Call for Papers

Electronic products, particularly consumer products, have become more complex with greater circuit density and increased functionality. Reliability issues continue to be a major concern for industrial, bio-medical, aerospace and automotive applications and require designers to work closely with materials, manufacturing, test and quality engineers to reduce the likelihood of failure and maximize the probability achieving the design life in the application.

Starting in 2017 the scope of the conference will be broadened to include the physical design aspects relating to electronics component, product and system reliability, involving such topics as thermal and mechanical design, design for manufacturability, test and signal integrity. The Technical Committee has invited several OEMs and well known vendors to present papers, and plans to organize dedicated design sessions and a workshop. We look forward to increased participation by local companies involved in electronics product design and product realization.

Third-generation Pb-free solder alloys are emerging with focus on high reliability applications under harsh environment conditions, such as aerospace and automotive industries, consumer and complex telecommunication applications. One group of alloys is modified with various additions to improve thermal fatigue performance and resistance to damage from high strain rate mechanical loading. Another group of alloys with Ag content lower than SAC305 are being developed to address needs for better drop/shock resistance and lower cost. Solder alloys with lower processing (melting) temperature are being evaluated for both groups to reduce damage to substrates and components.

Assembly process challenges include the use of finer metal powders in solder pastes and novel components and packaging technologies. Use of alloys tailored to the application, wider variety of alloy choices, and smaller passive components are among the challenges being addressed.

The engineers and scientists involved in the design and manufacture of many types of electronics equipment are now also concerned with the RoHS 2 requirements. The compliance dates are July 2014 (already past) for medical devices, monitoring and control instruments; 2016 for in-vitro diagnostic medical devices but not “active implantable medical devices”; 2017 for industrial monitoring and control equipment; and 2019 for electrical and electronic equipment, which were exempt from the original RoHS Directive. And let’s not forget REACH! Materials, process, quality and reliability professionals need to come together to share their knowledge and vision for addressing these challenges.

ICSR has been a very successful conference for over a decade. Showcase your company's expertise by presenting a paper. Organizations that have presented include: BAE, Blackberry (Research in Motion), Celestica, Creation Technologies, DfR Solutions, IBM Corporation, Indium Corporation, Kyzen, Ops A La Carte, Rockwell Collins, Sandia National Lab, and University of Toronto.

Submit an Abstract

Suggested topics to be covered include:

Design, DfX:

  • Design for Excellence (DfM, DfT, DfR, etc.)
  • Mechanical / electrical design integration
  • Thermal management
  • Design verification
  • Design tools, simulation

    Solder alloys:

  • Lead-free assembly processes
  • Lead-free die attach soldering
  • Nano-scale soldering materials & processes
  • New solder paste technologies

    Failure modes:

  • Tin whiskers
  • Electromigration and corrosion
  • Solder embrittlement


  • Conformal and hydrophobic coatings
  • Thermal interface materials
  • Underfills and encapsulants

    Environmental compliance & regulations

    Interconnects & component packaging:

  • Alternative interconnects
  • Nano-interconnects
  • High density interconnects
  • Package-on-package


  • Halogen-free laminates
  • Printed electronics
  • Flex circuits soldering and assembly


  • Harsh environment
  • Wearables
  • Entertainment systems
  • Robots and drones
  • Mechatronics

    Reliability from solder joint to systems level:

  • Temperature cycling, mechanical shock/drop, aging

    If you are interested in presenting, please submit a 200-300 word abstract to Jenny Ng at Include a title, author name and contact information with your abstract. Authors will be notified of acceptance by March 15, 2017.

    Technical papers are required and will be due on May 15, 2017.
    Please make sure you have company approval before submitting an abstract.

    The conference is co-sponsored by the SMTA Toronto Chapter.

    Questions? Please contact:
    Jenny Ng, SMTA Conference and Education Manager
    Phone: 952-920-7682

  • Cancellation Policy: Registration fees will be refunded (less a $75 processing fee) if written notice is postmarked two weeks prior to the event date. Cancellations received within two weeks prior to event date will not be refunded to cover costs incurred.