Monday, October 5th, 2020 @ 8:30am-12:00pm (US Pacific)
Presenter: Jennie Hwang, Ph.D., H-Technologies Group
Focusing on preventing prevailing production defects and product reliability issues that affect yield, cost and performance through an understanding of potential causes and plausible solutions. The course provides a holistic overview of product reliability including the important roles of materials, processes and testing/service conditions, as well as the crucial principles behind the product reliability. Two selected areas related to product failure (intermetallics and tin whisker) and five selected defects (PCB pad cratering vs. pad lifting, BGA head-on-pillow, open or insufficient solder joints, copper dissolution issue and lead-free through-hole barrel filling) will be discussed. Specific defects associated with the reliability of BTC and PoP assembly will be highlighted. The course summarizes the role of intermetallics at-interface and in-bulk (contributing from the PCB surface finish/component coating) in relation to product reliability, and the difference between SnPb and Pb-free solder joint in terms of intermetallic compounds, which in turn is attributed to production-floor phenomena and the real-word field failure. From practical perspectives, tin whisker with emphasis on risk mitigation through understanding the factors that affect tin whisker growth and its testing challenges will be outlined. The practical tin whisker criteria for reliability implications in the lead-free environment and the relative effectiveness of mitigating measures will be ranked.
- Premise of production defects and product failure prevention
- Common production defects and issues in lead-free assembly
- Product reliability – principles
- Product reliability – solder joint, PCB and component considerations
- PCB pad cratering (vs. pad lifting) — causes and solutions
- Open or insufficient solder Joints – different sources, best practices
- BGA head-on-pillow defect — causes, factors, remedies
- Copper dissolution - process factors, impact on through-hole joint reliability, mitigation
- Lead-free through-hole barrel filling — material, process and solder joint integrity
- Defects of BTC and PoP solder joints - prevention and remedies
- Intermetallic compounds – fundamentals, characteristics
- Intermetallic compounds – effects on failure mode, solder joint reliability
- Tin whisker - applications of concern, practical criteria, testing challenges
- Tin whisker - growth phenomena, contributing factors, risk mitigation, practical remedies
WHO SHOULD ATTEND:
The course provides working knowledge by addressing the most prevalent production defects and product issues that affect yield, cost and reliability of the assembly, suitable to all who are involved with or interested in SnPb and Pb-free manufacturing including designers, engineers, researchers, managers, quality, manufacturing and reliability professionals, as well as business decision makers; also designed for those who desire the broad-based information. Dr. Hwang, a long-standing leader in lead-free implementation and SMT manufacturing , brings deep knowledge to this course through both hands-on and advisory experiences in commercial as well as military applications.
ABOUT THE INSTRUCTOR:
Dr. Hwang, a long-standing leader in lead-free implementation and SMT manufacturing, brings deep knowledge to this course through both hands-on and advisory experiences. She has provided solutions to many challenging problems, ranging from production yield to field failure diagnosis to reliability issues in both commercial and military applications. She has 600+ publications to her credit, including the sole authorship of several internationally-used textbooks, and is a speaker in innumerable international and national events. Having received numerous honors and awards including induction into International Hall of Fame (Women in Technology) and National Academy of Engineering, she has served on the Board of NYSE Fortune 500 companies, and on various civic, government and university boards and committees, including U.S. Defense Dept. - Globalization Committee, Forecasting Future Disruptive Technologies Committee. She chairs the Board of Panels on the Assessment of Army Research Laboratory and the Board of Panels on the Assessment of Army Engineering Centers, and on the Assessment Board of NIST, the National Materials and Manufacturing Board, National Laboratory Assessment Board and the Board of Army S&T, System, Acquisition and Logistics. She is a reviewer of various government programs and publications. Her formal education includes Harvard Business School Executive Program and four academic degrees (Ph.D. M.S., M.S., B.S.) in Metallurgical Engineering and Materials Science, Physical Chemistry, Organic Chemistry and liquid Crystal Science. She has held various senior executive positions with Lockheed Martin Corp., SCM Corp, Sherwin Williams Co, and IEM Corp. She is also an invited distinguished adj. Professor of Engineering School of Case Western Reserve University, and serves on the University’s Board of Trustees. The Dr. Jennie S. Hwang YWCA award, now for 20 years running, is established in her honor, recognizing outstanding women students pursuing a STEM discipline.