Journal of SMT Article
Lead Free Wave Soldering: Process Optimization for Simple to Highly Complex Boards
Company: Vitronics Soltec, Inc. and others.
Date Published: 4/1/2007 Volume: 20-2
The critical aspects of the lead free wave soldering process can be broken down into several categories which include component reliability, board reliability, flux type and specifications, alloy and alloy composition, its melting behavior, wave equipment capacity and power requirements, profile attributes and flexibility.
This collaborative effort has investigated process parameter and material impact on the soldering process and joint formation. Addressed in this lead free implementation study were inspection criteria, failure definition and measurement, followed by root cause analysis and ultimately optimized process confirmation. This study will also provide insight into the process issues that one will encounter so that a rational implementation strategy for a reliable and robust lead free wave soldering process can be achieved.
Key words: Lead Free, Pb Free, wave soldering, process, solder, alloy, flux.
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