Carolinas (NC, SC)Durham, NC
Expos | Job Resources | Educational Grant | Students Only
Donate to your ChapterSMTA Carolinas Chapter welcomes donations and sponsorships from corporations or individuals. You can submit your contribution via PayPal.
Thanks from the SMTA Carolinas Chapter Board of Directors!
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PCB Materials Panel Discussion on 19 July at Hubbell Lighting
John Fatcheric - COO Oak-Mitsui - Starting out as a chemical process engineer, John has worked in a variety of technical, operations and general management roles. John is a seasoned executive with 30+ years in electronics industry with the majority of his career spent in copper foil & copper clad laminates manufacturing.
Ronald J Hornsby Jr. – Isola Group Director of Sales, East Coast and Canada - Ron has 35 years of experience in the PCB and Laminate business. Ron, a native of Ohio and graduate of Kent State University in 1981, worked for the PCB manufacturing companies of ECD and Hadco, in quality and engineering roles, out of college. He joined Polyclad laminates in 1990, with roles in Technical Account and Product Management. In joined Isola Laminates, upon Isola acquiring Polyclad Laminates in 2006, where he managed the Tech Account Managers, before moving into Sales management in 2010.
Denis McCarthy Jr. – Technical Sales Account Manager, Ventec International - Denis McCarthy Jr. is responsible for business development activities in the Chicago East Territory selling and supporting all product lines. With his particular knowledge in IMS material/metal core PCB and flex materials/rigid flex PCB, Denis will also play a key role in driving forward the company’s IMS material ranges and Ventec’s latest Thinflex line and No-Flow/Low-Flow prepregs. Having previously worked as Operations and Quality Manager at Ventec’s Chicago facility, Denis re-joins the company with over 25 years of focused industry experience and an in-depth understanding of customer requirements. Denis began his career at Sanmina Corp before moving on to production supervision and management roles at Printed Circuit Corp., Telecom USA Inc. and Time Sensitive Circuits. Most recently, Denis held the position of Engineering Manager at H and T Global Circuits with overall responsibility for process engineering.
Gareth Parry – Aismalibar, Chief Field Application Engineer - Mr. Parry has 25+ years of experience in the PCB industry. He had graduated with a Bachelor’s of Science in Mechanical Engineering and holds a Postgraduate Certificate in Advanced Microelectronics from the University of Bolton, UK. Gareth has been a member of the Association of Professional Engineers of Ontario since 1987.
Thank you to our event sponsors ATLANTECH, CTI, and KOH YOUNG
A very special thank you to our location sponsor HUBBELL LIGHTING
SMTA Info-Session Registration$5 pre-pay discount. Pre-pay ends on the Monday prior to the Thursday meeting
LED A.R.T. Symposium in RTPThe SMTA and CALCE are pleased to announce the LED Assembly, Reliability, and Test (A.R.T.) Symposium will take place November 28 - November 30, 2017 at the Archie K. Davis Conference Center in Research Triangle Park, NC.
The LED Assembly, Reliability & Testing (A.R.T.) Symposium will provide attendees with information to bridge the gap between the semiconductor physics and the architectural design level issues in LED supply chain. The design, manufacturing, reliability assessment, testing and inspection of LEDs and LED lighting products are not at the same level of development and interest. The LED A.R.T. Symposium is the forum for the industry to explore the problems faced and offer solutions.
- Reliability and Testing
The topics of interest include, but not limited to:
- LED Assembly, Failure Mechanisms, Packaging, and Applications
- Package and Board Cleaning
- Architectural and Smart Lighting
- LED Driver Systems
- UV, IR, and Wearable Sensors
If you would like to present at this conference, please submit a 200-300 word abstract to http://www.smta.org/LED/call_for_abstracts.cfm by July 1, 2017. Please include a title, author name, and contact information with your abstract. You can also submit proposals for half or full day workshops.
For more information on the conference, exhibition, or sponsorship opportunities, please contact Jenny Ng (email@example.com) at 952-920-7682. For more information on the Tutorials and Workshops, contact the Program Chair, Dr. Diganta Das (firstname.lastname@example.org).
