TECHNICAL SESSIONS
AAT4 Development and Optimization of 0.3mm Pitch BGA Packages for Mobile Applications
8:00am - 9:30am
(Room 202B)
MFX 4 Reliability of Low Silver Alternative to SAC Alloys
8:00am - 9:30am
(Room 202D)
SMT3 BGA Profiling and Reballing
8:00am - 9:30am
(Room 202C)
SUB1 PCB Fabrication and Reliability
8:00am - 9:30am
(Room 204A)
AAT5 Advances in PoP: Process and Reliability
10:30am - 12:30pm
(Room 202B)
MFX5 Alloy Selection and its Influence on Electronic Assembly
10:30am - 12:00pm
(Room 202D)
SMT4 Advances in Reflow Soldering
10:30am - 12:30pm
(Room 202C)
SUB2 Printed Circuit Board Performance and Reliability
10:30am - 12:00pm
(Room 204A)
AAT6 Wafer Level and Flip Chip Package Reliability
2:00pm - 3:30pm
(Room 202B)
MFX6 PCB Cavity or Inner Layer Component Assembly
2:00pm - 3:00pm
(Room 202D)
SMT5 BTCs: Voiding, Cleaning and Other Assembly Considerations
2:00pm - 3:30pm
(Room 202C)
SUB3 Investigation of Reliability for Alternate Surface Finishes
2:00pm - 3:30pm
(Room 204A)
PRC1 Process Inspection Technologies
2:00pm - 3:30pm
(Room 201B)
AAT7 The Impact of the Process Environment on Solder Defects
4:00pm - 5:30pm
(Room 202B)
SMT6 Advancements in Cleaning Process Controls
4:00pm - 5:30pm
(Room 202C)
SUB4 Substrate Technologies for Advanced Electronics
4:00pm - 5:30pm
(Room 204A)
PRC2 Imaging, Inspection, and Quality
4:00pm - 5:30pm
(Room 201B)