Webinar: Impact of LTS on Electronic Package Dynamic Warpage Behavior & SMT Yields
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7/28/2020
When: Tuesday, July 28th, 2020
11:00 AM (US Eastern)
Where: Online
United States
Contact: SMTA Headquarters
952-920-7682

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Co-Hosted with: iNEMI

Free for Everyone!

 

Tuesday, July 28th, 2020 @ 11:00am-12:00pm (US Eastern)

Presenter: Ron W. Kulterman, Flex Ltd.

 

Overview

Low temperature solder (LTS) adoption has increased over the years with the primary focus on reducing energy consumption. The fundamentals of dynamic warpage are well established in SMT industry, but there is minimal literature on the application of low temperature solders, specifically for SAC BGA with low temperature solder paste. iNEMI has conducted a wide range of dynamic warpage characterization of different electronic package types, namely package on package, fine pitch BGA, large FCBGA package with and without lids, and a wide selection of PBGA packages. The database generated has been reviewed to understand the impact of low temperature solder in reference to dynamic warpage considerations which avoids the typical maximum peak and valley warpage present at higher reflow temperatures.

Additional consideration is given to the rate and magnitude of contour change during LTS solidification phase that can induce a solder hot tear defect.  It was found that it is primarily the PBGA and FCBGA packages that require greater attention and optimization for LTS adoption.

Information from this presentation was originally presented at IEEE’s Electronic Components and Technology Conference (ECTC) 2019.

 

About the Presenter

Ron W. Kulterman is Materials Characterization and FA Lab Manager for Flex Ltd in Austin, Texas. His primary focus is on thermal mechanical behavior of PCBA structures in PCBA SMT manufacturing processes. He has worked with Flex (originally Solectron) since 1999 and has been in his current position for 10 years. Prior to that, he had a lead role in Design Services, with an emphasis on balancing design functionality with optimum DFM.

Prior to joining Flex, Ron was with IBM for 18 years, work with Test Engineering, as New Product Liaison between Manufacturing and Development Engineering, and eventually migrating into Lead Engineer and System Administration roles with EDA PCBA Design Services.

Ron earned his BSEE degree from the University of Texas.