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Bob Willis LGA/QFN Design, Assembly, Rework & Defect Guide -
Bob Willis
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SMTA 3D/SiP Advanced Packaging Symposium Proceedings on CD, 2008 -
SMTA
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SMTA International Conference on Soldering & Reliability Proceedings on CD, 2008 -
SMTA
This CD-ROM features the proceedings from the technical program at the International Conference on Soldering & Reliability, held May 13-16, 2008, at the Hilton Toronto Airport, Toronto, Ontario, Canada The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics for industrial, bio-medical, aerospace and automotive applications have kept the material, process and quality engineers busy planning for the future.
The European Union’s directive on lead-free electronics which became a reality on July 1, 2006 complicates that with the variety of alloy choices, component compatibility and mixed-solder concerns. More Info...
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Green Electronics Design and Manufacturing -
Sammy G. Shina
This state-of-the-art resource brings together contributions by a team of experts from the total electronics supply chain who show how to master the strategy, design, test and implementation issues of meeting global environmental regulations.
Edited by the founder of the New England Lead-Free Consortium and filled with over 130 detailed illustrations, Green Electronics Design and Manufacturing features:
Guidance for lead-free conversions while maintaining quality and reliability for printed circuit board production and rework of surface mount technology and palted through holes Restriction of hazardous substances (RoHS) compliance for hex-chrome and future halogen free issues Detailed coverage of global environmental regulations and their impact on manufacturing and design processes Techniques for managing corporate strategy and project design teams for green products Proven methods for testing and analyzing green products Proven methods for dealing with the adverse results of green production such as tin whiskers and finish interactions More Info...
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Introduction to System-on-Package (SOP) -
Tummala, Rao and Swaminathan, Madhavan
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
Dr. Rao Tummala (Atlanta, GA) is Pettit Chair Professor and Director of the Packaging Research Center at Georgia Tech. He is a past-President of ISHM, an IEEE Fellow, and the General Chair of IEEE-ICTC. He was recently named by Industry Week as one of the 50 Stars in the US for improving national competitiveness. More Info...
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MEMS and Nanotechnology-Based Sensors and Devices for Communications, Medical and Aerospace Applica -
A.R. Jha, Ph.D.
The integration of microelectromechanical systems (MEMS) and nanotechnology (NT) in sensors and devices significantly reduces their weight, size, power consumption, and production costs. These sensors and devices can then play greater roles in defense operations, wireless communication, the diagnosis and treatment of disease, and many more applications.
This book presents the latest performance parameters and experimental data of state-of-the-art sensors and devices. It describes packaging details, materials and their properties, and fabrication requirements vital for design, development, and testing. Some of the cutting-edge materials covered include quantum dots, nanoparticles, photonic crystals, and carbon nanotubes (CNTs). More Info...
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Mechanical Design of Electronic Systems -
Dally, James; Lall, Pradeep; and Suhling, Jeffrey
This book has been written for engineers to serve as a first text on the packaging of electronic systems. The material has been written for an engineering student or for a practicing professional working as a mechanical or electrical engineer with a company producing electronic products or systems. The engineering student should have completed fundamental courses in the engineering sciences, thermal sciences and materials as prerequisites. The practicing professional will probably be at the early stages of his or her career and be more concerned with the technical details of the design rather than the business strategy of a product line. More Info...
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Find It. Book It. Grow It. -
Susan Mucha
In this new book, Susan E. Mucha explores in great detail the entire account acquisition process of companies in the electronics manufacturing service (EMS) industry. EMS companies face the challenges of a 12- to 18-month sales cycle, low margins and geographically scattered customer bases. Growing the business requires a differentiation strategy and a focused process for maintaining mindshare within a diverse target market. Susan Mucha maps the process of building a differentiated brand while creating a repeatable, consistent sales process, and addresses strategies for account retention and growth.
With over 20 years’ experience in the industry, Mucha has built a distinguished career consulting to EMS companies. This new book is an excellent resource for chief executive officers, vice-presidents of sales and/or marketing, sales directors, sales managers, program managers, account managers, business development managers, and sales engineers in EMS companies and in related manufacturing services industries. More Info...
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RFID Handbook: Applications, Technology, Security, and Privacy -
Ahson, Syed and Ilyas, Mohammad
Radio Frequency Identification (RFID) tagging is now used by the department of defense and many of the world’s largest retailers including Wal-Mart. As RFID continues to infiltrate industries worldwide, organizations must harness a clear understanding of this technology in order to maximize its potential and protect against the potential risks it poses.
The RFID Handbook provides an overview of RFID technology, its associated security and privacy risks, and recommended practices that will enable organizations to realize productivity improvements while also protecting sensitive information and the privacy of individuals.
Expert contributors present a host of applications including RFID enabled automated receiving, triage with RFID for massive incidents, RFID and NFC in relation to mobile phones, and RFID technologies for communication robots and a privacy preserving video surveillance system. The unprecedented coverage also includes detailed descriptions of adaptive splitting protocols as well as tree-based and probabilistic anti-collision protocols.
