3D Microelectronic Packaging: From Fundamentals to Applications -  Yan Li and Deepak Goyal
This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.

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  Materials for Advanced Packaging - Second Edition -  Daniel Lu and C.P. Wong
This second edition continues to be the most comprehensive review on the developments in advanced packaging technologies. Experts in the field discuss established techniques, as well as emerging technologies, to provide readers with the most up-to-date developments in advanced packaging. Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field. New chapters have also been added on fast growing and emerging applications such as flexible and printed electronics, materials solutions to enable next generation thinner/lighter/more functional mobile devices, and functional coating for electronic devices such as anti-fingerprint coating, anti-scratch coating, and more. This book is ideal for professionals in semiconductor, digital health, and bio-medical areas as well as graduate students studying materials science and engineering.

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  SMTA Pan Pacific Microelectronics Symposium Proceedings 2017 -  SMTA
The 22nd Annual Pan Pacific Microelectronics Symposium which took place February 6-9, 2017 at the Sheraton Kauai Resort on Kauai, Hawaii was well received by attendees from North America, Asia, and Europe. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world. More than 50 papers from the technical program are available in the proceedings. In addition to several inspiring keynotes, this program features ground-breaking research from global experts on advanced processes, design, embedding and Fan-Out packaging, interposer technology, materials, nanotechnology, quality, reliability, roadmaps and manufacturing strategies.

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  SMTA International Wafer-Level Packaging Conference (IWLPC) 2016 Proceedings Download -  SMTA
Sponsored jointly by the SMTA and Chip Scale Review magazine, the 13th annual IWLPC addressed cutting edge topics in 3 key technology tracks: Wafer-Level, 3D, and MEMS packaging. The proceedings contain over 50 technical papers from leading experts in the advanced packaging industry. The conference took place October 18-20, 2016 at the DoubleTree by Hilton San Jose Hotel.

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  SMTA International Conference Proceedings 2016 -  SMTA
The SMTA International Conference Proceedings contain the latest and highest quality information and research on electronics assembly, lead-free, SMT, Package-on-Package, process control, Embedded Actives/Passives, 3D/TSV, Printed Electronics, and more... You can download over 130 papers from all sessions at SMTA International held September 25 - 29, 2016 in Rosemont, Illinois, including the AIMS/Harsh Environments Symposium, the Lead-Free Soldering Technology Symposium, and the Emerging Technologies Summit.

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  Mitigating Tin Whisker Risks: Theory and Practice -  Takahiko Kato, Carol Handwerker, Jasbir Bath
This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described.

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  Printed Circuits Handbook, 7th Edition -  Clyde Coombs, Jr.
The Printed Circuits Handbook has served as the definitive source for coverage of every facet of printed circuit boards and assemblies for 50 years. And now, for the first time anywhere, the new edition of this essential guide provides time-saving tools for success in the area of printed circuit supply chain management, including an entire new section on the elements of design, supplier identification and qualification, process control, product acceptance processes, and quality and reliability specification and assurance.

Written by a team of experts from around the world including 12 SMTA members, this encyclopedic resource has been thoroughly revised and expanded to include the latest printed circuit tools and technologies - from design to fabrication. Hundreds of illustrations and charts demonstrate key concepts, and valuable tables provide quick and easy access to essential information.

This new edition of the most trusted guide to printed circuits includes:

  • Introduction to Printed Circuits
  • Supply Chain Management
  • Lead-Free Materials and Processes
  • Engineering and Design of Printed Circuits
  • Base Materials for All Applications
  • Fabrication Processes
  • High Density Interconnection
  • Bare Board Testing
  • Assembly Processes
  • Soldering Materials and Processes
  • Non-Solder Interconnection
  • Quality Specification and Assessment
  • Reliability Prediction and Assessment
  • Assembly Testing
  • Repair and Rework
  • Flexible Circuits
  • and Much More

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      SMTA Pan Pacific Microelectronics Symposium Proceedings 2016 -  SMTA
    The 21st Annual Pan Pacific Microelectronics Symposium which took place January 25-28, 2016 at the Hapuna Beach Prince Resort on the Big Island of Hawaii was well received by attendees from North America, Asia, and Europe. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world. More than 50 papers from the technical program are available in the proceedings. Session topics ranged from 3D/Heterogeneous Integration and Nano-Technology to Wearable Electronics and Internet of Things (IoT).

