Journal of SMT Article


Author: Marc Papageorge
Company: ASAT Ltd.
Date Published: 4/1/1999   Volume: 12-2

Abstract: With so many IC packaging options in today’s electronics market, it has become difficult to discern between all the different packaging technologies. Often new packaging technologies are introduced to the market with certain performance levels. These levels are compared via electrical, thermal, reliability, and density. Of course all of these characteristics have a certain cost base value to the customer - chip size package (CSP) types in particular.

It has been reported that CSPs will grow 6x by the year 2000 (as stated in CSP Markets and Applications). In fact, silicon suppliers indicate that the growth of this market is likely to exceed this prediction. It has been pointed out by many market analysts that despite the multitude of existing CSPs, the market will contain four types, known as the following: flexible interposer, rigid interposer, custom leadframe, and wafer scale. Each of these packages has its strengths and weaknesses.

This paper will describe the electrical, thermal, and reliability advantages of the rigid (PCB), flex (tape), and leadframe (copper) type CSPs that are offered in the marketplace (FBGA, TfBGA, LPCC). All are wirebond-type packages that will gain most of the market share over flip chip -type configurations.

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