FORE - Golf Tournament
Date: September 14th
Tee-Time: 10:00 AM Shotgun Start
Course: Mill Creek Golf Club
Address: 1700 St. Andrews Drive; Mebane, NC 27302
Cost: $100 per Player, $400 per Foursome
Click here for sponsorship info: www.smta.org/chapters/files/carolinas_2017_SMTA_Golf_Tournament.docx
Mill Creek Golf Club is situated 650 acres in Mebane, North Carolina. The course has been carved out of land which seems to have been long-destined to become a gold course. It was completed in 1995 and features Ultradwarf Bermuda greens, Bermuda fairways, tree-lined fairways and hilly terrain. Water comes into play on several holes. We look forward to you coming out to Mill Creek Golf Golf and playing soon.
§ Black Tees - Yardage: 7004, Rating: 73.6, Slope: 138, Par: 72
§ Blue Tees - Yardage: 6387, Rating: 70.7, Slope: 131, Par: 72
§ White Tees - Yardage: 5711, Rating: 67.6, Slope: 119, Par 72
§ Yellow Tees - Yardage: 4884, Rating: 68.6, Slope: 117, Par: 72
You can sign-up as a single player or a complete foursome. To RSVP, please click here, or copy this address into your browser. http://www.smta.org/chapters/rsvp.cfm?BEE_ID=4166. You can register using the PayPal link found below our event sponsor list.
We are also looking for companies or individuals to help sponsor the event with prizes. You can donate using the same process as registering for the tournament or reach out to Eddie or Luis with prizes.
Please contact Bob Doetzer (Bob@circuittechnology.com) ) or Luis Sastoque (Luis@sastoque.com). Thanks for supporting the SMTA Carolinas Chapter Golf Outing!
Thanks to all our sponsors for supporting this event
Title Sponsor - $900 SOLD OUT
Corporate Sponsors - $600 - 7 Sold , 11 Left
Group Sponsorship - $400
Hole Sponsorship - $300
Donation Opportunities: $250 each
Donate to SMTA
ALL Proceeds support SMTA Programs
Successful SMTA Carolinas Expo
The 2017 Tech Conference and Expo on 16 May in Greensboro was a tremendous success. Pulling attendees from across the region, each was treated to an extraordinary set of whitepapers focused on IIoT, its implications and implementation. Thanks to our speakers for sharing their expertise.
While the papers where the highlight of the day's events, our raffle winners might disagree!
Congratulations to each of them with a special thank you to our sponsors who donated the prizes.
SMTA Carolinas ChangesFellow SMTA Members,
I would like to update you all on several important changes that have occurred recently for SMTA Carolinas. Two of our chapter officers, Larry Pymento and Cef Gonzalez, are taking on new responsibilities in their careers and are thus moving on to new challenges. They will both be missed, having led our initiatives for technical programs and membership, respectively. However, with these changes comes opportunity, and I am excited to announce several new board members. Bob Doetzer of Circuit Technology will join us as VP of Technical Programs and will be responsible for ensuring we continue to offer our membership strong technical content at future meetings. Jennifer Mace of Kimball Electronics will also join us as VP of Membership, and will lead in addition to our growth initiatives an increased focus on social media. Please join me in welcoming these individuals to the Carolinas leadership team, and as always, send us your ideas on how we can better serve you. A full list of chapter officers is available on smta.org. Thank you all for your consideration.
Eddie Kobeda, Ph.D.
SMTA Carolinas President
I wanted to update you on several important upcoming events in 2017.
this year. In 2017, you can expect the annual golf outing and several additional info-sessions across the Carolinas.
Successful Infosession GMI
Thank you to GMI and our speakers for ANOTHER great infosession and networking dinner
TOPIC: New Inspection and Metrology Advancements: Characterizing PCB Components in a New Way
The digital age has helped engineers analyze and measure critical features in new ways. By integrating hardware with software, traditional inspection and measurement limitations can be overcome. This has helped scientists and engineers acquire better data to solve complex problems with increased credibility
* How an increased depth of field makes detecting counterfeit components easier
* New ways to measure volume of deposits or component thermal expansion
* How more data points in an area format vs. single point or lines improves measurement repeatability
Speaker Bio: Jon Tedesco recently relocated to Charlotte, NC and has been working with Keyence Corporation for more than 5 years. In his current role, he helps customers solve applications in R&D, Quality Control or Failure Analysis. Prior to Keyence, Jon worked in technical support for a Fortune 500 IT Data Center Equipment Manufacturer and holds a Bachelor of Science in Engineering Management from Clarkson University in NY.
