International Conference on Soldering and Reliability
Bottom Termination Component Design Panel
Moderators: Brook Sandy Smith, Indium Corporation and Matt Kelly, P.Eng, MBA, IBM Corporation
Components with bottom terminations come in a variety of forms and can be found on nearly any electronics assembly. IPC's 7093 committee is reviewing and updating the spec for the "Design and Assembly Process Implementation for Bottom Termination Components" in order to integrate updated industry strategies for designing robust BTC assemblies. A panel of experts is assembled to discuss the latest and greatest research and strategies as well as answer questions from the attendees regarding challenges posed by assembling these components.
About ICSRElectronic products, particularly consumer products, have become more complex with greater circuit density and increased functionality. Reliability issues continue to be a major concern for industrial, bio-medical, aerospace and automotive applications and require designers to work closely with materials, manufacturing, test and quality engineers to reduce the likelihood of failure and maximize the probability achieving the design life in the application.
Starting in 2017 the scope of the conference will be broadened to include the physical design aspects relating to electronics component, product and system reliability, involving such topics as thermal and mechanical design, design for manufacturability, test and signal integrity. The Technical Committee has invited several OEMs and well known vendors to present papers, and plans to organize dedicated design sessions and a workshop. We look forward to increased participation by local companies involved in electronics product design and product realization.
Third-generation Pb-free solder alloys are emerging with focus on high reliability applications under harsh environment conditions, such as aerospace and automotive industries, consumer and complex telecommunication applications. One group of alloys is modified with various additions to improve thermal fatigue performance and resistance to damage from high strain rate mechanical loading. Another group of alloys with Ag content lower than SAC305 are being developed to address needs for better drop/shock resistance and lower cost. Solder alloys with lower processing (melting) temperature are being evaluated for both groups to reduce damage to substrates and components.
Assembly process challenges include the use of finer metal powders in solder pastes and novel components and packaging technologies. Use of alloys tailored to the application, wider variety of alloy choices, and smaller passive components are among the challenges being addressed.
The engineers and scientists involved in the design and manufacture of many types of electronics equipment are now also concerned with the RoHS 2 requirements. The compliance dates are July 2014 (already past) for medical devices, monitoring and control instruments; 2016 for in-vitro diagnostic medical devices but not “active implantable medical devices”; 2017 for industrial monitoring and control equipment; and 2019 for electrical and electronic equipment, which were exempt from the original RoHS Directive. And let’s not forget REACH! Materials, process, quality and reliability professionals need to come together to share their knowledge and vision for addressing these challenges.