• Stencil aperture and solder paste volume.
  • Standoff of BGA solder joint that was required to achieve the targeted reliability based on FEA prediction [1].
  • Reflow profile for large body size daughter module.
  • Rework process for a large body size daughter module.
  • After the process optimization, long term interconnect reliability was also evaluated through extensive thermal cycling (0 - 100C, 3500 cycles). An FEA model was created and validated using the experimental results. Finally, an acceleration calculation was performed based on the experimental results and the field product life conditions. It was concluded that the modules met all manufacturing and reliability requirements for the targeted product application. Key words: module, BGA, daughter card.">

    Journal of SMT Article

    MANUFACTURING OPTIMIZATION AND RELIABILITY OF LARGE SOLDERED DAUGHTER MODULES FOR HIGH PERFORMANCE COMMUNICATION APPLICATIONS

    Authors: R. Scott Priore, S. Camerlo, and Mark V. Brillhart
    Company: Cisco Systems, Inc.
    Date Published: 4/1/2005   Volume: 18-2

    Abstract: A 16 layer high-Tg FR4 build-up technology (1+14+1) daughter card with a size of 2.9" x 3.9", a thickness of .080", and a BGA ball count of 860 was employed for these experiments. The daughter card bill of materials incorporated one daisy chained 40mm FCBGA, eight daisy chained FCBGA memory chips and passives devices. All component placements were on the topside only. The solder balls were 0.35" in diameter using standard Sn/Pb eutectic solder.

    The manufacturability optimization evaluation was performed in the following areas:

  • Stencil aperture and solder paste volume.
  • Standoff of BGA solder joint that was required to achieve the targeted reliability based on FEA prediction [1].
  • Reflow profile for large body size daughter module.
  • Rework process for a large body size daughter module.
  • After the process optimization, long term interconnect reliability was also evaluated through extensive thermal cycling (0 - 100C, 3500 cycles). An FEA model was created and validated using the experimental results. Finally, an acceleration calculation was performed based on the experimental results and the field product life conditions. It was concluded that the modules met all manufacturing and reliability requirements for the targeted product application.

    Key words: module, BGA, daughter card.



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