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      SMTA International Conference Proceedings 2015 -  SMTA
    This is your source for the latest and highest quality information and research on electronics assembly, lead-free, SMT, Package-on-Package, process control, Embedded Actives/Passives, 3D/TSV, Printed Electronics, and more... You can download over 130 papers from all sessions at SMTA International held September 27 - October 1, 2015 in Rosemont, Illinois, including the AIMS/Harsh Environments Symposium, the Lead-Free Soldering Technology Symposium, and the Evolving Technologies Summit.

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      Handbook for Critical Cleaning, Second Edition - 2 Volume Set -  Barbara Kanegsberg and Edward Kanegsberg
    NOTE: This set consists of two volumes: Cleaning Agents and Systems and Applications, Processes, and Controls

    Should you clean your product during manufacturing? If so, when and how? Cleaning is essential for proper performance, optimal quality, and increased sales. Inadequate cleaning of product elements can lead to catastrophic failure of the entire system and serious hazards to individuals and the general public.

    A decade after the bestselling original, the Handbook for Critical Cleaning, Second Edition helps manufacturers meet today's challenges, providing practical information and perspective about cleaning chemistries, equipment, processes, and applications. With 90% new or revised chapters plus supplementary online material, the handbook has grown into two comprehensive volumes, Cleaning Agents and Systems and Applications, Processes, and Controls.

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      SMTA International Conference on Soldering & Reliability Proceedings Download, 2015 -  SMTA
    The proceedings from the technical program at the International Conference on Soldering & Reliability, held May 19-21, 2015, at the Hilton Markham Suites in Markham, ON, Canada are now available for download. The technical conference featured 28 presentations on topics including lead-free solders, materials as different as graphene, nanofibers and coatings, stencils for disparate-sized components, and prevention of defects like tin whiskers and head-in-pillow. Speakers represented companies including BAE Systems, Celestica, Creation Technologies, Intel Corporation, Jabil Circuit, Rockwell Collins, Verdant Electronics, and schools including University of Singapore, University of Waterloo, University of Toronto, and SUNY Binghamton.

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      Three-Dimensional Molded Interconnect Devices (3D MID) -  Jörg Franke
    Three-dimensional molded interconnect devices (MID) enable mechanical, electronic, optical, thermal and fluidic functions to be integrated into injection-molded components. This book offers a comprehensive insight into the state of the art in 3D-MID technology along the entire process chain. Individual chapters, moreover, deal with systematics of targeted development of MID parts and explore, with a dozen and more successful series-production applications as examples, the widely diverse fields of application for MID technology.

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      iNEMI 2015 Roadmap on USB -  iNEMI
    The 2015 iNEMI Roadmap is now available for sale in the SMTA BookStore. As the only industry roadmap that looks at the entire supply chain, the iNEMI Roadmap delivers in-depth information about the challenges and opportunities facing the electronics manufacturing industry over the next 10 years. It also provides direction regarding the technologies required to meet the ever-evolving needs of this rapidly diversifying and growing industry.

    This latest edition encompasses 24 chapters and more than 1,900 pages that look at five product sectors and 19 technology areas. It was developed by approximately 500 individuals from at least 20 countries, and representing more than 280 corporations, consortia, government agencies and universities. Market forecast data was provided by IHS Technology this cycle. A regional workshop held in the U.S. plus webinars targeting Europe and Asia allowed us to get valuable input to be sure that regional concerns and issues were included in the roadmap. As a result of these proactive efforts, the 2015 Roadmap included participants from at least 20 countries.

