Journal of SMT Article

The Last Will and Testament of The Lead-Free BGA Void

Authors: David Hillman, David Adams, Tim Pearson, Ross Wilcoxon, Bev Christian, Brandon Smith, and Mario Scalzo
Company: Rockwell Collins, Research In Motion, and Indium Corporation
Date Published: 7/30/2012   Volume: 25-3

Abstract: An investigation was conducted to: (1) determine if a correlation between solder joint void size/location and lead-free solder joint thermal cycle integrity existed for the thermal cycle range of -55°C to +125°C; (2) derive a BGA solder joint void criteria for submission to the IPC JSTD 001 committee. The statistical analysis and the metallographic cross-sectional analysis results revealed that the presence or size of the solder joint voids did not correlate to the loss of solder joint integrity. A proposed set of BGA void process control limits was derived based on the test results and previously published studies.


BGA, Lead-free Solder, Voids, Solder Joint Integrity

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