Upcoming Expos

Your local electronics assembly and manufacturing trade show!

SMTA Expos

Local Expos and Tech Forums have become one of the great benefits of SMTA's local chapters. Attendees get valuable technical info, meet leading suppliers, and get a FREE lunch. Exhibitors get a great opportunity to connect with people in their region who want to know about their products and services.

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May 22 - 24, 2017 Contamination, Cleaning and Coating Expo
June 7, 2017 Toronto SMTA Expo & Tech Forum
June 8, 2017 Tijuana Expo & Tech Forum
June 15, 2017 Empire Expo & Tech Forum
June 22, 2017 Upper Midwest Expo & Tech Forum
June 27 - 28, 2017 Symposium on Counterfeit Parts and Materials-Tabletop Exhibition
July 13, 2017 Ohio Expo & Tech Forum
August 24, 2017 Capital Expo & Tech Forum
September 19 - 20, 2017 SMTA International Electronics Exhibition
October 10, 2017 Austin (CTEA) Expo & Tech Forum
October 18, 2017 Long Island Expo & Tech Forum
October 18 - 19, 2017 Guadalajara Expo & Tech Forum
October 19, 2017 Intermountain Utah Expo & Tech Forum
October 24 - 25, 2017 International Wafer-Level Packaging Conference Exhibition
November 2, 2017 LA/Orange County Expo & Tech Forum
November 28 - 29, 2017 LED Assembly, Reliability & Testing Exhibition
January 18, 2018 Space Coast Expo & Tech Forum


or download a hard copy form to pay by check!






Contamination, Cleaning and Coating Expo

In conjunction with the Contamination, Cleaning and Coating Conference

May 22 - 24, 2017
Location: Radisson Blu Hotel Amsterdam Airport Schiphol
Amsterdam

Attendees
Online registration is now closed. Please register on site.
Register here to attend the expo only!
Technical conference and workshops not included.

Plan now to join us for free lunch and the chance to network with leading suppliers to our industry!

Conference attendees do NOT need to register for the Expo, your conference registration includes the Expo entrance. Click here to register for the conference.


Current Exhibitor List:

Foresite
Gen3 Systems Limited
Global SMT & Packaging
HumiSeal Europe Ltd
INVENTEC Performance Chemicals
Kester
KYZEN Corporation
Partnertec
ROTEC
Specialty Coating Systems

Companies in bold are SMTA corporate members
Exhibitors
Exhibit Hours:
Monday, May 22: 2:30 p.m. - 6:00 p.m.
Tuesday, May 23: 8:30 a.m. - 5:30 p.m.
Wednesday, May 24: 8:30 a.m. - 3:00 p.m.

For a hard copy of the sponsorship and exhibits form in USD, click here.

For a hard copy of the sponsorship and exhibits form in Pounds Sterling or Euro, click here.

Exhibit space entitles you to:

  • 6 ft. Draped table
  • Two Chairs
  • Electronic attendee list (sent after the conference)
  • Directory Listing
  • Lunch
  • Sponsorship Opportunities:

  • Reception Sponsor - $500
  • Lunch Sponsor - $300
  • Refreshment Break Sponsor - $200
  • Lanyard Sponsor $200/$400








  • Toronto SMTA Expo & Tech Forum

    In conjunction with the International Conference on Soldering & Reliability (ICSR)

    Wednesday, June 7, 2017
    Location: Edward Village Markham
    50 East Valhalla Drive
    Markham, ON L3R 0A3

    Attendees

    Register here to attend the expo only!
    Technical conference and workshops not included.

    Plan now to join us for free technical presentations, free lunch and the chance to network with leading suppliers to our industry!

    ICSR Conference attendees do NOT need to register for the Expo, your conference registration includes the Expo entrance.

    Exhibit Hours:
    Wednesday, June 7, 2017: 10:00am – 3:30pm

    9:00am
    Registration Opens

    10:00am
    Expo Opens

    12:00pm - 1:00pm
    Free Lunch!

    A Special Thank You To Our Lunch Sponsor: Nortec Humidity!





    1:00pm – 2:00pm
    Chuck Bauer Nanotechnology in Electronics Packaging, Interconnect, and Assembly: Hype or Reality?
    Chuck Bauer, Ph.D., TechLead Corporation

    While often exaggerated and over-promised, nanotechnology now provides vital performance enhancements to electronic systems after over a decade of R&D. Advanced solders and adhesives pioneered nanotech adoption by electronics manufacturers by minimizing technical risk and masking their nanotechnology nature via drop-in alternatives. Hype gives way to breakthrough as new nanotech solutions address multiple aspects of packaging, interconnect, and assembly. Leading nanotech contributions today include surface finishes for stencils and tin whisker mitigation, adhesives, die attach and solder replacements, via structures, additive circuit formation and 3D printing, novel conductors and dielectrics, and passive components. The authors examine a broad range of exciting evolutionary as well as revolutionary nano-based technologies for electronics manufacturing, identifying key technical challenges and fascinating practical applications characterizing the potential routes to commercialization. As with most technical developments, evolutionary nano-enabled solutions find quicker adoption thanks to existing standards and infrastructure, but revolutionary nano-alternatives entice early adopters with their potential, albeit at substantial risk, to displace incumbent technologies or even more excitingly to create entirely new markets. Presentations of practical and cost effective applications demonstrate that nanotechnology today indeed represents reality instead of hype.

