Intermountain (ID, UT)

ID, UT 

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Chapter News

SMTA Golf Scramble Aug 17, 2017

www.smta.org/chapters/files/Intermountain_Boise_Intermt_SMTA_Golf_Scramble-_Aug_17_2017_-_Rev_2.docx






12 Annual SMTA Golf Scramble, 20 June 2017

  






Intermountain Boise Expo & Tech Forum

 

 Wednesday, March 29, 2017 

Location: Boise State University 
Student Union Building Hatch Ballroom
1910 University Drive
Boise, ID 83725

Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Free Technical Program & Schedule: 
8:00AM
Registration opens

9:15AM – 10:00AM
Eric MoenUnderstanding PCB Design & Material Warpage Challenges Which Occur During B2B Board-to-Board/Module-Carrier Attachment 
Speaker: Eric Moen, Akrometrix 
PCB warpage has been identified as one of several key contributors to unacceptable yield rates during reflow assembly of a PCB module to a PCB carrier board. The module has a land grid array pattern and is placed directly on solder paste on the carrier board. This results in low-profile solder joints which are sensitive to the co-planarity of both the module and the carrier boards. The typical failure mode occurs when one or more solder joint opens are caused by a lifted corner of the module during/after reflow.
In an effort to improve attachment yield rates, a design of experiment has been proposed to evaluate several PCB design variables that are believed to contribute to warpage during reflow, including: (1) laminate material, (2) layer-to-layer copper balance, (3) panel configuration of the 6-up module array and (4) location of the 6-up array in the PCB fabricator’s working panel. To simplify the investigation, only the variables associated with module PCBs are considered; the carrier PCB design is held constant.
Additional graphical and statistical data which shows real-time at-temperature warpage behavior of several PCB modules and carriers will also be presented. This includes a detailed at-temperature gap analysis which shows the co-planarity gap between module and carrier at each critical reflow temperature.
This paper & presentation will present graphical and statistical details of at-room-temperature metrology on a large sample of modules with differing design variables. Shadow Moiré technique will be used to provide accurate warpage profiles of the 6-up module arrays before and after top- and bottom-side assembly, and again before and after attachment to the carrier board. A large volume of samples will be tested in order to gain statistical relevance of the data and correlate any yield problems to initial warpage. The objective is to isolate the key design parameter(s) that contribute most to attachment problems while also observing & reporting on the at-temperature warpage behavior of the substrates during reflow.

10:00AM
Expo opens

11:00AM – 11:45AM
bauerWearable Electronics Drives a New Manufacturing Paradigm! 
Speaker: Charles Bauer, Ph.D., TechLead Corporation 

With all the excitement around IoT (Internet of Things), big data and cognitive computing the impact of wearable electronics and smart textiles on the manufacturing environment frequently gets lost in the noise. However, these trends create many new and exciting challenges for the electronics industry, including new design, manufacture, test, and supply chain paradigms. The central role played by sensors, energy storage and energy harvest devices results in altogether revolutionary packaging concerns. Intended for intimate contact with human skin in diverse, often hostile environments such as automobile cabins and seawater, these systems require new yet proven safe and reliable materials as well as customized application configurations. This presentation explores the seemingly conflicting requirements of achieving low cost while meeting the high volume, high mix product requirements of this brave new world of electronics systems.

12:00PM
Complimentary Lunch
 

1:00PM – 1:45PM
bauerEquipment Road Maps… A Guide to Planning in the SMT Environment
Speaker: David Nixon, Keytronic EMS 

Do you find yourself reacting to new production equipment needs that you didn’t budget for? Often finding yourself struggling to find the right equipment with room for production expansion. This presentation will walk you through the process of building a 5-year equipment road map so that your budget and equipment needs are planned and not reactionary. We will discuss several methods for growth projection and the in’s and out of new vs used equipment.

2:30PM – 3:15PM
Establishing DFM Guidelines on Discrete Component Spacing in Printed Circuit Board Assembly
Speaker: John Harrell, Micron Technology, Inc. 
Surface mount technology (SMT) is ubiquitous in electronics industry. The solder paste printing and placement process forms the core of SMT technology. With increasing customer demands for small form factor in high-capacity memory, space in a printed circuit board (PCB) is premium; and, hence, careful consideration must be given to PCB design. In the current PCB design for manufacturing (DFM) guidelines, discrete component spacing rule is defined without considering package size combinations. The key objective of this study is to propose new spacing between land pads for discrete components like resistors and capacitors in PCB design. This proposal enables smaller form factor in high-capacity memory. Screening, optimization experiments, and analyses were performed to substantiate the proposal.

3:30PM
Drawing for Door Prizes - Must be present to win!
 