TOPIC: Nano coatings for stencils: What can they do for you?
Nano Coatings have been introduced by various manufacturers, with the promise of addressing some of the challenges relative to solder paste printing. Stated benefits include:
* Reduced underside cleaning
* Reduced bridging
* Improved solder paste release
* Improvements in yield
With several Nano technologies already on the market and more likely to be introduced, how can the performance be quantified? How can an assembler approach ROI? What hidden benefits or negative impacts should be considered? This paper will present a rigorous method for evaluating the performance and economic benefits of solder paste stencil Nano Coatings. Criterion such as underside cleaning, bridging, solder paste deposit geometry, post-print cleaning, and abrasion resistance of the coating will all be considered. Transfer efficiencies were studied across aperture sizes ranging using tin-lead, lead-free, water soluble, no-clean, and type 3, 4, and 5 solder pastes. Solder paste print performance for each Nano coating was summarized with respect to all of these variables. Performance of currently available coatings will be compared. Standard industry rules for stencil aperture design are being challenged by nano coating, consequently, proposed guidelines for stencil design are recommended.
Speaker Bio: Tony Lentz has worked in the electronics industry since 1994. He worked as a process engineer at a circuit board manufacturer for 5 years. Since 1999, Tony has worked for FCT Companies as a laboratory manager, facility manager, and most recently a field application engineer. Since 2013, Tony has focused on field application and R&D for FCT Assembly solder and stencil products. Tony has extensive experience doing research and development, quality control, and technical service with products used to manufacture and assemble printed circuit boards. He has published and presented many papers at industry events. Tony holds B.S. and M.B.S. degrees in Chemistry.
Panasonic Factory Solutions Award Presenation
PowerAmerica team proudly displaying its award
Successful Infosession at CREE
When Thursday, 08 Dec 2016 at 5:30
Topic: LED Component Trends for the Lighting Market
Thanks to our event sponsor CREE
Successful Infosession at Hubbell
Topic Focus on LED Assembly
Location 701 Millennium Blvd, Greenville, South Carolina 29607
“Fill the Void" by Tony Lentz, FCT Assembly
Voids in solder joints are a concern for many electronic manufacturers. Minimization of voiding is beneficial for the life and function of the circuit board; yet, many things cause voids. Regardless of the cause, there are ways to minimize voiding. For example, changes to the reflow profile can help reduce voiding, but the changes need to fit the solder paste. A test was designed to validate methods of minimizing voiding and a set of recommendations were made. This was all done in an effort to help the reader to “Fill the Void”.
"Optimize the Reflow Profile to Minimize Voiding" by Marybeth Allen, K.I.C.
Void reduction is a significant concern and controversial topics in electronics assembly. Voiding impacts electrical, thermal, and mechanical performance. There are many variables such as substrates, components, solder paste, acceptable void levels, and of course the reflow profile. This discussion will focus on the optimization of the reflow profile as one the solutions for the reduction of voiding.
Thanks to our location sponsor - Hubbell Lighting!
Additional thanks to our event sponsors
Chapter Update & Elections
Hello Current and Future SMTA Members,
I wanted to take a few moments to update you on several important topics as we enter the fall and approach the end of 2016. I hope many of you have had a chance to participate in one of our technical sessions hosted by the Carolinas Chapter, or utilized the resources on our SMTA web site provided by our national organization. Remember there continues to be excellent offerings with respect to webinars, papers, etc. from leading industry experts which will enhance your career and provide a great balance of business and technical acumen.
We have several important events coming up soon, including a golf outing this Thursday, Sept. 15, a joint SMTA – Student Chapter meeting at Juki in RTP, NC, on Thursday Sept. 22, and of course SMTAi is right around the corner the week of Sept. 26 in the Chicago area. We are also planning for an additional Info Session Dec. 8 at Cree in Durham, NC. Please mark your calendars and consider joining us for any or all of these events. There is still plenty of time to sign up.