Drawing on its distinguished editors and world-renowned contributors, this one-of-a-kind handbook serves as the ultimate reference on RFID, from basic research concepts to future applications. More Info...
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SMTA Medical Electronics Symposium Proceedings on CD, 2008 -
SMTA
The medical electronics industry is a dynamic and evolving industry that consists of many technology and market segments. The evolvement of technology and market segments are due to the close working relationships between the private sector, universities, local, state, federal and international governments. This allows the medical electronics technology to be a vibrant and interactive technical community. This symposium will include the market’s current and future outlooks, regulatory requirements, legal perspectives, components, reliability, trends, initiative projects and advanced applications. More Info...
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SMTA Pan Pacific Microelectronics Symposium Proceedings on CD, 2008 -
SMTA
The Annual Pan Pacific Microelectronics Symposium & Exhibit that was held January 22-24, 2008, at the Sheraton Kauai Resort, Kauai, promoted international technical interchange and provided a premier forum for extensive networking among industry professionals and business leaders throughout the world.
Sponsored by the SMTA, the Symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems, nanotechnology, and assembly.
More than 50 papers from the technical program are featured here. More Info...
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Embedded Core Design with FPGAs -
Zainalabedin Navabi, Ph.D.
A landmark guide in digital system design, Embedded Core Design with FPGAs equips today's computer engineers with everything they need to design embedded cores and apply those cores in a state-of-the-art embedded system. This practical resource brings together logic design, computer architecture, Verilog, FPGAs, Hardware/Software design, and SoCs, explaining how engineers can draw on their computer engineering background to achieve cutting-edge embedded designs.
Renowned design expert and educator Zainalabedin Navabi first covers the basics of logic design, RT Level Verilog, computer architectures, and the architecture of modern field programmable devices. He then explores the design of utility cores that are used for high-level core-based designs, with specific focus on existing Altera cores. Finally, he describes higher-end design methodologies, including design of hardware/software systems, CPU configurations, embedded systems, and the utilization of various Altera Nios II processors. More Info...
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Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing -
Bradley, E., Handwerker, C., Bath, J., Parker, R., and Gedney, R. (Editors)
Reflecting the results of a two-year study undertaken by a cross-section of some of the largest North American electronic equipment manufacturers, this book provides full coverage of the issues surrounding the implementation of lead-free solder into electric board assembly. Additionally, fully documented book chapters with references to existing published work in the area make this an invaluable reference for the countless engineers and companies faced with making the switch to lead-free electronics. More Info...
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Bob Willis Pin in Hole Intrusive Reflow CD-ROM -
Bob Willis
This CD ROM is fully interactive and covers the use of through hole components, design rules and process requirement when implementing Pin in Hole/Intrusive reflow assembly. Examples of satisfactory solder joint standards are provided with a complete guide to possible process defects with intrusive reflow. The defect section may be viewed with small examples to make searching easy and then each sample may be viewed at both half and full screen. More Info...
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Right The First Time- A Practical Handbook on High Speed PCB and System Design volume 2 -
Lee W. Ritchey
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Integrated Circuit Packaging, Assembly and Interconnections -
William J. Greig
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SMTA International Wafer-Level Packaging Conference (IWLPC) Proceedings on CD, 2007 -
SMTA
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SMTA International Conference Proceedings on CD, 2007 -
SMTA
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Nano/Microscale Heat Transfer -
Zhuomin Zhang
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Business Innovation in the 21st Century -
Praveen Gupta
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Virtually Stat Free Six Sigma: Focusing on Intent for Quick Results -
Praveen Gupta
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Hermeticity of Electronic Packages -
Hal Greenhouse
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Lead-Free Electronics -
Pecht, Michael and Ganesan, Sanka
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Guide to Lead-Free Solders: Physical Metallurgy and Reliability -
Evans, John W. (Author); Kwon, Dong-il (Contributor); and Engelmaier, Werner (Editor)
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Practical Guide to X-Ray Inspection Criteria -
Bernard, David and Willis, Bob
The Dage x-ray inspection guidebook provides x-ray images and information that can be used as a teaching aid and reference guide for anyone undertaking x-ray inspection of printed circuit board assemblies. The contents of the guidebook spans information on the theory and practice of x-ray inspection, voiding within BGA devices, inspection of area array packages, fine pitch devices, passive components, small active components and through-hole joints, as well as x-ray inspection criteria and commonly detectable defects. More Info...
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SMTA Successful Lead-Free/RoHS Strategies Conference Proceedings on CD, 2007 -
SMTA
This event brought attendees timely and relevant information and best practices for use in the reliable and effective transition to lead-free and RoHS assembly. The conference was structured to bring the latest research from industry experts to enable both consistent and reliable processes. The Do it Right – Do it Now sought to offer attendees the tools to transition to lead-free with the high quality they are accustomed to in leaded systems while maintaining regulatory due diligence. More Info...