    2:00pm - 2:30pm
    Alan Rae iNEMI Roadmap 2017 and Research Priorities
    Alan Rae, TPF Enterprises

    The 2017 iNEMI roadmap is now the only comprehensive electronics roadmap left in the Western Hemisphere. This talk outlines some of the findings relevant to the assembly community and the process underway to develop Research Priorities for companies, University and Government laboratories.

    2:30pm - 3:00pm
    Alan Rae Reliable Microelectronic Assembly Process Design Test Methods – A Non-Standard Approach
    Mike Bixenman, DBA, KYZEN Corporation

    Bottom terminated electronic components can fail from contamination trapped under the device. Many devices are designed with large, uninterrupted solder mass and a low standoff height, which close off paths for flux to outgas during reflow. The surface tension effects and wetting properties of the flux within solder paste can underfill the device with active residue that bridges conductive paths. Environmental conditions can mobilize conductive ions that lead to metal migration, and from which ultimately causes intermittent performance and failure. Non-standard test methods have been developed to perform site specific analysis of both contamination trapped under the bottom termination and reliability expectations based on the current assembly process conditions. These test methods allow an OEM to design a reliable assembly process by testing design factors, the selection of soldering materials, characterizing reflow conditions and cleaning processes.

    The purpose of this research paper is to demonstrate the use of these non-standard test methods to design printed circuit board features that allow the flux to outgas during reflow, test both ionic contamination and surface insulation resistance under a site specific component, selection of solder paste, reflow process conditions and optimization of the cleaning process. Data that helps an OEM determine up-front what does not work and the process conditions that do work will provide design conditions for building reliable electronic hardware.

    3:00pm
    Dessert & Coffee Break!

    3:30pm
    Expo Ends


    Current Exhibitor List:

    Adroit Circuit Logix Private Limited
    Alpha Assembly Solutions
    Apex Tool Group - Weller
    Aven Tools, Inc.
    Comtree Inc.
    Conductive Containers, Inc.
    Electronic Coating Technologies
    EPTAC Corporation
    Foresite, Inc.
    Fuji America Corporation
    High Density Package User Group
    ICAPE-USA
    Indium Corporation
    Integrity Testing Laboratory Inc.
    INVENTEC Performance Chemicals USA
    KolverUSA
    KYZEN Corporation
    MicroCare Corporation
    MuAnalysis
    Nikon Metrology, Inc.
    Nortec
    Opti-Tech Scientific Inc.
    Panasonic Factory Solutions
    PUREX INC
    Seica Inc.
    SMT Industrial Supply, Inc.
    StaticStop a division of SelecTech, Inc.
    Trans-Tec America LLC.
    Universal Instruments
    ZESTRON Americas

    Companies in bold are SMTA corporate members
    Exhibitors

    The Toronto Expo & Tech Forum has SOLD OUT! Please contact Emily to be put on a wait list at emily@smta.org or call 952-920-7682. Thank you!
    Exhibit Hours:
    Wednesday, June 7, 2017: 10:00am – 3:30pm

    The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).
    Early Registration Ends May 5th! Rates go up $100!

    For a hard copy of the sponsorship and exhibits form, click here.

    View the floor plan.

    Exhibit space entitles you to:

  • 6 ft. Draped table
  • Two Chairs
  • Attendee list (sent after the conference)
  • Company sign
  • Lunch & Breaks
  • Sponsorship Opportunities:

  • Lanyard Sponsor $400/$800 (Official sponsor for ICSR Conference & Toronto Expo)
  • Bag Sponsor - $400/$800 (Official sponsor for ICSR Conference & Toronto Expo)
  • Lunch Sponsor - $800
  • Refreshment Break Sponsor - $550





  • Tijuana Expo & Tech Forum

    Thursday, June 8, 2017
    Tijuana, BC

    Attendees

    Please see the SMTA Mexico Chapter Page for More Information on Technical Sessions.

    Exhibitors
    Please see the SMTA Mexico Chapter Page for More Information on Expo Materials.






    Empire Expo & Tech Forum

    Thursday, June 15, 2017
    Location: Holiday Inn Syracuse/Liverpool
    441 Electronics Parkway
    Liverpool, NY 13088

    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Free Technical Program & Schedule:
    8:00AM
    Registration opens

    9:00AM
    Expo Opens

    Nortec
    Special Thanks to our Coffee Break Sponsor, Nortec Humidity!


    9:00AM – 10:00AM
    Brook Investigating Test Methods for Electrochemical Consistency in PCB Assembly Processes
    Speaker: Brook Sandy-Smith, Indium Corporation

    There are several industry accepted methods for determining the electrochemical reliability for electronic assemblies. These methods are typically designed to either simulate humid environments in accelerated lifetime testing, or assess the species of ionic residues present on surfaces. Some can be used to test prototypes, or test boards; some are more applicable for quality and consistency testing in a production environment. The increasing complexity of high density assemblies, along with low standoff components, imposes greater associated challenges related to assessing electrochemical reliability. This has led to development and adoption of new methods for testing ionic residues that can lead to electrochemical migration. This paper will review traditional and emerging methods to characterize flux residues and cleanliness of finished assemblies, including surface insulation resistance, electrochemical migration, ROSE extraction and other emerging test methods. Data will be shared showing how different methods can detect process variations in different ways, and compare the results.

