SMTA - The Surface Mount Technology Association

FEATURED BOOKS & PROCEEDINGS

		Title : IPC-A-610E: Acceptability of Electronic Assemblies (Hard Copy) Author : IPC Description : A must for all quality assurance and assembly departments, IPC-A-610E illustrates industry-accepted workmanship criteria for electronics assemblies through full-color photographs and illustrations. Topics include lead-free, component orientation and soldering criteria for through-hole, SMT and discrete wiring assemblies, mechanical assembly, cleaning, marking, coating, and laminate requirements. More Info on This Book Add to Cart
		Title : IPC-J-STD-001E: Requirements for Soldered Electrical & Electronic Assemblies (on CD) Author : IPC Description : J-STD-001E is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes. This revision includes support for lead free manufacturing, in addition to easier to understand criteria for materials, methods and verification for producing quality soldered interconnections and assemblies. The requirements for all three classes of construction are included. Full color illustrations are provided for clarity. This standard fully complements IPC-A-610E. Released April 2010. More Info on This Book Add to Cart
		Title : Symposium on Counterfeit Electronic Parts - West 2010 Proceedings Author : SMTA Description : SMTA and CALCE @ University of Maryland hosted the Symposium on Counterfeit Electronic Parts - West on June 8-11, 2010 at Honeywell Deer Valley in Phoenix, AZ. Presentations covered intellectual property enforcement, prevention and detection strategies, defense strategies, G19 activities, and counterfeit trends. The symposium was an overwhelming success with participation of part manufacturers, distributors, users, government and law enforcement agencies, legal professionals, authentication technology manufacturers, academic institutions, supply chain and brand protection professionals. More Info on This Book Add to Cart
		Title : RF and Microwave Microelectronics Packaging Author : Ken Kuang, Franklin Kim, and Sean S. Cahill (Eds.) Description : RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. More Info on This Book Add to Cart
		Title : Portable Consumer Electronics - Packaging, Materials and Reliability Author : Viswanadham Puligandla and Sridhar Canumalla Description : Portable consumer electronic devices have experienced exponential growth in recent years. Although the reliability implications and performance criteria of these products are significantly different from electronic hardware of the past, no single volume has covered the materials, design, and reliability aspects of these products until the publication of this new book. More Info on This Book Add to Cart
		Title : Wire Bonding in Microelectronics, 3rd Edition Author : George Harman Description : The definitive resource on the critical process of connecting semiconductors with their packages. Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more. More Info on This Book Add to Cart
		Title : Bob Willis Package on Package (PoP) STACK Package Assembly, Inspection & Rework interactive CD-ROM Author : Bob Willis Description : Available soon - preorder yours today! The industry's first PoP Package assembly interactive CD-ROM. Package on Package (PoP) applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers. In simple terms POP represents the stacking of components one on top of another either during the original component manufacture or during printed board assembly. As real estate is at a premium for logic and memory, PCB designers say the only way to go is up and up. POP packaging systems may include direct soldering, wire bonding or conductive adhesives for device to device interconnection. PoP is new to many contract and OEM assembly staff but with the demands of paste dipping, reflow warpage, increased placement accuracy/Z height control process introduction can be demanding. The difficulty in multi level ball inspection can be a challenge for x-ray equipment procedures as level one balls can mask level two and three interconnections. Manual inspection can be used but with these applications space is often not available for side viewing. More Info on This Book Add to Cart
		Title : SMTA Pan Pacific Microelectronics Symposium Proceedings on CD, 2010 Author : SMTA Description : The Annual Pan Pacific Microelectronics Symposium & Exhibit held January 26-28, 2010, Kauai, Hawaii, promoted international technical interchange and provided a premier forum for networking among industry professionals and business leaders around the world. Sponsored by the SMTA, the Symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems, nanotechnology, and assembly. More Info on This Book Add to Cart
