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| Full-day
(7 hour) and half-day (3.5 hour) educational courses are led by industry
professionals with extensive experience in the subject area of the course.
Course leaders deliver focused, in-depth presentations on topics of
current importance to the industry, based on their research and industry
experience. |
Tutorials
are application-oriented and structured to combine field experience with
scientific research to solve everyday problems. Tutorials are offered on
Sunday, Monday, and Thursday providing you with the opportunity to attend
the conference sessions and visit the exhibit floor.
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Please note the  preceding some of the instructor biographies listed below. These internationally respected instructors have been recognized by the SMTA International Technical Committee for consistently receiving exceptionally high ratings from attendees for the specific course they are teaching this year at SMTAI.
SUNDAY, October 4
 Manufacturing and Assembly -
Sunday
T1 SMT Process Fundamentals for Tin-Lead, Lead Free and Mixed Assembly
S. Manian Ramkumar Ph.D., Rochester Institute of Technology (Instructor Bio)
Sunday, October 4
8:00am –
5:00pm
What You Will Learn
This course will provide introductory understanding of the surface mount and mixed technology assembly processes for lead based and lead free electronics packaging. Topics include coverage of PCBs, assembly types, component types, assembly process, assembly materials, identification of defects, troubleshooting and process control. Critical design tips for ease of manufacture and assembly will be discussed throughout the course. Tradeoff decisions between different materials and equipment types will also be highlighted. A good comparison of lead based and lead free process will be provided, including implementation.
Who Should Attend
People with little or no background in SMT; process, design, test and quality engineers; process and quality technicians; operators; marketing, sales and purchasing; managers
Topics Covered
- Electronics Packaging & Levels
- Functions of packaging
- Thermal management issues
- PCB assembly types
- Assembly process sequence
- PCB Types, Materials and Manufacturing
- Surface Mount Technology Components
- Passive component types
- Active component specifications
- Active component types (ICs) and advanced packaging
- Stencil Printing
- Solder paste-characterization, types, handling & safety
- No-lead solder and its impact
- Stencils and squeegees-materials, types & manufacturing
- Print parameters
- Process requirements for lead-free
- Print characteristics, defects and corrective action
- Adhesive Dispense
- Adhesive types, selection & dispensing techniques
- Inspection
- Reflow curing
- Component Placement
- Factors influencing the use of automated placement equipment
- Machine configurations & types
- Component packaging for automated placement
- Soldering
- Reflow soldering
- Typical reflow profile
- Profiling & its importance-how to?
- Affecting good reflow
- Lead-free solder and profiling changes
- Wave soldering
- Changes needed for lead-free solder
- Process sequence & defects
- Cleaning – Materials, Process, and No-Clean Process
- Inspection Techniques, Assembly Defect Identification and Corrective Action
- Testing of PCB Assemblies
- Rework and Repair
 T2 The Reliability of ‘Green’: Going Beyond SAC305
Randy Schueller, Ph.D., DfR Solutions(Instructor Bios)
Sunday, October 4
8:00am –
5:00pm
What You Will Learn
As the RoHS legislation enters its third year, knowledge of the basics of Pb-free design and manufacturing is proliferating. Consumer electronic OEMs have been manufacturing Pb-free electronics for several years while even companies that produce higher reliability products (telecom, industrial, medical, military, avionics) have made the transition or are in the process of preparing for the eventual demise of SnPb. Unfortunately, the introduction of new environmental legislation and new environmental-friendly materials continues at a rapid pace. As a result, the design / manufacturing / component / reliability engineer continues to struggle with new Pb-free alloys and halogen-free materials, among other issues. While this course will provide a comprehensive overview of some of the challenges of Pb-free, it will also focus on some of the newest issues in ‘green’ electronics. These will include tin whisker mitigations, halogen-free laminate, manufacturing challenges that continue to be a problem with Pb-free, the performance of second (2nd) generation Pb-free solders, and the newest long-term reliability information for Pb-free.
Who Should Attend
This course is geared toward engineers and managers in the areas of product development, manufacturing, quality, or reliability. Nearly all companies are migrating toward green products whether or not it is intentional. As non-green materials in the electronics industry are phased out, it is critical to understand the key differences and reliability issues that can result from the new material and processes. Consequently, anyone involved in the early life cycle of a product who wishes to mitigate the risk of failure would find value in attending this course.