    11:00AM – 12:00PM
    Carboni Cleanliness Process Design Considerations
    Speaker: Debbie Carboni, KYZEN Corporation

    Cleanliness is a product of design, including component density, standoff, height and design for flow. As space and weight continue to be reduced, size, pitch between conductors and standoff height reduce. Smaller components are more susceptible to contamination effects due to low standoff gaps. Residues trapped under the body of the component can still be active due to poor outgassing channels as well the potential to shield the soldering area from receiving flux heat in reflow, which creates pools of activated flux residue. Residues can be mobilized with moisture, create leakage currents, bridge power and ground, or act as seed points for dendrite growth or corrosion events. Residues on printed circuit boards are directly related to the reliability of the final product. How Clean is Clean enough requires test methods to determine the activity of residues trapped under the bottom termination. Site specific test methods can be an effective tool to help the assembler determine how clean is clean enough. These test methods allow the assembler to design a reliable assembly process by testing design factors, the selection of soldering materials, characterizing reflow conditions and cleaning processes.

    12:00PM
    Complimentary Lunch

    1:30PM – 2:30PM
    Northrup Chemical Data vs. Electrical Data is One A Better Reliability Predictor?
    Speaker: Mark Northrup, IEC Electronics

    The goal of this study was to correlate IPC Chemical and Electrical CAF test results. The electrical testing utilized for the test coupons was found within the PCQR2 Database document. The chemical testing of the coupons utilized Ion Chromatography (IC) testing in accordance with IPC-TM- 650, method 2.3.28.

    3:00PM
    Expo Closes


    Current Exhibitor List:

    Advance Circuit Technology
    Ansen Corporation
    Apex Tool Group - Weller
    Ascentech LLC- GEN3/Optilia
    Aven Tools, Inc.
    Avid Associates
    Cirexx International
    Compunetics, Inc.
    ELANTAS PDG, Inc.
    Electronic Coating Technologies
    Electronic Interconnect
    ElectroTech Sales
    Electrotek Corporation
    EPTAC Corporation
    ERSA North America
    Excelta Corporation/Xuron
    Hisco, Inc.
    ICAPE Group
    Indium Corporation
    InsulFab PCB Tooling
    JBC TOOLS
    Koki Solder America
    Komax Corporation/Chemtronics
    MicroCare Corporation
    Midwest PCB
    Nortec Humidity
    North Country PTAC
    PACE Worldwide
    Panasonic Factory Solutions
    Performance Technologies Group
    Photo Etch Technology
    Ralph W. Earl Company
    Restronics - Upstate NY
    SCJ Associates, Inc.
    Seika Machinery, Inc.
    Smart Splice LLC
    Steinel America, Inc./Jensen Global, Inc.
    Teradyne, Inc.
    W. J. Murphy Associates, Inc.

    Companies in bold are SMTA corporate members
    Exhibitors
    The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $30 per outlet. Early bird pricing ends on May 19, 2017!

    Click here for Ad and Sponsorship opportunities!

    Important Exhibitor Materials:

  • Hard Copy of Exhibitor Application

  • Exhibitor Details

  • Please contact SMTA Expo Manager Kaitlyn Gherity with questions or for additional information.






    Upper Midwest Expo & Tech Forum

    Thursday, June 22, 2017
    Location: DoubleTree by Hilton Minneapolis - Park Place
    Park Ballroom
    1500 Park Place Blvd.
    Minneapolis, MN 55416

    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Exhibit Hours:
    Thursday, June 22nd, 2017
    9:00AM–3:00PM

    Registration Opens at 8:00AM

    Free Technical Program & Schedule:
    8:00AM
    Registration opens

    aligned
    Special Thanks to our Coffee Sponsor, Solid Design Solutions!



    9:00AM
    Expo Opens

    9:00AM – 10:00AM
    Tim ONeill Benefits and Implications of Finer Mesh Solder Powder
    Speaker: Tim O'Neill, AIM Solder
    The trend for smaller devices with more functionality is accelerating as evidenced by the proliferation of wearables. From the Apple Watch™ to body cameras for law enforcement, the demands and opportunities are only limited by our imagination. The capability of existing PCB assembly technology needs to advance rapidly to meet the mission profile of these new devices. For the solder paste manufacturer, this path inevitably leads to incorporating finer metal powder into solder paste to facilitate ultra-fine pitch printing. In this study, we will evaluate the benefits and implications of finer mesh solder powder on various aspects of solder paste performance.

    Type IV, V, VI SAC305 solder powder will be tested and their performance on several key areas will be studied. Some of the studied variables will be print transfer efficiency, print life, wetting, coalescence and process stability. The goal of the study will be to measure the benefits derived from smaller particle size and quantify the negative implications. With this information, the assembler will know how to apply their resources to ensure the most robust process while achieving their desired outcome.

    11:00AM-12:00PM
    Real Life Recommendation Engine
    Speaker: Patrick Delaney, Lab651

    Now as we stand at the precipice of a new movement - one governed by smaller devices, newer and revolutionary sensors, gateways and connected devices of all sorts, we are faced with a completely new level of value proposition: how can we build Netflix-like or Amazon-like systems which recommend experiences in the physical world? Can we bridge the gap between, "web-based recommendation systems" which tell you what kinds of movies and products you might like, and physical, real-world experiences, involving physical movement, and increasingly intricate geophysical spaces? An interesting answer to this question will be presented at this talk - given the example of a home-built RFID-based tracking algorithm used to help improve and change how anything from conferences, concerts, state fairs, cruise ships and any type of, "mass gathering" performed around the world.

    For the past 20 or so years, the world of the web has been driven by algorithms and recommendation systems. The original value proposition, back in the 1990s, when someone jumped on a Personal Computer to, "surf the web," was that all sorts of preferences and customization could be gleaned from loyal user behavior in order to improve services over time. As the years went on and as laptops, mobile phones and tablets emerged, this value proposition became stronger and stronger - to the point where the vast majority of people are now just waking up to realize that there is a certain magic, but also perhaps a slightly frightening uncertainty, to having one's preferences and behavior stored, filtered and re-serviced, ostensibly for our benefit, by third parties.

