Wednesday At-A-Glance

AAT4 Development and Optimization of 0.3mm Pitch BGA Packages for Mobile Applications
8:00am - 9:30am
(Room 202B)

MFX 4 Reliability of Low Silver Alternative to SAC Alloys
8:00am - 9:30am
(Room 202D)

SMT3 BGA Profiling and Reballing
8:00am - 9:30am
(Room 202C)

AAT5 Advances in PoP: Process and Reliability
10:30am - 12:30pm
(Room 202B)

MFX5 Alloy Selection and its Influence on Electronic Assembly
10:30am - 12:00pm
(Room 202D)

SMT4 Advances in Reflow Soldering
10:30am - 12:30pm
(Room 202C)

AAT6 Wafer Level and Flip Chip Package Reliability
2:00pm - 3:30pm
(Room 202B)

MFX6 PCB Cavity or Inner Layer Component Assembly
2:00pm - 3:00pm
(Room 202D)

SMT5 BTCs: Voiding, Cleaning and Other Assembly Considerations
2:00pm - 3:30pm
(Room 202C)

AAT7 The Impact of the Process Environment on Solder Defects
4:00pm - 5:30pm
(Room 202B)

SMT6 Advancements in Cleaning Process Controls
4:00pm - 5:30pm
(Room 202C)

The sessions below all spotlight some of today's challenges and their solutions. These sessions are FREE to all SMTAI attendees and will be held in the Exhibit Hall Theatre.

SPOTLIGHT 4 Process and Yield Improvement in SMT
9:30am - 11:00am
(Exhibit Hall Theatre)

SPOTLIGHT 5 Test Engineering Strategies and Systems for Test of PCBAs in Manufacturing
11:30am - 1:00pm
(Exhibit Hall Theatre)

SPOTLIGHT 6 Increasing Product Reliability with Better ESD, SPI, SIR Understanding
1:30pm - 3:00pm
(Exhibit Hall Theatre)

SMT Process Certification
8:30am - 5:00pm
(Room 103A)

SMT Six Sigma Certification
8:30am - 5:00pm
(Room 103B)