Carrollton, TX 75006

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October Chapter Meeting


Steven Kummerl, Texas Instruments - Member of the Technical Staff



This presentation will share innovative real time x-ray reflow videos that have culminated into the “Freeze Frame” reflow technique.  This methodology will help process engineers identify voiding root causes and other SMT defects.  In addition to sharing case studies using “Freeze Frame” reflow technique, a variety of real time x-ray videos will be shared showing various voiding effects from board design, solder paste selection, and also the implementation of vacuum during reflow.



Date: October 6, 2017 @ 11am
Location: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080


  • FREE for New Members since prior meeting
  • $10 for Committee Members
  • $20 Members, employees of Corporate member companies, 1st time guests, and students
  • $25 non-members, students, & guests – same price
  • Cash at the door or credit card on-line (see below)

Ticket Type


  • 11:00am - Check in and Networking
  • 11:30am - Lunch Begins
  • 11:45am - Chapter Announcements
  • 12:00am - Feature Presentation
  • 1:00pm - Adjourn


Speaker Bio:

Steven Kummerl received his B.S. degree in Mechanical Engineering from University of Texas El Paso in 1995. He is a member of technical staff at Texas Instruments supporting semiconductor packaging R&D. He has worked in the field of high volume/high mix surface mount assemblies for more than 13 years and over 10 years at TI supporting packaging R&D. In his most current role Steven has designed numerous complex 3D packages, researched materials for robust second level reliability performance, and contributed in the creation of the System in Package and Sensor Technology roadmaps for TI. He holds over sixteen patents in the field of package design and has authored multiple publications which have been accepted into the Journal of SMTA, IEEE CMPT 2011 Characterization and modeling best paper of the year, and special invited guest speaker for the 2017 International Microelectronics and Packaging Society’s “System in Package” conference.

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Chapter Calendar of Events
Date / Time Event Location Phone Contact/Email
January 13, 2017
11:00 am
Chapter Meeting Aboca's Italian Grill 972-672-2506   Gary Tanel 
April 7, 2017
11:00 am
Protecting the Supply Chain from Counterfeit Electronic Components Aboca's Italian Grill 972-672-2506   Gary Tanel 
May 5, 2017
11:00 am
Chapter Meeting: HDI Manufacturing and Design Aboca's Italian Grill 972-672-2506   Gary Tanel 
June 2, 2017
11:00 am
Stencil Printing and Design Aboca's Italian Grill 972-672-2506   Gary Tanel 
September 18, 2017
09:00 am
SMTA-I Rosemont, IL 972-672-2506   Gary Tanel 
October 6, 2017
11:00 am
Advanced Packaging Aboca's Italian Grill 972-672-2506   Gary Tanel 
November 3, 2017
Chapter Meeting Aboca's Italian Grill 972-672-2506   Gary Tanel 
November 14, 2017
Certification - SMT Processes - November 14-16 (Dallas,TX) Verion Training Systems   Jenny Ng 
December 1, 2017
06:00 pm
Member Appreciation Party Grapevine Theater 972-672-2506   Gary Tanel 
January 12, 2018
Chapter Meeting Aboca's Italian Grill 972-672-2506   Gary Tanel 
February 9, 2018
Chapter Meeting Aboca's Italian Grill 972-672-2506   Gary Tanel 
April 10, 2018
Vendor - Expo - Dallas 2018 Plano Centre   Kaitlyn Gherity 
May 16, 2018
Medical Device Conference University of Texas at Dallas 952-920-7682   Jenny Ng 

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Our Chapter Leaders

President : Gary Tanel  (Libra Industries)
Phone : 972-672-2506

Vice President : Jack Harris  (The IPS Group, LLC)
Phone : 214-908-3336

Secretary : Keith Larson CID  (Summit Interconnect)
Phone : 817-915-5664

Treasurer : Jim Baker  (Spectra Sales Corporation)
Phone : 214-912-4103

VP of Technical Programs : Darrell Ray  (DRS Technologies)
Phone : 214-507-2117

VP of Membership : Carol Primdahl  (Krypton Solutions)
Phone : 214-882-2363

Webmaster (Appointed) : Chintan Sutaria  (CalcuQuote)
Phone : 909-278-8233

Technical Committee (Appointed) : Riki G. Brown  
Phone : 951-733-2806

Technical Committee (Appointed) : Viswanadham Puligandla Ph.D.  (Nokia (Retired))
Phone : 972-355 7107

Technical Committee (Appointed) : Glenn Robertson  (Process Sciences Inc.)
Phone : 972-960-2323

Technical Committee (Appointed) : Michael Barnes  (Fujitsu Network Communications, Inc.)
Phone : 972-479-2280

Newsletter Editor (Appointed) : Karl S. Doebbert  (Prototron Circuits)
Phone : 214-675-7017

Set Up Committee (Appointed) : Jimmy Randolph Fallin  (Philips Entertainment)
Phone : 214-647-7960

Board Liaison : Sal Sparacino (ZESTRON Americas)
Phone Contact : 703-393-9880

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Global Participating Members of our Chapter

Creation Technologies Inc.

Keysight Technologies


Corporate Members of our Chapter

Alliance Rubber Company

BBM, Inc.


Conecsus LLC

CR Assembly Corporation

DG Marketing Corporation

E.T.S. Group, Inc.

Electrolab, Inc.

Fujitsu Network Communications, Inc.

G-Force Reps, Ltd.

GSC (Garland Service Company)

JTAG Technologies

Krypton Solutions

LeeMAH Electronics

Mek Americas

National Circuit Assembly

NPI Technologies, Inc.

Osai Automation System USA Corporation

PAC Global, Inc.

Philips Entertainment

Precision Technology, Inc.

Raytheon Company

Southwest Systems Technology Inc.

SPEA America

Sunshine Global Circuits

Super PCB

SVTronics, Inc.

Test Technology Associates

TestEquity LLC

The IPS Group, LLC

Trilogy Circuits, Inc.

Variosystems, Inc.


SMTA Global Members

Amazon Celestica Inc. Cisco Systems, Inc. Creation Technologies Inc. FCA Group Harris Corporation Henkel Electronic Materials LLC HISCO, Inc. IDENTCO ITW EAE Jabil Circuit Sdn. Bhd. Keysight Technologies KYZEN Sdn. Bhd. Metallic Resources, Inc. Micro Systems Technologies Management AG NCAB Group USA NEO Technology Solutions Plexus Corp. Samtec Microelectronics SMAC Specialty Coating Systems Vexos ZESTRON Americas

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SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone 952.920.7682
Fax 952.926.1819