    12:00PM
    COMPLIMENTARY LUNCH

    Nortec
    Special Thanks to our Lunch Sponsor, Nortec Humidity!


    1:30PM – 2:30PM
    Cardoso 2D, 2.5D, and 3D X-Ray Inspection – What’s a “D”?
    Speaker: Bill Cardoso, Ph.D, Creative Electron
    The use of x-ray inspection in the electronics industry has gained wide adoption in the past 20 years, driven mainly by the development and use of bottom terminated components (BTC). The use of ball grid arrays (BGA), for example, allowed the development of standards and guidelines that dictate the maximum void size in each ball. In consequence, x-ray machine manufacturers developed solutions that address these requirements to became an integral part of the quality assurance function of modern electronic manufacturers.

    However, as new x-ray technologies are introduced – from new algorithms to new hardware – users are faced with a growing range of options to choose from. Users need a solid technical background to understand these options to make an educated decision when acquiring x-ray inspection capabilities. Unfortunately, x-ray companies are not always clear about the pros and cons of each option. As a result, users end up buying too much or too little capabilities. In either situation, the user is left without the right x-ray inspection solution.

    The goal of this presentation is to give the audience the tools needed to avoid making mistakes when acquiring x-ray inspection capabilities. We will set the record straight and clearly define critical concepts in x-ray inspection. The different x-ray modalities, 2D, 2.5D, and 3D x-ray inspection will be explained in details at the user level – no math involved. Most importantly, this presentation will cover when each modality must be utilized for a successful quality assurance program. A rich set of images and videos will be used to illustrate the advantages and disadvantages of each x-ray inspection modality.

    3:00PM
    Expo Closes


    Current Exhibitor List:

    AIM
    Aligned Solutions Inc.
    Alpha Assembly Solutions
    Amitron Corp
    Analog Technologies, Corp.
    Apex Tool Group - Weller
    Ascentec Engineering
    ASM Assembly Systems, LLC
    Aven Tools, Inc.
    Batten & Allen International
    BEST Inc.
    Conductive Containers, Inc.
    Coridian Technologies
    Dimation, Inc.
    E-tronix
    Electronic Systems, Inc.
    Ellsworth Adhesives
    ERSA North America
    Fuji America Corporation
    Garland Service Company (GSC)
    Henkel Electronics
    HISCO, Inc.
    ICAPE-USA
    Indium Corporation
    KeyTronicEMS
    KIC
    Koki Solder America/Tagarno USA
    KYZEN Corporation
    Logic PD
    LPKF Laser & Electronics
    MET Stencil
    Metcal
    MTE Solutions
    Nikon Metrology, Inc.
    Nortec Humidity
    Omni-Tronics, Inc.
    PACE Worldwide
    Panasonic Factory Solutions
    Rehm Thermal Systems LLC
    Restronics
    Safari Circuits, Inc.
    Seika Machinery, Inc.
    Solid Design Solutions
    StenTech
    TEK Products, Inc.
    Tonka Electronics, Inc
    TRANS TEC AMERICA/YAMAHA
    Transforming Technologies
    TTM Technologies
    Universal Instruments
    Vi Technology Inc.
    ZESTRON Americas

    Companies in bold are SMTA corporate members
    Exhibitors
    The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on May 26th, 2017!

    Click here for Ad and Sponsorship opportunities!

    Important Exhibitor Materials:

  • Exhibitor Details

  • Please contact SMTA Expo Manager Kaitlyn Gherity with questions or for additional information.






    Symposium on Counterfeit Parts and Materials-Tabletop Exhibition

    June 27 - 28, 2017
    Location: College Park Marriott Hotel and Conference Center
    3501 University Blvd East
    Hyattsville, MD 20783

    Attendees

    Exhibit Attendee:

    Conference attendees do NOT need to register for the Expo, your conference registration includes the Expo entrance.

    Come and visit the exhibits for FREE. Plan to network with leading suppliers in the counterfeit industry. We will provide you with FREE refreshments.

    Exhibits:
    June 27: 9:45am – 2:45pm
    June 28: 10:00am - 3:00pm


    Current Exhibitor List:

    4 Star Electronics  #10
    American Electronic Resource, Inc.
    Applied DNA Sciences  #1
    Creative Electron  #7
    ERAI, Inc.  #8
    HMB Electronics  #12
    Mentor, A Siemens Business  #9
    Nokomis Inc.  #6
    North Shore Components, Inc.  #5
    SMT Corporation  #2
    XTREME Semiconductor  #11

    Companies in bold are SMTA corporate members
    Exhibitors

    Sponsorship Opportunities:

    **All Sponsorships require an exhibit booth reservation**

    Lanyard Sponsor (Limit 1) -$400 (if provided by company/$800 if provided by SMTA) -SOLD
    Provide 150 lanyards and they will be the official lanyard for the conference. If you would like us to provide the lanyards, it will be an extra $400. You will receive logo recognition in the show directory, conference website and signage.

    Tote Bag Sponsorship (Limit 1)-$400 (if provided by company/$800 if provided by SMTA) -SOLD
    Provide your logo on all of the conference attendee bags! If you would like SMTA to provide the tote bags, it will be an extra $400. There will also be recognition in the show directory and website.

    Lunch Sponsorship Day 1 or Day 2 (Limit 2)-$500
    Signage upon entrance to exhibit hall lunch and on table tents featured throughout the room. There will also be recognition in the show directory and conference website.

