Capital Chapter Webinar: Defect Detection for Advanced Wafer and Package Devices
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Capital Chapter Webinar: Defect Detection for Advanced Wafer and Package Devices

The SMTA Capital Chapter is excited to host a FREE webinar Friday, September 18th on “Defect Detection for Advanced Wafer and Package level devices using Scanning Acoustic Microscopy.” The webinar will be given by James C.P. McKeon, Ph.D, Director of Technology at Sonix, Inc.

9/18/2020
When: Friday, September 18th
1:00 PM until 2:00 PM EST
Where: Virtual Meeting
United States
Presenter: James C.P. McKeon, Ph.D
Contact: Jessica Molloy
703-393-9880


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Cracking, delamination, and voiding… OH MY!! If you deal with packages or wafers then chances are you’re familiar with ultrasonic inspection, and if not – you should be!

The SMTA Capital Chapter is excited to host a FREE webinar Friday, September 18th on “Defect Detection for Advanced Wafer and Package level devices using Scanning Acoustic Microscopy.” The webinar will be given by James C.P. McKeon, Ph.D, Director of Technology at Sonix, Inc. James has 27 years’ experience with ultrasonic inspections and holds his Ph.D. in Applied Science with a concentration in Nondestructive Evaluation (NDE) with a focus on ultrasonic NDE and ten US patents. 

The benefit of ultrasonic inspection is that the interior of samples can be inspected nondestructively. So, there is no need to destroy a part inspecting it only to find out that it was a good part. Thus, aircraft can be inspected in-the-field without having to take them apart, patients can be examined without the need for surgery, and microelectronic devices can be inspected without the need for cross-sectioning or other destructive testing. Due to the small feature sizes in microelectronic samples, a specialized type of ultrasonic inspection called Scanning Acoustic Microscopy (SAM) has been developed. SAM systems allow for much higher resolution inspections and for the detection of additional defects such as die tilt or warpage, wire connects, underfill flow, solder bump integrity, hermetic seal integrity, and missing die. More recently SAM has been applied to the inspection of advanced packages; MEMS, CSI and BSI wafers; and die-on-wafer applications. The increased complexity of layers and materials in these samples has required the development of new inspection techniques. In this presentation, an overview of the capabilities of SAM systems for packages, strips, and bonded wafers will be shown.

Presenter:

James C.P. McKeon, Ph.D, Director of Technology, Sonix, Inc.

  • Ph.D. in Applied Science with a concentration in Nondestructive Evaluation (NDE) with primary focus being ultrasonic NDE
  • 27 years ultrasonic inspection experience
  • During the past 22 years, he has been working on Scanning Acoustic Microscopy hardware, software, and inspection techniques for microelectronic sample inspection
  • Inventor and holds 10 US patents

 

This event is brought to you free of charge during these difficult times from the generosity of the SMTA Capital Chapter.

You will receive an email with a personalized link to your virtual login credentials at least 24 hours in advance.  Only pre-registered participants will receive this link.