Topics Covered
- Components
- Understanding process sensitivity levels (PSL)
- Tin Whisker: predictions and mitigations
- Printed Circuit Boards
- Predicting and preventing printed board damage
- Newest Pb-free solderability finishes
- Halogen-free laminates: the good, the bad, and the ugly
- Solder and Manufacturing
- 2nd generation solders: what/who/why
- Finding a solution to hole fill
- Is Pb-free the culprit to head-in-pillow?
- Long-Term Reliability
- Temperature cycling
- Mechanical shock
- Vibration
T3 Lead-Free Lessons Learned - Surface Mount Technology
Chrys Shea, Shea Engineering Services (Instructor Bio)
Sunday, October 4
8:00am
–11:30am
What You Will Learn
Experience is the best teacher, but its lessons are often expensive - particularly in the context of printed circuit assembly, where small problems can add up to big dollars very quickly. The assembly process is filled with opportunities for quality concerns, and taking it lead-free only adds to the list of potential pitfalls. This course reviews the most common problems that have occurred in lead-free SMT assembly, how to avoid them, and tactics to address them if they do arise.
Who Should Attend
Process engineers and technicians; quality assurance professionals; new product introduction engineers; production managers and supervisors; procurement and supplier quality engineers; anyone who wants to avoid some of the common pitfalls of lead-free circuit assembly.
Topics Covered
Common defects: head-in-pillow, solder bridges, solder beads, voids, tombstones
Optimizing print quality, lead-free stencil design & intrusive reflow
The influence of the PWB fabrication process & surface finish on the SMT assembly process
Mixed metals solder systems in BGAs
Hybrid solder pastes for mixed metals & tin-lead HIP defects
Halogens & halides in the assembly process
T4 Conformal Coating Applications, Inspection, Rework & Quality Control
Bob Willis, ASKbobwillis.com (Instructor Bio)
Sunday, October 4
8:00am –
11:30am
What You Will Learn
The use of Conformal Coating has provided benefits to the industry for many years, either in the high reliability market sector or where products have to deal with extreme environmental conditions or simply in use in consumer applications. The use of coatings is seen in different industries like telecommunications, automotive and consumer products which have benefited from the use of selective coating but for different reasons.
This class will provide a simple guide to the use of coatings, their application and process, product benefits, inspection and quality control. A practical session will also allow delegates to examine coated boards using different materials and inspect the coating application.
Each attendee will also receive a FREE set of colour Inspection Wall Charts covering coating application and common defects to use on their manufacturing shop floor. During each workshop there are opportunities to win some of Bob’s interactive CD ROMs for best questions of the session.
Who Should Attend
This class is designed for design, process and quality engineers responsible for introducing coating materials. Inspection or auditing presented is extremely visual and practical, making it ideal for manufacturing staff. Like all the instructor’s workshops, it not just theory, it’s a "How to Do It Session".
Topics Covered
Why conformal coat
Clean or no clean
Coating material options
Coating process options
Cost of coating assemblies
SIR & cleanliness testing
Cleanliness testing methods
Reliability of coating
Testing & evaluation of coatings
Correct design for coating
Masking options and methods
Inspection & quality control of coating
In-house or contracting services
Inspection of coatings & methods
Rework & repair of board assemblies
T5 Design for Manufacturability in A Lead Free World
Ray Prasad, Ray Prasad Consultancy Group (Instructor Bio)
Sunday, October 4
1:30pm –
5:00pm
What You Will Learn
Designing for SMT can involve trial and error and a lot of frustration. Additional frustration is caused by fast-paced changes in packaging technologies and the advent of lead-free has compounded the designer’s task. This course is based on Ray's book “Surface Mount Technology: Principles and Practice”, Second Edition, and the IPC Land Pattern and Design document (now IPC-7351) initially chaired by Ray. It draws on his experience in developing DFM and Land Patterns at Intel Corporation, where he was the SMT Program Manager and the course provides detailed DFM guidelines for both tin-lead and lead-free assemblies.
At the end of the class, there is a quiz for review and plenty of time is allowed for questions and answers. Each attendee will receive a comprehensive handout containing all the presentation material.
Who Should Attend
Anyone in management, engineering, purchasing, design, process, quality, and manufacturing who are working with tin-lead or lead-free using SMT, fine pitch and BGA or plans to get into it in the future will benefit from this course. Attendees will learn technical details to help solve design and manufacturing problems and develop the internal DFM document to help develop a self-sustaining internal infrastructure which is critical in achieving design and manufacturing process stability in a constantly changing technology and organizational environment.