    Refreshment Sponsorship Day 1 or Day 2 (Limit 2)-$350
    Signage during PM refreshment breaks upon entrance to exhibit hall and on table tents featured throughout the room. There will also be recognition in the show directory and conference website.

    Exhibitor Information:

    Contact Jenny Ng for available booth space. 952-920-7682 or jenny@smta.org

    Please note that exhibit traffic will be minimal while symposium is in session.


    Click here to view floor plan.

    Exhibit space entitles you to:

  • 6 ft. Draped table
  • One conference pass
  • Attendee list
  • Breakfast, Lunch & Breaks
  • One copy of the conference proceedings
  • Download a hard copy of the registration form

    Cost to exhibit:
    Rates increase $100 after May 31, 2017

    Booth type CALCE/SMTA Members Non-Members
    One table
    includes access to Electrical Outlet
    $550 $650
    One table
    no access to Electrical Outlet
    $500 $600







    Ohio Expo & Tech Forum

    Thursday, July 13, 2017
    Location: Embassy Suites Cleveland Rockside
    5800 Rockside Woods Boulevard
    Independence (Cleveland), OH 44131

    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Exhibit Hours:
    Thursday, July 13, 2017
    10:00AM–3:00PM


    8:00 AM
    Registration opens

    A Special Thank You To Our Breakfast Sponsor:





    A Special Thank You To Our Coffee Sponsor:





    9:15 AM

    Vance Modeling an SMT Line to Improve Throughput
    Greg Vance, Sr. Project Engineer, Rockwell Automation

    One of the major challenges for an electronic assembly manufacturing engineer is determining how a SMT machine will impact throughput. Typically an SMT equipment supplier will ask for few (5-10) products to simulate the throughput capability of their machine. Unfortunately, if the engineer works in a high mix low volume environment he may need to know the impact of a new machine on a 1,000 or more products. Currently there are a lack of simulation tools to model this. This is confirmed in the IPC Technology Roadmap for Electronics Interconnections 2015 it states “In order to better deal with the demands for increased interconnection density and respond to market demands for better return on capital investment in assembly equipment, there is a need within the manufacturing industry for continued improvement in tools and software for modeling and simulation. Needs in this area include better methods of load balancing and improved machine utilization? The tools for determining the balance on assembly lines will need to be flexible to handle the mix of assembly types that manufacturers now face.”

    Rockwell Automation partnered with Universal Instruments to develop a tool to model a large quantity of products and the impact of SMT line configurations. The information used for the modeling includes placement per panel information and machine components placed per hour capability. With these tools an electronic assembly plant can be modeled and analyzed to identify improvement opportunities and perform “what if” analysis to model impact of machine changes.

    10:00 AM
    Expo Opens

    12:00 PM–1:00 PM
    Free Hot Lunch!

    A Special Thank You To Our Lunch Sponsor:






    1:45 PM

    Shea Advances in Stencil Technology for Achieving Successful Printing Results
    Chrys Shea, Shea Engineering Services

    Fresh from the SMTA International Conference, Chrys is bringing the latest research and development in stencil printing to address important questions from the users’ perspective:
    • How does nanocoating help the print process? Is it worth the cost?
    • Will high tension stencils improve print quality?
    • When should Type 5 solder paste be considered for fine feature printing?
    • What’s the difference between wet wiping and dry wiping?
    • Do wiper parameters, papers, solvents and sequences make a big difference?
    • What are the new methods of making stepped stencils?
    • What is the role of wall roughness in the print process?

    Come to this presentation to:
    • REVIEW the data
    • SEE the photos
    • WATCH the videos
    • LISTEN for tips and tricks that will help your process

    If you couldn’t get to the SMTA International conference, the latest published research is coming to you!
    Highlights of technical studies published by AIM, KYZEN, Shea Engineering Services, MET, FCT, and a 4-company New England consortium will be included in the presentation.


    3:00PM
    Expo Closes


    Current Exhibitor List:

    AIM
    Alpha Assembly Solutions
    American Standard Circuits, Inc.
    Apex Tool Group - Weller
    Ascentec Engineering
    Ascentech LLC- GEN3/Optilia
    ASM Assembly Systems, LLC
    Aven Tools, Inc.
    Compunetics, Inc.
    Conductive Containers, Inc.
    Creative Electron, Inc.
    Digitaltest, Inc.
    ECD
    Electrolube
    Electronic Assembly Products, Ltd.
    EPTAC Corporation
    FCT Assembly
    Foresite, Inc.
    Garland Service Company (GSC)
    Horizon Sales
    ICAPE-USA
    Indium Corporation
    Industrial Electronics Services, Inc
    INVENTEC Performance Chemicals USA
    KIC
    Koki Solder America/Tagarno USA
    KYZEN Corporation
    Libra Industries
    M.E.O. Ltd.
    MET Stencil
    MicroScreen
    Murray Percival Co
    Nikon Metrology, Inc.
    Omron Inspection Systems
    PACE Worldwide
    Panasonic Factory Solutions
    PFC Flexible Circuits Limited
    Professional Sales Inc
    PUREX INC
    RBB Systems, Inc.
    Rehm Thermal Systems LLC
    Safari Circuits, Inc.
    Seica Inc.
    Smart Splice LLC
    SMT Capital, LLC
    SmtXtra USA Inc
    Specialty Coating Systems
    StenTech
    Teradyne, Inc.
    Tharium Corporation
    The W.E.W. Co., Inc.
    Tin Technology and Refining
    Trans-Tec Yamaha
    Tronex Tools/Saki Corp.
    Universal Instruments Corporation
    Vi TECHNOLOGY

    Companies in bold are SMTA corporate members
    Exhibitors
    The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).