		Title : SMTA Symposium on Avoiding, Detecting, and Preventing Counterfeit Electronic Parts Proceedings 2009 Author : SMTA Description : SMTA and CALCE @ University of Maryland hosted the 3rd Annual Symposium on Avoiding, Detecting, and Preventing Counterfeit Electronic Parts on December 2-3, 2009 at the University of Maryland, College Park, MD. All of the symposia were overwhelming successes with participation of part manufacturers, distributors, users, government and law enforcement agencies, legal professionals, authentication technology manufacturers, academic institutions, supply chain and brand protection professionals. Going beyond anecdotes and examples of counterfeit parts, this symposium focuses on the solutions that are available and are under development by all sectors of the industry. Topics include: Electronic parts supply chain Sources of counterfeit parts Proven methodologies for reducing chances of being victims of counterfeit parts Supply chain management tools to mitigate counterfeit part risks Inspections tools and techniques for detecting counterfeit parts Authentication techniques for securing electronic part supply chain Trade and business issues adopted by industry Law enforcement and international cooperation More Info on This Book Add to Cart
		Title : Advanced MEMS Packaging Author : John Lau, Cheng Kuo Lee, C.S. Premachandran, and Yu Aibin Description : Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packaging. This authoritative guide presents cutting-edge MEMS (microelectromechanical systems) packaging techniques, such as low-temperature C2W and W2W bonding and 3D packaging. More Info on This Book Add to Cart
		Title : Bob Willis Package on Package (PoP) Inspection & Process Defects wall charts Author : Bob Willis Description : A set of 20 colour wall charts available covering inspection and quality control in Package on Package (PoP) assembly. The charts were produced to accompany the "Package on Package (PoP) STACK Package Assembly, Inspection & Rework Workshops" organised in Europe. The photographic poster guide is ideal reference source in your organisation and is provided as an Acrobat pdf file. The individual sheets can be printed at A4 for bench top reference or as A3 colour posters for display for operator reference or as a training aid. More Info on This Book Add to Cart
		Title : Bob Willis Package on Package (PoP) STACK Package Assembly Photo CD-ROM Author : Bob Willis Description : Photo CD-ROMs provide process, quality engineers, marketing or editorial staff with a unique source of photographs which may be used in company inspection documents, technical presentations and web sites. The photographs can also be used in marketing and advertising material or in technical articles. They may be simply pasted into any Word or PowerPoint document for in house company use. Photographs on the CD may be provided in .jpg or .Tiff file format. The PoP Photo CD-ROM contains over 380 images. More Info on This Book Add to Cart
		Title : SMTA International Wafer-Level Packaging Conference (IWLPC) Proceedings on CD, 2009 Author : SMTA Description : Sponsored jointly by the SMTA and Chip Scale Review magazine, the 6th annual IWLPC addressed cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages. The conference took place October 27-30, 2009 at the Marriott Hotel in Santa Clara, CA. More Info on This Book Add to Cart
		Title : SMTA/MEPTEC Medical Electronics Symposium Day 2 Proceedings on CD, 2009 Author : SMTA/MEPTEC Description : The medical electronics industry is a dynamic and evolving industry that consists of many technology and market segments. The evolvement of technology and market segments are due to the close working relationships between the private sector, universities, local, state, federal and international governments. This allows the medical electronics technology to be a vibrant and interactive technical community. This symposium will include the market's current and future outlooks, regulatory requirements, legal perspectives, components, reliability, trends, initiative projects and advanced applications. More Info on This Book Add to Cart
		Title : SMTA International Conference Proceedings on CD, 2009 Author : SMTA Description : Come. Focus. This is your reference source for electronics assembly, lead-free, SMT, RFID, process control, flip chip, chip scale, BGA, RoHS compliance, automotive, and more... you'll find the electronic interconnection solutions you need, because this proceedings is dedicated to surface mount, advanced packaging, and related technologies and business operations. The CD also includes papers from the AIMS Harsh Environment Electronics Symposium. More Info on This Book Add to Cart
		Title : Materials for Advanced Packaging Author : Daniel Lu and C.P. Wong Description : Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. Materials for Advanced Packaging provides a comprehensive review on the most recent developments in advanced packaging technologies including emerging technologies such as 3 dimensional (3D), nanopackaging, and biomedical packaging with a focus on materials and processing aspects. More Info on This Book Add to Cart
		Title : Solder Joint Technology Materials, Properties, and Reliability Author : King-Ning Tu Description : Solder joints are ubiquitous in electronic consumer products. With the European Union’s directive to ban the use of lead-based (Pb) solders in these products, there is an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. This book offers a thorough examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems. More Info on This Book Add to Cart