4:00PM
Expo Closes
 


Current Exhibitor List:

Check SMTA event page for updated exhibitor list

Companies in bold are SMTA corporate members
Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on March 3rd, 2017! 

Click here for Ad and Sponsorship opportunities!


Important Exhibitor Materials:

 



Please contact SMTA Expo Manager Kaitlyn Gherity with questions or for additional information.






SMTA Intermountain Chapter Current Newsletter and Archives

2016 March Newsletter
2012 September Newsletter
2011 March Vendor conference
2011 February
2009 April January
2007 September
2006 November March
2005 August July May April February
2004 September June April






Chapter Calendar of Events
Date / Time Event Location Phone Contact/Email
August 11, 2016
8:00 am
Golf in Idaho Shadow Valley Golf Course 208-867-6006   David Bell 
dcbell@q.com
September 26, 2016
8:00 am
SMTAI Conference & Exhibition Donald Stephens Convention Center, Rosemont Ill 952-920-7682   Kaitlyn Gherity 
kaitlyn@smta.org
October 20, 2016
10:00 am
SMTA Utah Expo & Tech Forum University of Utah (952)920-7682   Kaitly Gherity 
kaitlyn@smta.org
November 10, 2016
4:00 pm
Idaho Technical Meeting Boise location - TBD 208-867-6006   David Bell 
dcbell@q.com
January 17, 2017
6:30 pm
Membership Appreciation Dinner, Idaho Izumi Japanese Steak House (208)850-2124   Sheldon Stewart 
sheldon.stewart@plexus.com
March 29, 2017
9:00 am
2017 Boise Expo and Technical Forum Boise State University 208-850-2124   Sheldon Stewart 
Sheldon.Stewart@plexus.com
June 20, 2017
8:00 am
SMTA 12th Annual Golf Scramble Birch Creek Golf Course, Smithfield Utah 435-227-9659   Gordan Jackman or Robert Winter 
gordan@campbellsci.com
August 17, 2017
9:00 am
Boise Golf Scramble Shadow Valley Golf Club (208) 898-1275   Sheldon Stewart 
Sheldon.Stewart@plexus.com
October 19, 2017
Intermountain Utah Expo & Tech Forum University of Utah 952-920-7682  Kaitlyn Gherity 
November 9, 2017
4:00 PM
Intermountain Chapter Meeting TBD (208)615-0063   Sheldon Stewart 
sheldon.stewart@plexus.com


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Our Chapter Leaders

President : Sheldon S. Stewart  (Plexus Corp.)
Phone : 208-898-1275
Email : sheldon.stewart@plexus.com

Vice President : Tony Whitt  (Automation Supply)
Phone : 303-881-1623
Email : tony@automationsupply.com

Secretary : Don Ellison Saunders  (Hewlett-Packard Company)
Phone : 208-866-5608
Email : don.e.saunders@hp.com

Treasurer : Robert Winter  (L3 Technologies)
Phone : 801-725-0820
Email : robert.g.winter@L3T.com

VP of Technical Programs : Patrick Ryan  (Indium Corporation)
Phone : 315-534-3316
Email : pryan@indium.com

Webmaster (Appointed) : Steve W. Greathouse  (Plexus Corp.)
Phone : 208-898-1274
Email : steve.greathouse@plexus.com

VP of Membership (Appointed) : Josh Matthew Huether  (Plexus Corp.)
Phone : 208-898-1201
Email : josh.huether@plexus.com

Chapter Advisor (Appointed) : David C. Bell  
Phone : 208-867-6006
Email : dcbell@q.com

Director of Utah Golf (Appointed) : Gordan Jackman  (Campbell Scientific Inc.)
Phone : 435-227-9659
Email : gordan@campbellsci.com

Board Liaison : Raiyo Aspandiar (Intel Corporation)
Phone Contact : 503-696-2627
Email Address : raiyo.f.aspandiar@intel.com

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Global Participating Members of our Chapter

HISCO, Inc.

Plexus Corp.



Corporate Members of our Chapter

Blackfox Training Institute

Computrol Meridian

Computrol Orem

Krayden, Inc.

Micron Technology Inc



SMTA Global Members

Amazon Celestica Inc. Cisco Systems, Inc. Creation Technologies Inc. FCA Group Harris Corporation Henkel Electronic Materials LLC HISCO, Inc. IDENTCO ITW EAE Jabil Circuit Sdn. Bhd. Keysight Technologies KYZEN Sdn. Bhd. Metallic Resources, Inc. Micro Systems Technologies Management AG NCAB Group USA NEO Technology Solutions Plexus Corp. Samtec Microelectronics SMAC Specialty Coating Systems Vexos ZESTRON Americas

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SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344

Phone 952.920.7682
Fax 952.926.1819
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