    The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early registration pricing ends on June 16th, 2017!

    Click here for Ad and Sponsorship opportunities!

    Important Exhibitor Materials:

  • Exhibitor Details

  • Hard Copy of Exhibitor Reg Form

  • Please contact SMTA Expo Manager Emily Stuckmayer with questions or for additional information.






    Capital Expo & Tech Forum

    Thursday, August 24, 2017
    Location: Johns Hopkins University/Applied Physics Lab
    Kossiakoff Center
    11100 Johns Hopkins Road
    Laurel, MD 20723

    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Exhibit Hours:
    Thursday, August 24th, 2016
    9:00AM–3:00PM

    Registration Opens at 8:00AM

    Free Technical Program & Schedule:
    Coming Soon!


    Current Exhibitor List:

    Apex Tool Group - Weller
    Ascentech LLC- GEN3/Optilia
    Aven Tools, Inc.
    Conductive Containers, Inc.
    Hopewell Companies
    Indium Corporation
    Insulfab PCB Tooling
    KYZEN Corporation
    Nikon Metrology, Inc.
    Nordson DAGE
    NTS
    PACE Worldwide
    Seica Inc.
    Smart Splice LLC
    Stellar Technical Products
    TAGARNO USA/ Nordson SELECT
    Vi TECHNOLOGY
    ZESTRON Americas

    Companies in bold are SMTA corporate members
    Exhibitors
    The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).

    The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early Bird pricing ends Friday, July 28th, 2017!


    Important Exhibitor Materials:

  • Hard Copy of Exhibitor Reg Form

  • Please contact SMTA Expo Manager Kaitlyn Gherity with questions or for additional information.






    SMTA International Electronics Exhibition

    September 19 - 20, 2017
    Location: Donald E. Stephens Convention Center
    Rosemont, IL

    Exhibitors
    Exhibitors Register Now
    SMTA International delivers value to you and your organization through our goal to bring our members and visitors together to focus, exchange ideas and share the newest technologies. Last year we welcomed over 1600 attendees from 21 different countries.






    Austin (CTEA) Expo & Tech Forum

    Tuesday, October 10, 2017
    Location: Norris Conference Center
    2525 West Anderson Lane
    #365
    Austin, TX 78757

    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

  • Norris Conference Center Location

  • Free Technical Program & Schedule:

    Exhibit Hours:
    Tuesday, October 10th, 2017
    10:00AM–3:00PM


    TECHNICAL PROGRAM COMING SOON!





    Special Thanks to Our Lunch Sponsor: NPI Technologies


    Current Exhibitor List:

    Alpha Assembly Solutions
    BBM, Inc.
    Conductive Containers, Inc.
    Creative Electron, Inc.
    Electronic Systems, Inc.
    Fuji America Corporation
    KYZEN Corporation
    Nikon Metrology, Inc.
    Nordson DAGE
    NPI Technologies, Inc.
    PACE Worldwide
    Panasonic Factory Solutions
    SMAC MCA
    Southwest Sytems
    Specialty Coating Systems
    Teradyne, Inc.
    Tharium Corporation
    Vi Technology

    Companies in bold are SMTA corporate members
    Exhibitors
    The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on September 15th, 2017!

    Click here for Ad and Sponsorship opportunities!

    Important Exhibitor Materials:

  • Hard Copy of Exhibitor Reg Form
  • Norris Conference Center Location

  • Please contact SMTA Expo Manager Emily Stuckmayer with questions or for additional information.






    Long Island Expo & Tech Forum

    Wednesday, October 18, 2017
    Location: Melville Marriott Long Island
    1350 Walt Whitman Road
    Melville, NY 11747

    Attendees

    Please see the Long Island Chapter Page for More Information on Technical Sessions and Expo Materials.


    Exhibitors
    Please contact Sharon Dietrich with questions or for additional information.






    Guadalajara Expo & Tech Forum

    October 18 - 19, 2017
    Location: Hotel Riu Guadalajara
    Guadalajara

    Attendees

    Please see the Guadalajara Chapter Page for More Information on Technical Sessions.

    Here is a recap of the 2015 event:

    Exhibitors
    Please see the Guadalajara Chapter Page for More Information on Expo Materials.






    Intermountain Utah Expo & Tech Forum

    Thursday, October 19, 2017
    Location: University of Utah
    A. Ray Olpin University Union - Saltair Room
    200 S Central Campus Drive
    Salt Lake City, UT 84112

    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Exhibit Hours:
    Thursday, October 19, 2017
    10:00AM–3:00PM

    Free Technical Program & Schedule:
    COMING SOON!


    Current Exhibitor List:

    Conductive Containers, Inc.
    Digitaltest, Inc.
    Indium Corporation
    KYZEN Corporation
    Nikon Metrology, Inc.

    Companies in bold are SMTA corporate members
    Exhibitors
    The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on September 22nd, 2017!

    Important Exhibitor Materials:

    Please contact SMTA Expo Manager Kaitlyn Gherity with questions or for additional information.






    International Wafer-Level Packaging Conference Exhibition

    October 24 - 25, 2017
    Location: Double Tree Hotel
    2050 Gateway Place
    San Jose, CA 95110

    Attendees

    Note - If you already registered for the IWLPC conference you do not need to register separately to attend the expo.


