Journal of SMT Article


Authors: Dr. Benlih Huang, Dr. Hong-Sik Wang, and Dr. Ning-Cheng Lee
Company: Indium Corporation of America
Date Published: 1/31/2008   Volume: 21-1

Abstract: Addition of Al into SAC alloys reduces the number of hard Ag3Sn and Cu6Sn5 IMC particles, and forms larger, softer nonstoichiometric AlAg and AlCu particles. This results in a significant reduction in yield strength, and also causes some moderate increase in creep rate. For high Ag SAC alloys, adding Al 0.1-0.6% to SAC alloys is most effective in softening, and brings the yield strength down to the level of SAC105 and SAC1505, while the creep rate is still maintained at SAC305 level. Addition of Ni results in formation of large (Ni,Cu)3Sn4 IMC particles and loss of Cu6Sn5 particles. This also causes softening of SAC alloys, although to a less extent than that of Al addition. Addition of Al also drives the microstructure to shift from near-ternary SnAgCu eutectic toward combination of eutectic SnAg and eutectic SnCu. Addition of Ni drives shifting toward eutectic SnAg. For SAC+Al+Ni alloys, the pasty range and liquidus temperature are about 4°C less than that of SAC105 or SAC1505 if the addition quantity is less than about 0.6%. Addition of Al and Ni also results in a slight decrease in modulus and elongation at break, although the tensile strength is not affected.

Key Words: solder, lead-free, SAC, soften, compliant, creep resistant, Al, Ni

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