Topics Covered
- Introduction
- General DFM considerations
- Why lead-free? Legislation & market forces
- Major impact of LF on soldering process
- LF vs. tin-lead impact on reliability
- DFM for Lead-Free Only
- Laminates for lead-free
- Lead-free surface finishes
- Component considerations
- Effect on MSL level & reflow profile due to lead-free
- DFM for Both Tin-Lead and Lead-Free Soldering
- Layer count & via size considerations
- Orientation & inter-package spacing
- Land pattern & stencil considerations
- Fiducials, soldermask, & paneling
- Design for test, repair & cleaning
T6 Lead-Free Lessons Learned – Wave Soldering Technology
Chrys Shea, Shea Engineering Services (Instructor
Bio)
Sunday, October 4
1:30pm – 5:00pm
What You Will Learn
Lead-free wave soldering turned out to be a lot trickier than most electronics manufacturers expected. At first glance, the tin-lead and lead-free wave soldering processes may appear to be very similar, but small behavioral differences in the alloys have created some enormous quality and throughput differences on assembly lines. Higher melting temperatures, slower wetting speeds, and the more sluggish flow of lead-free alloys have necessitated some basic changes to the process. New paths of process optimization include more robust fluxes, longer process times, and extra attention to the solder's flow dynamics and rework methods. This course reviews the most common problems that have occurred in lead-free wave soldering, ways to prevent them, and tactics to resolve them if they do arise.
Who Should Attend
Process engineers and technicians; quality assurance professionals; new product introduction engineers; production managers and supervisors; procurement and supplier quality engineers; anyone who wants to avoid some of the common pitfalls of lead-free wave soldering.
Topics Covered
Review of basic elements: flux, heat & solder
Solder pot setup: immersion depth, contact time, nozzle design, peel-off mechanics & temperature
Solder pot alloy monitoring
Hole fill requirements & strategies
Pallet design
The influence of the PWB fabrication process & surface finish on the PTH assembly process
Blow holes
Copper erosion
Separating fact from fiction in wave soldering
Advanced Packaging -
Sunday
T7 Advanced Packaging Technologies and Future Interconnection Trends
Joseph Fjelstad, Verdant Electronics
(Instructor
Bio)
Sunday, October 4
1:30pm – 5:00pm
What You Will Learn
IC packaging technology is the first interconnection element supporting the semiconductor chip, and is the primary gatekeeper of electronic system performance. With so many packaging options available, understanding the basics of IC packaging is critical to successful product design. This course reviews common IC packages, including chip scale, BGA, 3-D stacked, and folded packages. A review of wafer-level packaging is also covered.
Who Should Attend
This course is wide ranging in terms of potential interest and should prove suitable for those both entering, as well as those seasoned by some years in the electronics industry. Designers, development engineers, product managers and any others with responsibilities that touch on matters related to electronic packaging and interconnection can all benefit from the material presented.
Topics Covered
Roles of IC packaging
Construction & manufacturing processes for common IC packages
Impact of IC package design on the assembly processes
Testing strategies
Trends in the integration of IC, package & PCB substrate (e.g., the Occam Process)
What’s new, & where IC packaging technology is headed
Role of IC packaging technologies in electronics assembly
Chip scale packaging types
3-D packaging concepts
Reliability testing & electrical performance of CSPs
Impact of lead-free check points & alternative approaches
Standards for substrates
The future of IC packaging
Substrates - Sunday
T8 Flex Circuit Fundamentals
Ken Gilleo, Ph.D., ET-Trends LLC (Instructor
Bio)
Sunday, October 4
1:30pm – 5:00pm
What You Will Learn
Flexible Circuitry, the very first printed circuit and most valuable interconnect, continues fast-paced advances as products shrink and features expand. Flex is a vital enabling technology for a wide range of electronics, especially portable consumer products. Flex is the very best high-density interconnect (HDI) that also provides extreme thinness, the lowest weight, pliability and extraordinary durability, even in the harshest environments like outer space. Flex is a unique 3D circuit that brings hi-rel connections to moving assemblies. Cell phones, cameras, displays, personal-players, PDAs, iPods, iPhone, laptops, disk drives, and hundreds of large and small products use flex. But mature applications, like automotive and military, are also growing, as more powerful electronics is adopted.