    Current Exhibitor List:

    AEMtec GmbH  #50
    AI Technology, Inc.  #38
    Akrometrix, LLC  #24
    AMICRA Microtechnologies GmbH  #11
    Amkor Technology  #33
    ATV Technologie GmbH  #15
    Axus Technology  #29
    Cadence Design Systems, Inc.  #30
    Camtek USA Inc  #14
    Chip Scale Review  #59
    Deca Technologies  #4
    EMD Performance Materials Corp.  #32
    EV Group  #36
    EVATEC AG  #28
    Filmetrics, Inc.  #40
    FRT of America  #2
    Henkel Electronic Materials  #44
    Hitachi Chemical Co., Ltd.  #16
    IMAT, Inc.  #31
    Indium Corporation  #39
    Ivenesas  #34
    JH Technologies  #55
    Johnstech International  #22
    KYEC USA
    Lam Research Corporation
    LB Semicon  #27
    Lintec of America, Inc.  #5
    Nanotronics  #42
    nepes Corporation  #23
    NEUTRONIX  #6
    NHK Spring Co.  #19
    Nikon Metrology  #18
    Nordson DAGE  #1
    Pac Tech USA  #25
    Plasma-Therm, LLC  #46
    PURE TECHNOLOGIES  #17
    Quantum Analytics  #21
    Samtec, Inc.  #43
    SETNA  #68
    Shenmao Technology Inc.  #12
    SMTA  #58
    Sonoscan, Inc.  #51
    SPTS Technologies  #35
    SSP Inc.  #47
    STATS ChipPAC Ltd.  #20
    SUSS MicroTec Inc.  #13
    TAIYO INK MFG.CO., LTD  #45
    TechSearch International Inc.  #3
    Toray International America Inc.  #26
    Unisem  #37
    UnitySC  #10
    Yield Engineering Systems, Inc.  #7
    Yole Développement  #8
    YXLON FeinFocus  #54
    ZEISS Microscopy  #41

    Companies in bold are SMTA corporate members
    Exhibitors

    Sponsorship and Exhibitor Information



    View all sponsorship and exhibition opportunities.

    IWLPC Expo 2017 Application

    Dates: October 24-25, 2017
    Location: DoubleTree by Hilton Hotel, San Jose, CA


    Exhibits Move-In
    Monday, October 23 from 12:00pm-5:00pm

    Expo Hours
    Tuesday, October 24 from 10:00am-5:00pm | Reception 5:30pm-7:00pm
    Wednesday, October 25 from 9:30am-3:30pm

    Exhibits Move-Out
    Wednesday, October 25 from 3:30pm-7:30pm

    Why Exhibit at IWLPC?

    * Reach a focused international audience
    * Generate Exposure in this highly competitive marketplace
    * Share New Products and concepts to the market
    * Enhance Relationships with existing customers and generate new leads

    What type of attendees will be there?

    Assembly/Packaging Engineers, Corporate/General Management, Test Engineering, Engineering Management, IC Design Engineer, Manufacturing Management, PC Board Design/Fabrication, Purchasing, R&D, Sales/Marketing, Consultant, and many more!

    What's Included?

  • Two Choices:
    8'x10' Pipe & Drape inside exhibit hall (a table & two chairs are provided)
    OR
    6ft table-top outside exhibit hall/foyer (NO pipe & drape, ONLY a table and two chairs)

    Click here to view the floor plan!








  • LA/Orange County Expo & Tech Forum

    Thursday, November 2, 2017
    Location: The Grand Event Center
    4101 E Willow Street
    Long Beach, CA 90815

    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Exhibit Hours:
    Thursday, November 2, 2017
    10:00AM–3:00PM


    9:00AM
    Registration opens

    10:00AM
    Expo Opens

    11:00AM–11:30AM
    Thermal imaging for R&D and PCB inspections
    Tony Shockey, Applications Development Manager, Fluke Corporation

    "Our world in infrared, what it appears to be and where it can be used." This presentation will cover applications, tips, and tricks to help use thermal imaging technology most effectively for PCBA inspection and trouble shooting.

    11:45AM–12:45PM
    Complimentary lunch!


    1:00PM–1:30PM
    Unforgiving Environments - Proper Handling & Storage Controls Go a Long Way Toward Print Quality
    Timothy O'Neill, Technical Marketing Manager, AIM Solder

    Solder paste is the foundation of SMT assembly process and the importance of consistent paste performance cannot be overstated. This presentation explains the basics of how a solder paste formula is developed and manufactured and how the end user can optimize handling and usage to maximize performance, reduce defects and minimize waste.

    2:00PM–2:30PM
    Effective Cleaning Approaches for Southern California Electronics Assemblers
    Barbara & Edward Kanegsberg, BFK Solutions

    The best way to clean electronics assemblies depends on the flux, the design of the assembly, and on your customer requirements. Not cleaning or cleaning with water alone is not always the right approach. Cleaning process options have changed over the past few months; there are new cleaning agents and new cleaning equipment. We will tell you about the advantages and problems of new and familiar cleaning agents. We’ll get you up to speed on cleaning agents that are allowed or even encouraged by regulators and on some cleaners that may be banned, locally and at the National level. We will also answer your questions about cleaning process effectiveness, regulatory requirements, and process costs.

    2:30PM
    Raffle on Show Floor!


