Journal of SMT Article
HOT AIR LEAD-FREE REWORK OF BGA PACKAGES & SOCKETS
Company: Intel Corporation
Date Published: 1/1/2005 Volume: 18-1
A hot air rework process for a 478 BGA lead-free socket with two different solder ball compositions (Sn/Ag3.5 and Sn/Ag3.0/Cu0.5) was also developed. The rework temperature range for these packages was from 230-250°C. Detailed inter-metallic compound (IMC) analysis was also conducted on some of these packages. Many packages were put through a series of reliability tests that included temperature cycling, static bake, mechanical shock, and vibration. A generic guideline for lead-free rework profiling was established based on the rework conducted in this study and will be described in this paper. From the results obtained, it was ascertained that lead-free hot air rework can be reliably done on a variety of boards and surface finishes.
Key words: lead-free rework, BGA, solder joints, IMC.
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