Journal of SMT Article

A STUDY ON MOLDING MATERIAL FOR FLEXIBLE FLIP CHIP CONNECTION

Authors: S. Lu, T-H. Lin, D. McBride, and F. Andros
Company: Binghamton University
Date Published: 7/1/2005   Volume: 18-3

Abstract: Flexible flip chip connection (F2C2), invented for directly attaching silicon chips to circuit carriers without solder bumps, was proposed by Donald G. McBride in his patents 5,807,766 and 5,854,093 [1, 2]. It is a novel approach attempting to create area array flip chip interconnection using matrix block of copper wires embedded by a heat-resistant, dissolvable substance.

Finally, the encapsulating, dissolvable substance is removed from the body of the wafer, leaving the chip attached to the board by only the inter-disposed, flexible wires. This research endeavor addressed the development and selection of the most appropriate molding material to hold the wires stable and finally benefit the assembly processes using the basic mold-attach-dissolve approach.

Key words: flexible flip chip connection, area array, footprint, molding material.



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