    3:00PM
    Expo Closes


    Current Exhibitor List:

    Alpha Assembly Solutions
    Ascentec Engineering
    Aven Tools, Inc.
    Conductive Containers, Inc.
    Creative Electron, Inc.
    Digitaltest, Inc.
    EPTAC Corporation
    FlackTek, Inc.
    INVENTEC Performance Chemicals USA
    JH Technologies
    KYZEN Corporation
    Nikon Metrology, Inc.
    PA&LS
    PACE Worldwide
    Panasonic Factory Solutions
    Smart Splice LLC
    TAC Water and Misting Systems
    Teradyne, Inc.
    Tharium Corporation
    Vi Technology Inc

    Companies in bold are SMTA corporate members
    Exhibitors
    The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).

    The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on October 6th, 2017!

    Click here for Ad and Sponsorship opportunities!

    Important Exhibitor Materials:

  • Exhibitor Details

  • Hard Copy of Exhibitor Reg Form

  • Please contact SMTA Expo Manager Emily Stuckmayer with questions or for additional information.






    LED Assembly, Reliability & Testing Exhibition
    Note - If you already registered for the symposium you do not need to register separately for the expo

    November 28 - 29, 2017
    Location: Archie K. Davis Conference Center
    12 Davis Drive
    Research Triangle Park, NC 27709

    Attendees

    Exhibit Attendee:

    Conference attendees do NOT need to register for the Expo, your conference registration includes the Expo entrance.

    Come and visit the exhibits for FREE. Plan to network with leading suppliers in the LED component industry. We will provide you with FREE refreshments.

    Exhibit Hours:
    November 28: 9:30am-4:00pm
    November 29: 9:30am–3:30pm

    Exhibitors

    Exhibitor Information:

    At the LED A.R.T. Symposium and Exhibition you will network with Assembly/Packaging Engineers, Corporate/General Management, Test Engineers, Designers, Buyers, R&D Engineers, and more.

    Download the brochure for details.

    Cost to exhibit:

    Booth type CALCE/SMTA Members Non-Members
    One table
    includes access to Electrical Outlet
    $750 $850
    One table
    no access to Electrical Outlet
    $700 $800


    Sponsorship Opportunities:

    Lanyard Sponsor: $400/$800

  • Provide 150 Lanyards and they will be the official lanyard for the conference(If you would like us to make the lanyards it will be an extra $400)
  • Logo recognition and link to company on website and all marketing event materials
  • Logo recognition in Show Directory
  • On-site signage (posted throughout conference/expo area)

    Bag Sponsor: $400/$800
  • Provide 150 Bags and they will be the official bags of the conference. (If you would like us to make the bags it will be an extra $400)
  • Logo recognition and link to company on website and all marketing event materials
  • Logo recognition in Show Directory
  • Logo on all marketing event materials
  • On-site signage (posted throughout conference/expo area)

    Lunch Sponsors: $800
  • Logo recognition in Show Directory
  • Logo recognition and link to company Web site
  • On-site signage (posted throughout conference/expo area)

    Refreshment Break Sponsorships: $550
  • On-site signage (posted near coffee breaks)
  • Recognition in Show Directory

  • Venue Address:
    Archie K. Davis Conference Center
    12 Davis Drive
    Research Triangle Park, NC 27709 USA

    Table space includes:

  • 6 Foot Draped table
  • Two chairs
  • One Conference Pass
  • Electronic attendee list (sent approximately a week after the conference)
  • Directory listing
  • Lunch


  • Details:

  • You may use your table to display literature, products small pieces of equipment, table top display signs, etc.; we request that any table top items do not exceed two feet.

  • If you wish you can display a banner or some other appropriate type of sign on the front or top of the table.

  • As space is limited we are trying to minimize the space each table takes. If you have a pop-up or other items, please let us know and we'll try to accommodate you.

    SETUP and TEAR DOWN

    Tuesday, November 28
    7:30am-9:30am
    Archie Davis Conference Center

    Boxes will be delivered to Archie Davis Conference Center.

    Show Hours:

    November 28: 9:30am-4:00pm
    November 29: 10:00am–3:30pm

    Dismantle:

    By end of Conference

    SHIPPING INFORMATION

    Please address all packages as follows: LED Symposium/Your Company Name
    Attn: Jenny Ng, SMTA
    Archie Davis Conference Center
    12 Davis Drive
    RTP, NC 27709, USA

    • Make sure your company name is visible
    • Due to limited space, please ship packages to arrive no earlier than two days prior to the event.
    • Exhibitors will be responsible for packing, labeling and shipping all outgoing materials. Please bring your own packing slips to ship your materials back.

    DIRECTIONS

    For questions, please contact
    Jenny Ng
    Conference and Education Manager
    952.920.7682
    Jenny@smta.org






  • Space Coast Expo & Tech Forum

    Thursday, January 18, 2018
    Location: Melbourne Auditorium
    625 East Hibiscus Blvd
    Melbourne, FL

    Attendees

    Exhibit Hours:
    Thursday, January 18, 2018 Expo: 10:00AM–4:00PM

    Technical Sessions: 9:00AM-4:00PM
    Registration: Opens at 8:00AM

    Free Technical Program & Schedule:

    Exhibitors
    The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).
    The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list.Electricity is an additional $25 per outlet. Early bird pricing ends on December 15th, 2017!

    Important Exhibitor Materials:

  • Hard Copy of Exhibitor Application

  • Please contact SMTA Expo Manager Kaitlyn Gherity or with questions or for additional information.

    Cancellation Policy: All exhibit fees are non-refundable. Payment can be deferred to another expo within the same year, if notification is received more than two weeks prior to the original exhibition date, after which no payment allocation will be made.

    SMTA Headquarters
    6600 City West Parkway, Suite 300
    Eden Prairie, MN 55344

    Phone 952.920.7682
    Fax 952.926.1819
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