Another important issue I want to highlight are the annual elections which are just around the corner (typically completed in Oct./Nov. time frame). I would like to encourage everyone to consider how they might participate further in SMTA, or perhaps nominate a colleague who could bring their unique and valuable leadership experience to the organization. We all realize the many challenges this can invite but are excited about the possibilities, especially the creative ideas we would expect from new faces. Of course, your role could simply be in the form of a collaboration on a small project or it could be a very big new role that benefits our members and the chapter objectives more widely. I hope you will give this further thought and let any of our current officers know if you have any questions.
For the many of you that are already members let me thank you sincerely for your continued support. If you are not currently a member I strongly encourage you to consider joining the Carolinas Chapter, and prior to that please allow one of our officers to share their own personal stories on the benefits of participating. Thank you very much for your consideration.
Eddie Kobeda, Ph.D.
President, SMTA Carolinas Chapter
SMTA Spring Blast Technical Info Session Presentations
Thanks to everyone who attended the 13Apr meeting. With 56 attendees it was a tremendous success!
The presentations are now available for viewing
1) Defect Recognition and Failure Analysis with High Resolution X-Ray/3D Computer Tomography and 3D AOI, John Travis, Nordson
(2) Critical PCBA Success Factors for EMS, Larry Pymento, SMTA Carolinas Chapter
Thanks to our event sponsors: GMI, Future Electronics, & Arrow Electronics
The Alphabet Soup of IPC Specifications
Bob Doetzer, Circuit Technology
New and Emerging Technologies in Electronics
Daniel Baldwin, Engent
Three Dimensional Integration
Paul D. Franzon, NC State University
The Future of HDI Via Structures, Power Delivery, and Thermal Management in Next Generation Printed Circuits
Tom Buck, Viasystems
Shawn Robinson, Panasonic
IoT Device Teardowns
Bill Cardoso, Creative Electron
Wireless Research Center of North Carolina Developments
Larry Steffann, Wireless Research Center of North Carolina
Investigation into the Use of Nano-Coated Stencils to Improve Solder Paste Printing
Bill Kunckle, Metal Etching Technology
Fill the Void
Tony Lentz, FCT Assembly
Optimized Profiling to Minimize Voiding
Marybeth Allen, KIC
LED Components in Lighting Markets
Tom Place, CREE
Reliability of Level 1 and Level 2 Packaging in Solid-State Lighting Devices
Dr. Lynn Davis, RTI International
|Date / Time||Event||Location||Phone||Contact/Email|
February 23, 2017
|Winter Infosession||GMI at 1133 N Main St, Mooresville, NC 28115||919.624.2113||
May 16, 2017
|2017 Carolinas Expo & Tech Forum||Holiday Inn Greensboro Airport at 6426 Burnt Poplar Rd, Greensboro, NC 27409||919.624.2113||
July 19, 2017
|Summer Info Session||Hubbell Lighting at 701 Millennium Blvd, Greenville, SC 29607||704-787-0293||
September 14, 2017
|Carolinas Chapter Golf Event||Mill Creek Golf Course at 1700 St Andrews Dr, Mebane, NC 27302||919-552-3434||
Eddie Kobeda Ph.D. (Visionary Thinking Group)
Phone : 800-790-0437
Email : email@example.com
Vice President :
Luis M. Sastoque (Team Manufacturing)
Phone : 704-788-9088
Email : Luis@sastoque.com
Brent A. Fischthal (Koh Young Americas)
Phone : 7046512860
Email : Brent.Fischthal@KohYoung.com
VP of Membership (Appointed) :
Jennifer Lynn Mace (Kimball Electronics)
Phone : 9193895861
Email : Jennifer.Mace@kimballelectronics.com
VP Technical Programs (Appointed) :
Bob Doetzer (Circuit Technology, Inc.)
Phone : 919-552-3434
Email : firstname.lastname@example.org
VP Special Events & Student Chapter (Appointed) :
Nicholas Mescia (Power America)
Phone : 919-741-9264
Email : email@example.com
Acting Treasurer :
Luis M. Sastoque (Team Manufacturing)
Phone : 704-788-9088
Email : Luis@sastoque.com
Board Liaison :
Eileen Hibbler (TEK Products)
Phone Contact : 321-355-8519
Email Address : firstname.lastname@example.org