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      SMTA Pan Pacific Microelectronics Symposium Proceedings 2015 -  SMTA
    The 20th Annual Pan Pacific Microelectronics Symposium which took place February 2-5, 2015 at the Sheraton Poipou Resort in Kauai, Hawaii was well received by attendees from North America, Asia, and Europe. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world. More than 50 papers from the technical program are available in the proceedings. Session topics ranged from Power Electronics and Nano-Technology to Wearable Electronics and 2.5/3D Interposers.

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      SMTA International Wafer-Level Packaging Conference (IWLPC) 2014 Proceedings on USB Flash Drive -  SMTA
    Sponsored jointly by the SMTA and Chip Scale Review magazine, the 11th annual IWLPC addressed cutting edge topics in 3 key technology tracks: Wafer-Level, 3D, and MEMS packaging. The proceedings contain over 50 technical papers from leading experts in the advanced packaging industry. The conference took place November 11-13, 2014 at the DoubleTree San Jose Airport Hotel.

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      SMTA/MEPTEC/iNEMI Medical Electronics Symposium 2014 Proceedings on USB -  SMTA
    In 2014 INEMI, MEPTEC, and SMTA joined forces to host the Medical Electronics Symposium September 18-19, 2014 in Portland, Oregon. The presentations focus on advances in electronic technologies and advanced manufacturing, specifically targeting medical and bioscience applications. The symposium covered three tracks: Components and Designs for Higher Density Functionalities, Solutions for Best-in-Class Assembly and Volume Manufacturing, and Next Generation Microelectronics for Changing Healthcare Markets. Over 30 presentations are included in the proceedings.

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      Adhesion in Microelectronics -  K. L. Mittal and Tanweer Ahsan
    This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Topics covered in the book include various theories or mechanisms of adhesion, surface (physical or chemical) characterization of materials as it pertains to adhesion, surface cleaning as it pertains to adhesion, ways to improve adhesion, unraveling of interfacial interactions using an array of pertinent techniques, characterization of interfaces / interphases, polymer-polymer adhesion, metal-polymer adhesion (metallized polymers), polymer adhesion to various substrates, adhesion of thin films, underfills, molding compounds, and different dielectric materials, delamination and reliability issues in packaged devices, interface mechanics and crack propagation, and adhesion measurement of thin films and coatings.

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      SMTA International Conference Proceedings on USB, 2014 -  SMTA
    This is your source for the latest and highest quality information and research on electronics assembly, lead-free, SMT, Package-on-Package, process control, Embedded Actives/Passives, 3D/TSV, Printed Electronics, conflict minerals, and more... The flash drive includes over 130 papers from all sessions at SMTA International held September 28 - October 2, 2014 in Rosemont, Illinois, including the AIMS/Harsh Environments Symposium, the Lead-Free Soldering Technology Symposium, and the Evolving Technologies Summit.

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      Bob Willis High Temperature Soldering Inspection and Defect Wall Charts -  Bob Willis
    A set of 15 colour wall charts available covering inspection and process defects in High Temperature assembly. The photographic poster guide is ideal reference source in your organisation and is provided as an Acrobat pdf file. The individual sheets can be printed at A4 for bench top reference or as A3 colour posters for display for operator reference or as a training aid. The posters cover different solder alloys through hole and selective soldering to leads and chip terminations.

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      Bob Willis High Temperature Soldering and Assembly Photo Album -  Bob Willis
    The HT Photo Album provide process, quality engineers, marketing or editorial staff with a unique source of photographs which may be used in company inspection documents, technical presentations and web sites. The photographs can also be used in marketing and advertising material or in technical articles. They may be simply pasted into any Word or PowerPoint document for in house company use. Photographs on the CD are normally provided in .jpg format. This Photo CD-ROM contains over 100 images including through hole and surface mount solder joints, microsections, x-ray images, conformal coating and the different types of process failures that may be found during assembly and equipment operation.