		Title : Conformal Coating - Application, Inspection, Rework, and Quality Control Author : Bob Willis Description : This CD-ROM provides a simple guide to the use of coatings, their application processes, product benefits, inspection and quality control. A practical interactive defect guide also allows users to see defect coating application and user defects. A unique feature of the interactive disk is engineers answering the most common questions on coating processes, process defects and quality control in manufacture. This section features six experts on coating from around the world and also contributors to national and international standards on coating with IEC and IPC. More Info on This Book Add to Cart
		Title : Bob Willis Conformal Coating Photo Album CD-ROM Author : Bob Willis Description : This CD-ROM is one of a series of photo albums and provides the process or quality engineer with a supply of photographs which may be used for company inspection documentation or training presentations. The photographs can also be used in marketing and advertising material or in technical articles provided the source is credited. They can be simply pasted into any Word or PowerPoint document for in-house company use. Photographs are provided in either .Tiff or .jpg file format. The images are not all one resolution but a mixture of high and low resolution. More Info on This Book Add to Cart
		Title : Third International Symposium On Tin Whiskers 2009 Proceedings on CD Author : SMTA Description : This symposium, held on June 23-24, 2009 at the Technical University Of Denmark, Lyngby, Denmark covered case histories, theories of tin whisker growth, experiments and results, risk evaluation methods, and risk mitigation strategies. Papers cover the current state of knowledge regarding tin whisker growth, risk, and mitigation strategies, enabling the development of improved and effective qualification and mitigation procedures. More Info on This Book Add to Cart
		Title : SMTA International Conference on Soldering & Reliability Proceedings on CD, 2009 Author : SMTA Description : This CD-ROM features the proceedings from the technical program at the International Conference on Soldering & Reliability, held May 20-22, 2009, at the Crowne Plaza Hotel, Toronto, Ontario, Canada. The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics for industrial, aerospace and automotive applications have kept the material, process and quality engineers busy planning for the future. Process optimizations for manufacturing and repair, as well as mixed alloy soldering have become important areas of study. New solder alloys, as well as a return to vapor phase soldering, lead-free HASL, and cleaning provide topics for renewed understanding. Finally, the proposed changes to the restrictions on hazardous substances, and the upcoming REACH initiative will be covered. More Info on This Book Add to Cart
		Title : Wafer Level 3-D ICs Process Technology Author : Chuan Seng Tan, Ronald J. Gutmann, and Rafael L. Reif Description : Wafer Level 3-D ICs Process Technology focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses alternative technology platforms for pre-packaging wafer level 3-D ICs, with an emphasis on wafer-to-wafer stacking. Driven by the need for improved performance, a number of companies, consortia and universities are researching methods to use short, monolithically-fabricated, vertical interconnections to replace the long interconnects found in 2-D ICs. Stacking disparate technologies to provide various combinations of densely-packed functions, such as logic, memory, MEMS, displays, RF, mixed-signal, sensors, and power delivery is potentially possible with 3-D heterogeneous integration, making this technology the "Holy Grail" of system integration. More Info on This Book Add to Cart
		Title : Bob Willis Conformal Coating Photographic Poster Guide Author : Bob Willis Description : The 15 page colour poster guide is available at ASKbobwillis.com and was originally produced to accompany our workshops run jointly with ITRI in St Albans, England. The photographic guide is ideal as a reference source for operators, inspection and training departments in your organisation and is provided as an Acrobat pdf file. The individual sheets can be printed as A4 for bench top reference or as A3 colour posters for reference in manufacture. Alternatively they can be viewed on a PC with each page featuring three images illustrating points to examine or steps in the inspection process. Currently the guide features 10 individual pages for on site printing and display. More Info on This Book Add to Cart
		Title : Bob Willis Counterfeit Component Photographic Guide Poster Set Author : Bob Willis Description : The 28 page colour guide is available at ASKbobwillis.com and was originally produced to accompany the "Practical Failure Analysis Workshops" run jointly with ITRI in St Albans. The photographic guide is ideal as a reference source to reduce the impact of counterfeit components on your organisation and is provided as an Acrobat pdf file. The individual sheets can be printed at A4 for bench top reference or as A3 colour posters for reference at goods receipt inspection and can be updated with new samples provided for inclusion or new test methods and procedures. More Info on This Book Add to Cart