We'll cover the unique flex materials - the real key to excellent performance; both high-end high-temp polymers and low-cost thermoplastics. Flex material topics include traditional polyimides, Liquid Crystal Polymers (LCP), and ultra-low cost polyesters. We'll compare these products and provide "when to use what" guidelines. Both traditional and newer processes are covered, including laser machining and fluid jetting (ink jet). Conductor processes include subtractive, additive, and printed PTF inks. We’ll briefly touch on RFID tags and the newest and just-emerging area, "Printed Electronics", aka Flexible Electronics.
Discussions will include special properties and unique characteristics of flex dielectrics, metal conductors, polymer inks. We'll compare flex to rigid PCBs and point out where each is best suited. You already use flex, so join us to learn more about this powerful and enabling technology.
Who Should Attend
Technical and marketing managers, designers, material suppliers, circuit fabricators, test engineers and assembly personnel in the general printed circuit field. IC fabricators, electronic package designers and technologists will also benefit.
Topics Covered
The fundamentals of flexible circuitry
Advantages & limitations
Flex materials: base films, conductors, finishes, masks, coverlayers, & backers
Adhesiveless vs. laminates
Think in 3-dimensional
Dynamic vs. flex to install
Assembly: SMT, COB, TAB and flip chip
The total cost picture
Newer areas; RFID tags and printed (organic/plastic) electronics
MONDAY, October 5
Manufacturing and Assembly - Monday
T9 Implementing Advanced SMT Manufacturing
Phil Zarrow and Jim Hall, ITM Consulting (Instructor
Bio)
Monday, October 5
8:00am – 5:00pm
What You Will Learn
The circuit board assembler is constantly challenged by components that seem to defy logic and manufacturability. Passives such as 0201s and 01005s, while bringing happiness to the designer with regard to layout densities are the bane of the assembler. IC packaging also has adhered to the mantra of “smaller, faster” taunting the assembler with land-grid arrays, QFNs, and high-density CSPs and Flip-chips. Yet, manufacturing PCBAs with these “bleeding edge” components is not insurmountable, (though not for the weak of heart).
This advanced course is intended to provide the experienced participant with a thorough yet practical approach to dealing with today’s challenges of Surface Mount Technology manufacturing. High manufacturing yield can best be attained by understanding and successfully implementing the appropriate process considerations. This course will give the participant a true comprehension of the SMT assembly processes and associated materials. The very latest and best methodologies and philosophies regarding process optimization will be presented and discussed. Optimizing the SMT assembly process, as it pertains to very small and high-density components will thus be covered, including DFM guidelines, solder paste, screen/stencil printing, component placement, reflow, inspection and rework. The impact of lead-free and RoHS compliance will, of course, also be discussed. Case studies based upon the instructor's experience will be presented. Most important, particular attention will be paid to the sources of problems that occur within the assembly process.
Who Should Attend
This course is intended for manufacturing, process, design, test and quality engineering personnel as well as management experienced in SMT assembly and want to further their expertise in implementing and optimizing their SMT assembly processes, even when faced with leading edge and “bleeding edge” technologies.
Topics Covered
- Component Issues
- Very small passives
- ICs
- QFNs, LGAs , NQFPs, etc.
- Ultra-fine pitch BGAs, CSPs & flip-chips
- Reliability
- Corner & edge bonding
- Flip Chip
- 3-D assembly: PoP
- Moisture sensitive devices (MSDs)
- Issues & specifications
- Higher MSL’s (4 – 6)
- Real-world scenarios
- Tracking
- Design for Manufacturability Considerations (Overview)
- Pad design–Guidelines & Tradeoffs
- Via in Pad
- Component layout: proximities & double-sided
- Lead-free PCB materials & surface finishes
- Solder Paste
- Solder paste composition & behavior:
- Recommendations for 0201 & 01005s
- Solder Paste Printing & Deposition
- Deposition basics
- Screen & stencil engineering
- Multi-pitch (broadband or mixed tech) printing
- Aperture size & shape
- Stencil design
- Variables & control
- Machine elements & parameters
- Solder dispensing
- Jet printing
- Automatic Component Placement
- ”Platform” concepts of current equipment
- Optimizing up-time and utilization
- Variables and control
- SMT Soldering
- Reflow soldering considerations
- Profile optimization strategies
- Advanced reflow requirements for complex component and product geometries
- Additional requirement for lead-free solder alloys
- Vapor phase soldering
- Reflow of lead-free area arrays in SnPb processes
- Reflow of through-hole components (pin-in-paste, etc)
- Selective soldering of through-hole components
- Inspection, Verification and Rework
- Solder joint quality and reliability
- Inspection methodology and equipment
- In-process inspection
- Automated optical inspection (AOI)
- X-Ray and X-Ray tomography inspection
- General Discussion; Q&A
T10 Troubleshooting Yield Problems in a Lead-Free World
Ray Prasad, Prasad Consultancy Group (Instructor
Bio)
Monday, October 5
8:00am – 11:30am
What You Will Learn
SMT has been in use in high volume since 1985 and BGA has been in use in high volume since 1995. But even after all these years of high volume experience, less than 10% of companies have yield over 90%. That means 90% of companies are doing too much rework.
