Journal of SMT Article

Collaboration Between OEM and EMS to Combat Head on Pillowing Defects: Part 1 - AXI Capability for HoP Detection

Authors: Alex Chan, Paul Brown, Lars Bruno, Anne-Kathrine Knoph, Thilo Sack, David Geiger, David Mendez, Mulugeta Abtew, Iulia Muntele, and Michael Meilunas
Company: Alcatel-Lucent, Ericsson, Celestica Inc., Flextronics International, Sanmina Corporation, and Universal Instruments Corporation
Date Published: 7/31/2013   Volume: 26-3

Abstract: It is an ongoing battle in the OEM and EMS world to eliminate Head on Pillow (HoP) defects in every day assembly activities. Recent effort in the industry has been primarily focused on defect mitigation, while limited investment has been made to understand the true capability of HoP detection using Automatic X-ray Inspection (AXI). For this reason, the study presented here focused on evaluating the HoP detection capability of four different AXI platforms using assemblies with known HoP defects.


HoP, BGA, AXI, x-ray

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