		Title : Profiling Guide for Profitability Author : Mike Limberg and Brian O'Leary Description : Learn Smart Profiling for Tough Times. This guide is meant as a brief, concise guide to profiling, while knowing that for many, the reflow oven continues to be a "black box." The status quo is no longer an option, especially during this economic downturn. Resources have been spread thin and those of us with knowledge are far and few between. The reflow process continues to bleed operations of precious time and money. Decoding the reflow process is not only important, it is essential for survival these days. Discover how to: Characterize your Facility Characterize your Reflow Oven and Thermocouples Measure, Define & Improve your Reflow Process Find out what is new in Automation, Thermocouple Attachment Methodology and Materials More Info on This Book Add to Cart
		Title : SMTA Pan Pacific Microelectronics Symposium Proceedings on CD, 2009 Author : SMTA Description : The Annual Pan Pacific Microelectronics Symposium & Exhibit that was held February 10-12, 2009, at the Hapuna Beach Prince Hotel on the Big Island of Hawaii, promoted international technical interchange and provided a premier forum for extensive networking among industry professionals and business leaders throughout the world. Sponsored by the SMTA, the Symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems, nanotechnology, and assembly. More Info on This Book Add to Cart
		Title : Solder Joint Reliability Prediction for Multiple Environments Author : Andrew E. Perkins and Suresh K. Sitaraman Description : Solder Joint Reliability Prediction for Multiple Environments provides industry engineers, graduate students, academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries. More Info on This Book Add to Cart
		Title : Semiconductor Manufacturing Handbook Author : Hwaiyu Geng Description : This handbook will provide engineers with the principles, applications, and solutions needed to design and manage semiconductor manufacturing operations. Consolidating the many complex fields of semiconductor fundamentals and manufacturing into one volume by deploying a team of world class specialists, it allows the quick look up of specific manufacturing reference data across many subdisciplines. More Info on This Book Add to Cart
		Title : Design for Six Sigma 2nd Ed. Author : Kai Yang and Basem S. El-Haik Description : The Latest Tools and Guidance Needed to Implement Design for Six Sigma in New Product and Service Development! The Second Edition of this indispensable design tool retains the core of the previous edition, while adding new information on innovation, lean product development, incomplete DOE, mixture experiments, and alternative DFSS roadmaps—plus new thread-through case studies. From quality concepts and DFSS fundamentals…to DFSS deployment and project algorithm…to design validation, the updated edition of Design for Six Sigma gives you a solid understanding of the entire process for applying DFSS in the creation of successful new products and services. More Info on This Book Add to Cart
		Title : Bob Willis Flip Chip Assembly & Defect Photo CD-ROM Author : Bob Willis Description : The flip chip CD ROM provides the process or quality engineer with a source of photographs of assembly process, flip chip components and process defects which may be used in company inspection document or training presentations. They may be simply pasted into any document for in house company use. Over 230 photographs are provided as a .jpg or .Tiff file format. Includes some x-ray and underfill process examples and defects. More Info on This Book Add to Cart
		Title : Bob Willis LGA/QFN Design, Assembly, Rework & Defect Guide Author : Bob Willis Description : If you are using PowerPoint for training or technical sales presentations and need to illustrate the conventional, surface mount & LGA/QFN assembly process stages this CD-ROM is for you. The CD features three presentations: LGA/QFN Design and Assembly Process Conventional through hole assembly Surface mount and mixed technology assembly stages Changes for lead-free production More Info on This Book Add to Cart
		Title : Green Electronics Design and Manufacturing Author : Sammy G. Shina Description : This state-of-the-art resource brings together contributions by a team of experts from the total electronics supply chain who show how to master the strategy, design, test and implementation issues of meeting global environmental regulations. More Info on This Book Add to Cart
		Title : Introduction to System-on-Package (SOP) Author : Rao Tummala and Madhavan Swaminathan Description : System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges. More Info on This Book Add to Cart
