UT Arlington Student Chapter Poster Presentation & Luncheon
Meet the technologists of the future. Learn new technology, meet people, find interns and talented employees.
Monday February 13th, 2017
11:00 a.m. to 1:00 p.m.
SMTA Members, Non-members, Technical Managers, and Hiring Managers are welcome.
Forward this invitation to others.
Pricing: FREE for all
11:00-11:20 Check-in & Networking
11:20 Lunch begins (provided)
11:40 Brief Introduction by Prof. Dereje Agonafer
12:00 Poster Presentations
1. Effect of Copper Density on Reliability of Thin Wafer Level Chip Scale Package by Pavan Rajmane
2. The Impact of Low Loss Materials on Board Level Reliability by Mugdha Chaudhari
3. Crack Propagation Study on 3D TSV Package under Thermal Loading by Unique Rahangdale
4. QFN Package Assembly under Power and Thermal Cycling by Navya Kasi Reddy
5. Comprehensive Design Analysis of Thick FR-4 QFN Assemblies for Enhanced Board Level Reliability by Rishikesh Tendulkar
6. Solder Ball Reliability Assessment of WLCSP under Power Cycling by Srikanth Chintapally
7. Comparative Assessment of Board Level Reliability of PCBs using Viscoelastic Modeling vs. Elastic Modeling by Abel Misrak
Brief Overview of Work Done at Electronics, MEMS, and Nanoelectronics Systems Packaging Center (EMNSPC) at UT Arlington
Dereje Agonafer, Jenkins Garrett Professor
Mechanical and Aerospace Engineering, UT Arlington
The mission of EMNSPC at UTA is to establish a first-class research center that will meet the needs of industry, and in particular, the state of Texas and the North Texas region's "Electronic, MEMS and Nanoelectronics Packaging Industry". This includes research, education and training. EMNSPC will target the needs of the Microelectronics, MEMS and Nanoelectronics (with a special emphasis on thermo mechanical issues) as a fundamental research area as these technologies have and will continue to overlap. "Technology" and "Executive" Advisory Board members from Industry will provide leadership and guidance to the Center.
Dr. Agonafer is the Jenkins Garrett Professor in Mechanical and Aerospace Engineering Department (first endowed chair in the history of the department). He heads two centers and is "Site Director of NSF IUCRC in Energy Efficient Systems" and Director of "Electronics, MEMS and Nanoelectronics Systems Packaging Center." After receiving his PhD degree, he joined IBM and in 1991, the value of his contribution to "Computer Aided Thermal Engineering" was recognized by being awarded the "IBM Outstanding Technical Achievement Award in Appreciation for Computer Aided Thermal Modeling." Since joining UTA in 1999, he has successfully advised over 140 graduate students and currently advises 12 PhDs and 32 MSc students. His recent focus has been on data center cooling as "Site Director of NSF IUCRC in Energy Efficient Systems" and 3D packaging/cooling (patents filed). Professor Agonafer serves on the Scientific Advisory Board of a NSF Center, Mid-Infrared Technologies for Health and the Environment (MIRTHE) at Princeton University since 2007. He also serves on advisory boards at Princeton, Colorado, Howard and CCNY. Professor Agonafer has published over 200 papers and 10 issued patents (with several pending), He is a Fellow of ASME and Fellow of The American Association for the Advancement of Science (AAAS). Professor Agonafer has received numerous awards during his distinguished career including the 2008 Thermi Award for "Significant Contributor to the field of semiconductor thermal management", and the 2009 InterPACK Excellence Award for leadership in electronic packaging. Professor Agonafer was at MIT as a Dr. Martin Luther King, Jr. Visiting Professor during the 2007 academic year. He has offered courses and given lectures and keynotes internationally including Chiba, Toyama, Puerto Rico, Singapore, Panang, Seoul, Taipei, Shanghai, Tokyo, Osaka, and Capetown, Tufts University, Northeastern University, MIT and Harvard. Professor Agonafer received the 2014 NSBE Golden Torch Award In May 2014, he received the ITHERM Achievement, an award first instituted in 1996, and presented biennially in recognition of significant contributions made in thermal and thermomechanical management of electronics. In 2015, he received over 2 million dollars of servers from Yahoo and Cisco to build his data center lab.
Rio Grande A,
E H Hereford University Center, 300 W 1st St, Arlington, TX 76010