Journal of SMT Article

Pb-Free Thermal Cycle Acceleration Factors

Authors: Phil Isaacs and Eddie Kobeda
Company: IBM Corporation
Date Published: 4/30/2011   Volume: 24-2

Abstract: Society is demanding tougher legislation to minimize or even eliminate perceived health risks to our environment. Since the European Union began drafting requirements in support of RoHS (Restriction of Hazardous Substances), companies have been scrambling to address the critical transition from eutectic SnPb to Pb-free solder for electronic assemblies. Activities have focused heavily on understanding fundamental material properties and their changes during higher temperature processing. The most important question that must be answered is how these new materials will perform in the equivalent customer environment. This paper will discuss the calculation of acceleration factors for different Pb-free solders, comparing results with those for eutectic SnPb, while also evaluating several approaches and their ability to predict field reliability.

Keywords: 

Pb-free, acceleration factor, thermal cycling, field cycles, failure mode.



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344

Phone 952.920.7682
Fax 952.926.1819
Home
Site Map
Update Your Info
Related Links
Send Us Feedback
Contact Us
Privacy Policy
↑ Top