		Title : MEMS and Nanotechnology-Based Sensors and Devices for Communications, Medical and Aerospace Applica Author : A.R. Jha, Ph.D. Description : The integration of microelectromechanical systems (MEMS) and nanotechnology (NT) in sensors and devices significantly reduces their weight, size, power consumption, and production costs. These sensors and devices can then play greater roles in defense operations, wireless communication, the diagnosis and treatment of disease, and many more applications. This book presents the latest performance parameters and experimental data of state-of-the-art sensors and devices. It describes packaging details, materials and their properties, and fabrication requirements vital for design, development, and testing. Some of the cutting-edge materials covered include quantum dots, nanoparticles, photonic crystals, and carbon nanotubes (CNTs). More Info on This Book Add to Cart
		Title : Mechanical Design of Electronic Systems Author : James Dally, Pradeep Lall, and Jeffrey Suhling Description : This book has been written for engineers to serve as a first text on the packaging of electronic systems. The material has been written for an engineering student or for a practicing professional working as a mechanical or electrical engineer with a company producing electronic products or systems. The engineering student should have completed fundamental courses in the engineering sciences, thermal sciences and materials as prerequisites. The practicing professional will probably be at the early stages of his or her career and be more concerned with the technical details of the design rather than the business strategy of a product line. More Info on This Book Add to Cart
		Title : Find It. Book It. Grow It. Author : Susan Mucha Description : In this new book, Susan E. Mucha explores in great detail the entire account acquisition process of companies in the electronics manufacturing service (EMS) industry. EMS companies face the challenges of a 12- to 18-month sales cycle, low margins and geographically scattered customer bases. Growing the business requires a differentiation strategy and a focused process for maintaining mindshare within a diverse target market. Susan Mucha maps the process of building a differentiated brand while creating a repeatable, consistent sales process, and addresses strategies for account retention and growth. More Info on This Book Add to Cart
		Title : RFID Handbook: Applications, Technology, Security, and Privacy Author : Syed Ahson and Mohammad Ilyas Description : Radio Frequency Identification (RFID) tagging is now used by the department of defense and many of the world’s largest retailers including Wal-Mart. As RFID continues to infiltrate industries worldwide, organizations must harness a clear understanding of this technology in order to maximize its potential and protect against the potential risks it poses. The RFID Handbook provides an overview of RFID technology, its associated security and privacy risks, and recommended practices that will enable organizations to realize productivity improvements while also protecting sensitive information and the privacy of individuals. More Info on This Book Add to Cart
		Title : Embedded Core Design with FPGAs Author : Zainalabedin Navabi, Ph.D. Description : A landmark guide in digital system design, Embedded Core Design with FPGAs equips today's computer engineers with everything they need to design embedded cores and apply those cores in a state-of-the-art embedded system. This practical resource brings together logic design, computer architecture, Verilog, FPGAs, Hardware/Software design, and SoCs, explaining how engineers can draw on their computer engineering background to achieve cutting-edge embedded designs. Renowned design expert and educator Zainalabedin Navabi first covers the basics of logic design, RT Level Verilog, computer architectures, and the architecture of modern field programmable devices. He then explores the design of utility cores that are used for high-level core-based designs, with specific focus on existing Altera cores. Finally, he describes higher-end design methodologies, including design of hardware/software systems, CPU configurations, embedded systems, and the utilization of various Altera Nios II processors. More Info on This Book Add to Cart
		Title : Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing Author : E. Bradley, C. Handwerker, J. Bath, R. Parker, and R. Gedney, (Editors) Description : Reflecting the results of a two-year study undertaken by a cross-section of some of the largest North American electronic equipment manufacturers, this book provides full coverage of the issues surrounding the implementation of lead-free solder into electric board assembly. Additionally, fully documented book chapters with references to existing published work in the area make this an invaluable reference for the countless engineers and companies faced with making the switch to lead-free electronics. More Info on This Book Add to Cart
		Title : Right The First Time- A Practical Handbook on High Speed PCB and System Design volume 2 Author : Lee W. Ritchey Description : This is the second volume in a two-part series. While Volume 1 of "Right the First Time, A Practical Handbook on High Speed PCB and System Design," addressed the fundamentals, this book provides a detailed explanation of the steps involved in designing and manufacturing a printed circuit board that works right the first time. This book has been designed to provide engineering professionals, as well as business decision makers, a thorough treatment on the process of fabricating complex PCBs including a detailed description of the PCB fabrication process; PCB materials selection; EMI and EMC; Gigabit and higher signaling issues; the PCB design process; power delivery details; testing, simulation and simulators, and IC package design. As with Volume 1, this book also contains an extensive glossary of terms, their definitions and their use relative to high-speed design. More Info on This Book Add to Cart