The electronic assembly, if done correctly, produces high quality assemblies at a very high speed. But when something goes wrong, and something does go wrong and will go wrong as long as humans are involved, the same line will produce scrap at the same high speed. And the problem is further compounded with the advent of lead-free soldering technology.
This course focuses on three major areas of defects in SMT: design, assembly and the quality of incoming materials. We elaborate on defects related to in coming material quality including surface finishes, and reflow and wave soldering and delve into some unsettled issues in lead free wave soldering and show you finding the root cause of the defects to build products with high and consistent quality to reduce cost and improve reliability.
The objective of this course is to provide an understanding of root causes of major defects in SMT and through hole tin-lead and lead-free assemblies and ways to prevent them. You are also encouraged to bring your pesky defects for class discussion and root cause analysis.
Who Should Attend
Manufacturing, process, design, test, quality engineering personnel and their managers who are involved in designing or producing tin-lead/lead-free SMT and mixed-technology assemblies and want to reduce product cost and improve process yield should attend this course.
Topics Covered
- Major Yield Drivers
- Defects related to DFM
- Defects related to incoming materials
- Defects related to manufacturing processes
- Defects related to lead-free conversion
- Case Histories & Examples of Defects
- Design for Manufacturing
- Land pattern
- Surface finish
- Incoming Materials
- PCB
- Components
- Solderability
- Alloys
- Manufacturing Processes
- Paste printing
- Reflow soldering
- Wave soldering
- Rework: hot air vs. laser
- Path to Yield Improvement
- Total quality management (TQM) principles & statistical quality control tools
- Quality assurance vs. quality control
- Continuous process improvement
- Role of testing & inspection in yield improvement
- Why only two defects for monitoring yield?
- Examples of Defects from YOU
- Case histories from YOU
- Bring your pesky defects for class discussion
- Quiz
T11 LGA (Land Grid Array), QFN (Quad Flat No-lead) Design, Assembly, Inspection & Rework
Bob Willis, ASKbobwillis.com (Instructor
Bio)
Monday, October 5
8:00am – 11:30am
What You Will Learn
LGA and QFN have fast become a common package type often used in many professional portable products. With any new device type there is always a learning curve for design, process and quality engineers who have to come to grips with the challenges that these packages bring. Each step of the implementation process for LGA/QFN devices will be reviewed along with results of practice process trials with these devices. Included with this course will be a set of optical and x-ray inspection charts for each delegate to use in manufacture. The instructor is well known for his practical courses and supported by Bob Willis unique process video experiments, LGA/QFN are guaranteed to come alive.
Who Should Attend
This workshop is designed for design, process, and quality engineers responsible for introducing products containing LGA/QFN. Much of the material presented is extremely visual and practical making it ideal for manufacturing staff, like all the instructors workshops it not just theory, it’s a “How to Do It Session”.
Topics Covered
Component Package Types
Component Construction
MSD Handling Levels
Solderability Testing Packages
Printed Board Layout on Rigid & Flexible Circuits
Soldermask Layout Options
Lead-free Stencil Printing Options
Placement & Component Packaging
Convection & Vapour Phase Soldering Yields
Visual Inspection Criteria
X-ray Inspection Criteria
LGA/QFN Rework & Replacement
Array Solder Joint Reliability
Common Process Problems with LGA/QFN
Advanced Packaging -
Monday
T12 3 Dimensional Assembly, Packaging & Integration
Charles Bauer, Ph.D., TechLead Corporation (Instructor
Bio)
Monday, October 5
1:30pm – 5:00pm
What You Will Learn
The latest trend in miniaturization of electronics systems, 3D assembly and packaging of both active and passive devices, opens a new world of performance and integration to system designers. This course covers both the fundamental and advanced technologies in use today to produce stacked chip packages as well as stackable packages for implementation of highly integrated mobile electronic products. These include the challenges of die thinning, thin die attach, multi-level wire bonding, mixed technology die attachment and bonding, flip chip, TAB and TSV (Through Silicon Via) technologies. Substrate selection for various 3D packaging techniques including silicon tiles, flex circuit origami and specialty interposers concludes the chip stacking section of the course. Several examples of specific 3D package structures demonstrate both the power and limitations of these approaches.
