Ag-0.5Cu, Sn-0.7Cu-0.05Ni+Ge, Sn-3.5Ag-1.0Cu-3.0Bi and Sn-1.0Ag-0.7Cu-1.6Bi-0.2In – were investigated using three artificial sweat solutions with varying chloride concentrations and acidity. The surface morphology and corrosion product compositions were determined using optical and SEM/EDX analysis. The effect of corrosion on the mechanical properties of these alloys before and after exposure to the sweat was measured using shear strength tests.
Lead-free solder alloys, corrosion, artificial sweat
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