University of Toronto Student ChapterToronto, Canada
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Improving Reliability of Electronic Devices - A Multidisciplinary Approach; Talk on April 4, 2017
The University of Toronto SMTA Student Chapter would like to welcome André M. Delhaise, a PhD candidate under the supervision of Professor Doug D. Perovic at the University of Toronto. André will be presenting a talk about Improving the Reliability of Electronic Devices – A Multidisciplinary Approach. A full bio of André and the abstract for his talk can be found below.
The talk will be happening on Tuesday, April 4th, 2017 in SF1101 (10 King’s College Road, Room 1101) from 6 – 7 PM. Light refreshments will be served.
Please RVSP here by Monday, April 3rd: smta.org/chapters/rsvp.cfm?BEE_ID=4179
We hope to see you there!
Improving Reliability of Electronic Devices - A Multidisciplinary Approach
Over the last twenty years, society has become increasingly dependent on technology, particularly electronic devices. Not only in commercial devices such as laptop computers and smartphones, electronic devices are prevalent in the aerospace, automotive and medical industries. These applications require high reliability (likelihood for a material or device to survive given some stimulus). It is therefore crucial to study the reliability of a new technology to ensure the device will not fail unexpectedly in service and potentially have catastrophic consequences (such as the Air Asia crash in 2014). Electronic assemblies are challenging systems to characterize, given they consist of a wide array of materials, each possessing vastly different properties. One of these materials is solder, which forms the interconnect between electronic components and the printed circuit board (PCB). Careful consideration of solder alloy metallurgy and properties is essential to ensuring device reliability.
This talk firstly gives a high-level overview of the various components of an electronic assembly, then discusses the various challenges encountered in the electronics manufacturing industry with respect to solder alloys. In addition, the various approaches taken by industry and academia to address these issues will be covered. Special focus will be placed on the research projects ongoing between the Perovic group at the University of Toronto and Celestica, which focus on the reliability, properties, and metallurgy of new, novel solders containing bismuth (Bi), and are aimed towards the commercialization of these alloys.
André M. Delhaise graduated from the University of Toronto with a BASc Materials Science & Engineering in 2013. André has been involved in the SMT industry since May 2011, when he started a 16-month internship at Celestica Toronto, working as a Materials Lab Technician in the Engineering Services department. There, he was involved in numerous projects including PCB qualifications, solder joint failure analysis, and lead-free solder research. For his fourth-year thesis, he did a project investigating the effects of contamination and environment on the growth characteristics of tin whiskers in electronic assemblies, in close collaboration with Celestica. After graduation, he started a MASc degree (bypassed to PhD in 2014) under the supervision of Professor Doug D. Perovic and Dr. Polina Snugovsky (Celestica), focusing on the strengthening mechanisms of bismuth in lead-free solder alloys. André was recently rehired by Celestica in February 2017 as a metallurgist, and is involved in several lead-free projects in association with the Refined Manufacturing Acceleration Process (ReMAP), a Canadian-led consortium of academic and industry partners focused on the commercialization of novel manufacturing technologies and processes.
Introduction to Manufacturing and EMS Operations
University of Toronto Student Chapter/Toronto SMTA Joint Chapter Meeting
Amy Zhao (University of Toronto)
Phone : 647-882-2860
Email : firstname.lastname@example.org
Vice President :
Farheen Fathima Ahmed (University of Toronto)
Phone : 416-912-9045
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Drew Tomchyshyn (University of Toronto)
Phone : 647-969-6076
Email : firstname.lastname@example.org
Chapter Advisor :
Doug Perovic (University of Toronto)
Phone : 416-978-5635
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Board Liaison :
Matt Kelly (IBM Corporation)
Phone Contact : 905-316-5242
Email Address : firstname.lastname@example.org