		Title : Integrated Circuit Packaging, Assembly and Interconnections Author : William J. Greig Description : Integrated Circuit Packaging, Assembly and Interconnections is intended as a multi-purpose text, serving individuals looking for an introduction, a review or an update. To this end, it provides an overview of materials and the processes, as well as trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. More Info on This Book Add to Cart
		Title : Business Innovation in the 21st Century Author : Praveen Gupta Description : The Business Innovation book, with Foreword by Dipak Jain, Dean, Kellogg School of Management, provides a framework for process of innovation in corporations for introducing new products, services, or solutions faster. Features -- Powerful new framework called Brinnovation™; Types of innovation: Fundament, Platform, Derivative, and Variation; Management of Innovation; Measures of innovation. Table of Contents -- Part I. Evolving Innovation -- History, Tools, creativity, innovation on demand; Part II. Understanding Innovation -- Brain processes, Framework, Deployment, Measures; Part III. Institutionalizing Innovation -- Service, Protecting, Commercializing, and Managing Innovation; Wisdom of Innovation by Bob Galvin, Former Chairman/CEO of Motorola.** To receive bulk discount, or purchase hardcover version, please visit www.accelper.com. More Info on This Book Add to Cart
		Title : Virtually Stat Free Six Sigma: Focusing on Intent for Quick Results Author : Praveen Gupta Description : Stat Free Six Sigma has been written to ease implantation of Six Sigma by minimizing statistics, and to achieve great results through innovative application. Unique features of the book include: No cumbersome statistics, hypothesis testing, and statistics tables; Stat Free DMAIC Tool Matrix; and Key Executive Tools. To order multiple copies, or receive bulk discount, please visit www.accelper.com. More Info on This Book Add to Cart
		Title : Lead-Free Soldering Author : Jasbir Bath Description : This book aims to give the latest information on development of the lead-free soldering materials and processes and identify where more work is needed. The chapters of the book describe legislation, alloys, reflow, wave, rework, reliability, backward and forward process compatibility, PCB surface finishes and PCB laminates, and standards affecting the general lead-free soldering arena. More Info on This Book Add to Cart
		Title : SMTA Six Sigma/Green Belt Certification Study Guide Author : Ronald Lasky, Phil Zarrow, and W. James Hall Description : Six Sigma/Green Belt Certification Study Guide More Info on This Book Add to Cart
		Title : SMTA Processes Certification Study Guide Author : Ronald Lasky, Phil Zarrow, and W. James Hall Description : SMT Procceses Certification Study Guide More Info on This Book Add to Cart
		Title : SMTA/TMAG Testability Guidelines TP-101D (Single-user Electronic PDF) Author : SMTA/TMAG Task Forces Description : The SMTA Testability Guidelines TP-101D were developed by various Task Forces, each concentrating on its own discipline. The work of the various Task Forces is featured as separate chapters. A general format applies to each task force, and it was intended to assist the reader in dealing with the testability considerations that need to go into the design, development, and test of a product. Each chapter begins with an introduction intended to put into perspective the enumerated guidelines that follow. Site licenses are available for multiple users to access the SMTA Testability Guidelines electronically. More Info on This Book Add to Cart
		Title : IPC-A-610E: Acceptability of Electronic Assemblies (on CD-ROM) Author : IPC Description : A must for all quality assurance and assembly departments, IPC-A-610E illustrates industry-accepted workmanship criteria for electronics assemblies through full-color photographs and illustrations. Topics include lead-free, component orientation and soldering criteria for through-hole, SMT and discrete wiring assemblies, mechanical assembly, cleaning, marking, coating, and laminate requirements. More Info on This Book Add to Cart
		Title : IPC-J-STD-001E: Requirements for Soldered Electrical & Electronic Assemblies (Hard Copy) Author : IPC Description : J-STD-001E is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes. This revision includes support for lead free manufacturing, in addition to easier to understand criteria for materials, methods and verification for producing quality soldered interconnections and assemblies. The requirements for all three classes of construction are included. Full color illustrations are provided for clarity. This standard fully complements IPC-A-610E. Released April 2010. More Info on This Book Add to Cart