Upper Midwest (Minnesota, Iowa & Dakotas)

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Chapter News

April 27th: Incredible Shrinking World of Electronics

Upper Mid-west Chapter is bringing in a speaker for the following topic:
The Incredible Shrinking World Of Electronics – Can DFM Survive? Can Traditional Manufacturing Survive?
Speaker: Dale Lee, Staff DFX Process Engineer with Plexus Corporation

 

Who Should Attend:
This presentation is intended for anyone that is interested in electronic assembly processes and how they are affected by ever shrinking component dimensions.

Date:     Thursday, April 27th, 2017
Cost:      $25 Members/ $30 Non-members (make checks payable to SMTA)

Time/Agenda:

  • 12:15 to 12:45 PM - Registration/Lunch
  • 12:45 to 12:50 PM – SMTA announcements
  • 12:50 to 2:30 PM – Dale’s Presentation
  • 2:30 to 3:00 PM – Q&A
  • Times subject to change so please arrive before 12:45 PM. 

Free lunch is provided for this session. Contact smta.umwc@gmail.com for any dietary restrictions.

RSVP by April 21st to guaranty a lunchbox for this session.


Address/Directions to Hennepin Technical College:

Eden Prairie Campus
13100 College View Drive
Eden Prairie, MN  55347

From 494 East:
Exit from 494 at Flying Cloud Drive.  At the top of the ramp, go left.  Proceed south on Flying Cloud drive approximately 2.5 miles.  Turn right at College View Drive proceed to Eden Prairie Campus.
Room J110

From 494 West:
Exit from 494 at Highway 212 west. Proceed south on Highway 212 west approximately 1 mile and take Prairie Center Drive exit. Turn right and proceed to Flying Cloud Drive. Turn right and drive south for 1.5 miles. Turn right at College View Drive proceed to Eden Prairie Campus.
Room J110

Presentation Overview:
Today’s electronic component packaging technologies of  smaller packages (0201/01005/008003), finer lead pitch (0.4/0.35/0.3/…), bottom terminated components (QFN/LGA) and printed circuit board designs (high layer counts, finer lines, VIP, increased copper thicknesses, copper routing, …) have impacted traditional assembly processes with very addition of tight solder application, component placement and soldering constraints.  Using traditional, simplified mass production techniques may not be sufficient to achieve a high-yielding manufacturing process.  This presentation will highlight elements of the impacts of these technologies on reliability and yield when not properly addressed in the design/assembly/inspection-test process, introduce the elements of design for matched process (DFMP), and provide examples of several opportunities within the DFMP for yield improvement through manufacturing tooling design, SMT and PTH assembly process matching.

What you will learn:

  • Component packaging and PCB design impacts
  • SMT and PTH solder design impacts
  • Thermal balance, trace routing, equipment limitation/tolerance, PCB array tolerance, process tooling design
  • Process control impacts
  • Paste volume, thermal shock SMT and PTH, reflow process warpage
  • Cleaning impacts
  • Compatibility issues, low stand-off components

Dale Lee’s – Bio:
Dale is a Staff DFX Process Engineer with Plexus Corporation primarily involved with DFX analysis and definition/correlation of design, process, legislative and tooling impacts on assembly processes and manufacturing yields. Dale has been involved in surface mount design, package & process development and production for over twenty years in various technical and managerial positions. These activities have included research, development and implementation of advanced manufacturing technologies and interconnect techniques, design and development of CSP & BGA packages, PCB & PCBA support, DFM/DFX analysis of flex & rigid PCB/PCBA’s including supply chain, process qualification and new process introduction for domestic and foreign low, medium and high volume production applications. Dale has authored, instructed and presented topics including advanced SMT packaging, PCB and SMT design, assembly, DFM/DFX and rework. He is a past recipient of the Surface Mount Technology Association’s “Excellence in Leadership” award. He has been very involved with multiple industry associations and activities including INEMI, SMTA and IPC.






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Call for Papers: Upper Midwest Chapter Expo

Call for Papers:  Upper Midwest Chapter Expo June 22, 2017       

The Upper Midwest Chapter Expo is scheduled for June 22, 2017.


Anyone interested in presenting at the Expo is invited to submit an abstract for consideration. Please send abstracts to Kaitlyn Gherity, kaitlyn@smta.org, by March 25.

We are open to all ideas, and possible suggestions are:

·        New Developments in PCB Technology

·        Conformal Coating/Hydrophobic Coatings

·        2.5/3D Packaging

·        Robotic Laser Soldering

·        Nano-Technology with Polymeric Structures

·        Photonics Integration

·        Flexible Substrates and Flex/Rigid Hybrid Substrates

·        IoT  Manufacturing

·        Industry 4.0 development

·        Manufacturing of Sensors

·        New developments in Board Level Adhesive & Underfills

·        New developments in  Lead free Solders and Interconnect

We look forward to your response!






SMTA Certification

Now available in Minnesota!

