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SMTA Pan Pacific Microelectronics Symposium Proceedings on CD, 2011
Author: SMTA
Publisher: SMTA
Copyright Year: 2011
Number of Pages: N/A
Non-Member Price: $160.00
Member Price:
$150.00
The Annual Pan Pacific Microelectronics Symposium & Exhibit held January 18-20, 2011, on the Big Island of Hawaii, promoted international technical interchange and provided a premier forum for networking among industry professionals and business leaders around the world. Sponsored by the SMTA, the Symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems, nanotechnology, and assembly.
More than 30 papers from the technical program are featured here. Topics include: 3D Package on Package, 3D Through Silicon Vias (TSV), Global Roadmapping, Strategic Manufacturing: Challenges and Reliability, Green Electronics Design, Material Advances in Reliability, Substrates, Connections, LEDs, and Laser Processes.
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