Journal of SMT Article
CSP SELF-CENTERING ASSESSMENT USING OFFSET NORMALIZATION METHODOLOGY
Company: Solectron Corporation
Date Published: 7/1/1999 Volume: 12-3
A mathematical model identifying the key process parameters for this experiment was formulated. Two additional DOEs with identified process variables were conducted. A series of experiments was performed on a high precision placement rework machine to emulate the reflow activities during CSP removal and replacement. Finally, the optimized process parameters were used as control variables for self-centering assessment on CSP and PBGA packages. The mathematical formulation and OPNDP were evaluated by multiple regression analysis to show the performance of these approaches. The self-centering effect exhibited in various array packages was studied.
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