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Lead-Free Soldering -
Jasbir Bath
The past few years have seen major developments in soldering materials and processes for electronics assembly manufacture due to the movement from tin-lead to lead-free soldering. The removal of lead from electronics solders due to environmental considerations first developed with proposed US legislation in the early 1990s. At that time, the alternatives had not been fully explored, so a ban on the use of lead in electronic solders was put on hold. However the seed was sown for development with various projects initiated during the 1990s in Europe, the Americas, and Asia.
Based on government pressures, Japan OEMs began to move to lead-free solder products from 1998 and this, combined with the European Union ROHS (Restriction of Hazardous Substances) legislation enacted in 2006, drove the global manufacture of electronics consumer products with lead-free solders. From 1998 to the present, the development of lead-free solder materials and processes has progressed to such an extent that development work moving forward will typically only concentrate on lead-free solders and components rather than tin-lead solders and components.
This book aims to give the latest information on development of the lead-free soldering materials and processes and identify where more work is needed. The chapters of the book describe legislation, alloys, reflow, wave, rework, reliability, backward and forward process compatibility, PCB surface finishes and PCB laminates, and standards affecting the general lead-free soldering arena. More Info...
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The SMT Step by Step Collection 2006 -
PennWell Books
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SMTA TechScan Compendium,The State-of-the-Art in Ball Grid Array and Chip Scale Package Technology -
SMTA / Paul Vianco
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The Handbook of Manufacturing Engineering, Second Edition -
Richard Crowson
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SMTA Medical Electronics Symposium Proceedings on CD, 2006 -
SMTA
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SMTA Six Sigma/Green Belt Certification Study Guide -
Lasky, Ronald; Zarrow, Phil; and Hall, W. James
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SMTA Processes Certification Study Guide -
Lasky, Ronald; Zarrow, Phil; and Hall, W. James
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Your Transition to Pb-Free On-line Course and Book -
Lasky, Ronald; Hickey, Katherine; and Parashar, Amish
Our industry is making one of its most challenging and evolutionary steps in going from SnPb to lead-free products. The issues are many, and they must be well understood to avoid costly mistakes or misspoken statements. In this book and corresponding "E-Learn" on-line course you will learn the most critical pieces about the transition to lead-free. It is the most extensive and broadest coverage of this topic available anywhere.
The transition to lead-free first starts with understanding the directives and global trends. Then learn about the possible alloy replacements, their pros and cons along with the environmental considerations and reliability; each backed up with testing and data. The PWB finishes are dealt with in detail, covering a wide range of optional finishes. That is followed by what the effects are of intermixing different board finishes, PWB plating types and solder alloys: addressing both forward and backward compatibility. Next, another important topic, tin whiskers are explained in a detail not found anywhere else. Now you are only half way through! More Info...
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Bob Willis Conventional/SMT & Lead-Free Assembly Process Animations (CD) -
Bob Willis
If you are using PowerPoint for training or technical sales presentations and need to illustrate the conventional and surface mount assembly process stages, this CD-ROM is for you. The CD features three presentations: Conventional through hole assembly Surface mount and mixed technology assembly stages Changes for lead-free production More Info...
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Bob Willis Printed Circuit Board Design & Lead-Free Defect Guide 2 (CD) -
Bob Willis
Printed board design and layout is the key to zero defect manufacturing, which is particularly true for lead-free. Design and development engineers must convert their build of materials to make all components lead-free and processes compatible.
This CD-ROM provides a basic introduction to conventional, surface mount, ball grid array, and pin in hole / intrusive reflow assembly, including changes for lead-free with the following... More Info...
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Bob Willis BGA Inspection & Lead-Free Defect Guide (CD) -
Bob Willis
This interactive CD-ROM produced jointly by Metcal and Bob Willis covers optical and X-ray inspection of solder joints. It includes an introduction to the lead-free assembly process with specific attention to BGA and area array devices. It provides a step-by-step guide to the procedure of inspection for optical and X-ray showing you how to do it. More Info...
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Lead-Free Solder Interconnect Reliability -
Shangguan (Editor), Dongkai
This book provides the most up-to-date knowledge and data available on the reliability of lead-free solder interconnects. The content has been written by leading experts working in this important technology area. Both fundamental research and practical considerations are addressed.
Environmental regulations are driving the worldwide adoption of lead-free soldering technology for electronics packaging, board assembly, and related manufacturing operations. While a significant amount of research and development work has been conducted in recent years on manufacturing issues to enable the conversion to lead-free solders, data from studies related to the reliability of lead-free solder interconnects are still emerging. More Info...
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MEMS/MOEMS Packaging: Concepts, Designs, Materials, and Processes -
Dr. Ken Gilleo
While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS and MOEMS, and ultimately nano-electrical devices, is the development of appropriate packaging solutions for the protection, assembly, and long-term reliable operation.
This book rigorously examines the properties of the materials used in MEMS and MOEMS assembly and then evaluates them in terms of their routing, electrical performance, thermal management, and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging. More Info...
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