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      SMTA International Conference on Soldering & Reliability Proceedings on CD, 2014 -  SMTA
    This CD-ROM features the proceedings from the technical program at the International Conference on Soldering & Reliability, held May 13-15, 2014, at the Four Points by Sheraton Toronto Airport Hotel in Toronto, ON, Canada. There are 25 technical papers on topics ranging from Tin Whisker testing and micro-Alloying to Bottom Termination Component voiding and High Temperature, High Reliability lead-free solder issues. Research was compiled from a variety of companies including Alpha, BAE International, BlackBerry, Celestica Inc., DfR Solutions, IBM Corporation, Indium Corporation, Kyzen Corporation, Nihon Superior Company, Ltd, Rockwell Collins, Universal Instruments Corporation, several renowned universities, and more.

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      SMTA/TMAG Testability Guidelines TP-101E (Single-user Electronic PDF) -  SMTA/TMAG Task Forces
    Although test has always been thought of as a necessary evil, in reality it is the single best way to ensure that a product meets the needs of your customer. Throughout the development process test is used to reduce the risk that the design, theory, and final product, reality, are as close to each other as possible. The SMTA Testability Guidelines TP-101D were developed by various Task Forces, each concentrating on its own discipline. The work of the various Task Forces is featured as separate chapters. The Guidelines were intended to assist the reader in dealing with the testability considerations that need to go into the design, development, and test of a product.

    Site licenses are available for multiple users to access the SMTA Testability Guidelines electronically.

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      Handbook of Electronic Assembly and A Guide to SMTA Certification -  Professor Ronald Lasky, PhD, PE, W. James Hall, Katherine Hickey, Jennifer Tate, PhD
    Originally conceived as a supplement to the SMTA Certification Program, this book is a must-have reference manual for all process engineers working in the electronics industry as well as anyone just entering the industry. The book provides an in-depth understanding of the entire electronic assembly process. Chapter topics include soldering and materials, printed wiring boards, components, paste-print stencil, component placement, assembly line design and optimization, solder reflow, wave soldering, dispensing, and inspection and test.

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      Introduction to Printed Electronics -  Katsuaki Suganuma
    This book describes in detail modern technologies for printed electronics, explaining how nanotechnology and modern printing technology are merging to revolutionize electronics fabrication of thin, lightweight, large, and inexpensive products. Readers will benefit from the explanations of materials, devices and circuits used to design and implement the latest applications of printed electronics, such as thin flexible OLED displays, organic solar cells, OLED lighting, smart wallpaper, sensors, logic, memory and more.

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      SMTA Pan Pacific Microelectronics Symposium Proceedings on CD, 2014 -  SMTA
    The 19th Annual Pan Pacific Microelectronics Symposium that took place February 11-13, 2014, at the Hapuna Beach Prince Resort on the Big Island of Hawaii was well received by attendees from North America, Asia, and Europe. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world. More than 50 papers from the technical program are featured here. Topics included Interposers, Roadmaps and Industry Trends, Embedded Assemblies, Assembly Challenges, 3D and TSV Technologies, Prognostics and Health Management, Business Strategies, Power Electronics, Reliability and Failure Analysis, Manufacturing Paradigms, Statistics and Probability, Connection Taxonomy, Simulation and Modeling.

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      Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs -  Brandon Noia and Krishnendu Chakrabarty
    This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.

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      Factors Governing Tin Whisker Growth -  Erika Crandall
    This thesis is designed to clarify and control the fundamental mechanisms that govern whisker formation. The research focuses on reproducible "laboratory" created whiskers under a variety of rigorously controlled environmental factors such as film thickness, film stress, substrate material, gas environment, and humidity exposure, which are known to play a significant role in whisker production. The ultimate question of how to impede and/or prevent whisker growth is also addressed and shows that whisker prevention is possible via hard metal capping films, which are impenetrable by whiskers.

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      Extreme Environment Electronics -  John Cressler and H. Alan Mantooth
    Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics.

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      DfE OnlineTM (Single User License) -  Technology Forecasters Inc.

