Journal of SMT Article
MANUFACTURING OPTIMIZATION AND RELIABILITY OF LARGE SOLDERED DAUGHTER MODULES FOR HIGH PERFORMANCE COMMUNICATION APPLICATIONS
Company: Cisco Systems, Inc.
Date Published: 4/1/2005 Volume: 18-2
The manufacturability optimization evaluation was performed in the following areas:
After the process optimization, long term interconnect reliability was also evaluated through extensive thermal cycling (0 - 100C, 3500 cycles). An FEA model was created and validated using the experimental results. Finally, an acceleration calculation was performed based on the experimental results and the field product life conditions. It was concluded that the modules met all manufacturing and reliability requirements for the targeted product application.
Key words: module, BGA, daughter card.
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