SMT Processes- May 2-4, 2017 (Eden Prairie, MN)

·        May 2- Course (8:30-5pm)

·        May 3- ½ day of course + exam

·        May 4- All day exam (8:30-5pm)

Instruction: English 
Test: English 
Instructor: Jim Hall, ITM Consulting

 

For more information, http://www.smta.org/certification/ 






Click on links to view these Upper Mid-West Chapter newsletters:

April 2014 Newsletter
May 2011 Newsletter

March/April 2011 Newsletter
February 2011 Newsletter
June 2010 Newsletter
May 2010 Newsletter
April 2010 Newsletter
July 2009 Newsletter - Golf edition
July 2008 Newsletter
June 2008 Newsletter
May 2008 Newsletter
Mike Carano presentation, Solderable Surface Finishes Overview and Recommendations
Dave Hillman presentation, How PCB Surface Finishes Impact Assembly Processes from an OEM Perspective
March 2008 Newsletter
November 2007 Newsletter
May 2007 Newsletter






Chapter Calendar of Events
Date / Time Event Location Phone Contact/Email
April 27, 2017
12:15 pm
The Incredible Shrinking World Of Electronics – Can DFM Survive? Can Traditional Manufacturing Survive? Hennepin Technical College - Eden Prairie 612-220-9093   Sue Blankenheim 
sue@omni-tronics.com
May 2, 2017
Certification - SMT Processes - May 2-4 2017 (Eden Prairie, MN) - SMTA Headquarters   Jenny Ng 
May 16, 2017
12:15 pm
Deadly Sins of SMT Hennepin Technical College - Brooklyn Park 612-220-9093   Sue Blankenheim 
sue@omni-tronics.com
June 22, 2017
10:00 am
Upper Mid-west Chapter Vendor Expo TBD TBD   TBD 
TBD
June 22, 2017
Vendor-Expo - Upper Midwest 2017 DoubleTree by Hilton Minneapolis - Park Place   Kaitlyn Gherity 
July 28, 2017
11:00 am
26th Annual Golf Outing Stonebrooke- Shakopee 612-803-2619   Erik Stromberg 
estromberg@e-tronix.com


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Our Chapter Leaders

President : Michael Havener  (Benchmark Electronics, MN Division)
Phone : 507-452-8932
Email : mike.havener@bench.com

Vice President : Kris Meacham  (JW Sales, LLC)
Phone : 612-807-4382
Email : kmeacham@salesjw.com

Secretary : Bob Breu  (Bosch Automotive Service Solutions)
Phone : 507-363-6390
Email : bob.breu@us.bosch.com

Treasurer : Erik Stromberg  (E-tronix)
Phone : 612-803-2619
Email : erik@e-tronix.com

VP of Technical Programs : Brian Peterson  (All Flex Flexible Circuits)
Phone : 507-663-7162
Email : bpeterson@allflexinc.com

VP of Membership : Tara Dunn  (Omni PCB)
Phone : 507-332-9932
Email : tarad@omnipcb.com

VP Communications (Appointed) : Alex Zeitler  (NRI Electronics)
Phone : 651-726-1333
Email : azeitler@nrielectronics.com

VP of Operations (Appointed) : Sue Blankenheim  (Omni-Tronics Inc.)
Phone : 763-425-7910
Email : sue@omni-tronics.com

Membership Committee (Appointed) : John P. Japs  (Tonka Electronics, Inc.)
Phone : 952-831-8969
Email : john.japs@tonkaelectronics.com

Board Liaison : Robert Kinyanjui (John Deere Electronic Solutions, Inc.)
Phone Contact : 701-451-3785
Email Address : KinyanjuiRobertK@JohnDeere.com

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Global Participating Members of our Chapter

Creation Technologies Inc.

ITW EAE



Corporate Members of our Chapter

3M Company

All Flex Flexible Circuits

Altron, Inc.

Analog Technologies Corporation

Appareo

ASC International

Benchmark Electronics, MN Division

Bergquist Company

BTW Inc.

Circuit Check Inc.

Conductive Containers, Inc.

Control Products Inc.

CyberOptics Corporation

Digi International

Dimation

EI Microcircuits, Inc.

Electronic Systems Inc.

Great Lakes Engineering

Itron, Inc.

John Deere Electronic Solutions, Inc.

KeyTronicEMS

Logic PD

NRI Electronics

Production Automation Corporation

Quality Circuits Inc.

Raven Industries Inc.

RiverSide Electronics Ltd.

Seagate Technology

Solid Design Solutions, Inc.

Sparton Onyx

TEK Products, Inc.

V-Tek, Inc.



SMTA Global Members

Amazon Celestica Inc. Cisco Systems, Inc. Creation Technologies Inc. FCA Group Harris Corporation Henkel Electronic Materials LLC HISCO, Inc. IDENTCO ITW EAE Jabil Circuit Sdn. Bhd. Keysight Technologies KYZEN Sdn. Bhd. Metallic Resources, Inc. Micro Systems Technologies Management AG Microsoft Corporation NCAB Group USA NEO Technology Solutions Plexus Corp. Samtec Microelectronics SMAC Specialty Coating Systems Vexos ZESTRON Americas

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SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344

Phone 952.920.7682
Fax 952.926.1819
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