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      High Performance Electronics Assembly Cleaning Symposium Proceedings on CD 2008 -  SMTA/IPC
    The symposium, held on October 28-29, 2008 at the Crowne Plaza Chicago O'Hare in Rosemont, IL, focused on all classes of high reliability and high performance electronics assembly and included case studies from manufacturing experts in the aerospace and defense, automotive, consumer telecommunications, and medical products industries.

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      SMTA 3D/SiP Advanced Packaging Symposium Proceedings on CD, 2008 -  SMTA

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      SMTA International Conference on Soldering & Reliability Proceedings on CD, 2008 -  SMTA
    This CD-ROM features the proceedings from the technical program at the International Conference on Soldering & Reliability, held May 13-16, 2008, at the Hilton Toronto Airport, Toronto, Ontario, Canada The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics for industrial, bio-medical, aerospace and automotive applications have kept the material, process and quality engineers busy planning for the future.

    The European Union’s directive on lead-free electronics which became a reality on July 1, 2006 complicates that with the variety of alloy choices, component compatibility and mixed-solder concerns.

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      SMTA Medical Electronics Symposium Proceedings on CD, 2008 -  SMTA
    The medical electronics industry is a dynamic and evolving industry that consists of many technology and market segments. The evolvement of technology and market segments are due to the close working relationships between the private sector, universities, local, state, federal and international governments. This allows the medical electronics technology to be a vibrant and interactive technical community. This symposium will include the market’s current and future outlooks, regulatory requirements, legal perspectives, components, reliability, trends, initiative projects and advanced applications.

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      Nano/Microscale Heat Transfer -  Zhuomin Zhang

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      Hermeticity of Electronic Packages -  Hal Greenhouse

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      Lead-Free Electronics -  Michael Pecht and Sanka Ganesan

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      Guide to Lead-Free Solders: Physical Metallurgy and Reliability -  John W. Evans (Author), Dong-il Kwon (Contributor), and Werner Engelmaier (Editor)

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      Practical Guide to X-Ray Inspection Criteria -  David Bernard and Bob Willis
    The Dage x-ray inspection guidebook provides x-ray images and information that can be used as a teaching aid and reference guide for anyone undertaking x-ray inspection of printed circuit board assemblies. The contents of the guidebook spans information on the theory and practice of x-ray inspection, voiding within BGA devices, inspection of area array packages, fine pitch devices, passive components, small active components and through-hole joints, as well as x-ray inspection criteria and commonly detectable defects.

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      The SMT Step by Step Collection 2006 -  PennWell Books

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      The Handbook of Manufacturing Engineering, Second Edition -  Richard Crowson

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      SMTA Medical Electronics Symposium Proceedings on CD, 2006 -  SMTA

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      Bob Willis Conventional/SMT & Lead-Free Assembly Process Animations (CD) -  Bob Willis
    If you are using PowerPoint for training or technical sales presentations and need to illustrate the conventional and surface mount assembly process stages, this CD-ROM is for you. The CD features three presentations:
  • Conventional through hole assembly
  • Surface mount and mixed technology assembly stages
  • Changes for lead-free production
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      Lead-Free Solder Interconnect Reliability -  Dongkai Shangguan (Editor)
    This book provides the most up-to-date knowledge and data available on the reliability of lead-free solder interconnects. The content has been written by leading experts working in this important technology area. Both fundamental research and practical considerations are addressed.

    Environmental regulations are driving the worldwide adoption of lead-free soldering technology for electronics packaging, board assembly, and related manufacturing operations. While a significant amount of research and development work has been conducted in recent years on manufacturing issues to enable the conversion to lead-free solders, data from studies related to the reliability of lead-free solder interconnects are still emerging.

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      MEMS/MOEMS Packaging: Concepts, Designs, Materials, and Processes -  Dr. Ken Gilleo
    While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS and MOEMS, and ultimately nano-electrical devices, is the development of appropriate packaging solutions for the protection, assembly, and long-term reliable operation.

    This book rigorously examines the properties of the materials used in MEMS and MOEMS assembly and then evaluates them in terms of their routing, electrical performance, thermal management, and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.

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