Further considerations for 3D electronics include stackable packages based on flex and rigid substrate approaches, integrated system in package (SiP) techniques and multilayer, embedded passive technologies. Additional coverage of SMT design and assembly implications rounds out the technical content of the course. The course concludes with a review of the drivers behind 3D packaging and presentation of multiple examples of 3D packages in actual usage today.
Who Should Attend
This course covers basic and advanced topics for product and design engineers, manufacturing process and assembly/packaging engineers, engineering managers, senior design technicians, consultants and academic specialists as well as marketing and sales personnel requiring an understanding of the capabilities, implications, and options of 3D packaging and assembly technologies.
Topics Covered
- 3D Package Trends
- 3D Package Applications
- Stacked Packages
- Package on Package
- Origami
- Edge stacked modules
- Die Stacking
- Wire bond
- Mixed technology
- Edge redistribution
- Through silicon vias
- 3D Integration (SiP)
- Issues in 3D Integration
- SMT Assembly Implications
- Drivers for 3D Packaging
- Intellectual Property Landscape for 3D Packaging
Soldering -
Monday
T13 Lead-Free System Performance & Reliability – Present & Future
Jennie Hwang, Ph.D., H-Technologies Group (Instructor
Bio)
Monday, October 5
1:30pm – 5:00pm
What You Will Learn
This course provides a holistic view of the state-of-the-art lead-free performance and reliability, as well as what is on the horizon in the future. A wide array of global production results and the product field service performance have been generated during the last decade. Not all test results appear to coincide, yet all product performance and test results manifest the criticality of sound practice. The course will highlight the sound practice in all key areas of lead-free electronics. Based on the speaker’s three textbooks: "Environment-Friendly Electronics-Lead Free Technology", “Lead-free Implementation—A Manufacturing Guide” and "Modern Solder Technology for Competitive Electronics Manufacturing", representative test results will be outlined. The power of metallurgy and its ability to anticipate the relative performance will be illustrated by discussing the comparative performance vs. metallurgical phases and microstructure. New alloy developments and their impact on product performance and reliability will also be discussed.
Who Should Attend
The course provides a proper level of working knowledge to all who are involved with or interested in the production and reliability of Pb-free packaging and assembling; also designed for those who desire the broad-based information.
Topics Covered
Solder Joint Technology – mechanical, physical properties on performance
PCB Surface Finishes – options and impact on performance & reliability
Component Coatings – options and impact on performance & reliability
Rework - key parameters on performance & reliability (large BGA)
Production Defects and Remedies – types unique to lead-free
System Compatibility on Reliability – forward and backward
System Reliability – PCB characteristics + components + solder joints + process
BGA/CSP/WLP Solder Joint Performance – examples of temperature cycling data
Fundamental Differences Between SnPb & Pb-free
Testing Solder Joint Reliability – discriminating tests and discerning parameters
What is on the horizon and what impact will there be on reliability performance
Power of metallurgy for increased fatigue resistance and creep resistance
Illustration of microstructure evolution vs. strengthening in
SnAg > SnAgCu > SnAgCuNi > SnAgCu+x,y,z and other systems
Illustration of microstructure evolution vs strengthening in
SnCu > SnCu+Ni > SnCu+Ni +x > SnCu+Ni +x,y,z and other systems
Comparing the present system with the future deployment from the reliability perspective
Concluding points
Process Control - Monday
T14 Common Failure Modes in Electronic Packages and Assemblies and How to Avoid Them
Andrew Mawer, Freescale Semiconductor (Instructor
Bio)
Monday, October 5
1:30pm – 5:00pm
What You Will Learn
This course will cover many of the most common component-level and package to board Pb-free and SnPb-based solder interconnect failure modes experienced by electronic assemblies. These include failures that occur during the assembly process as well as those that occur with systems in the field or during accelerated testing. The root cause of each failure will be explained and examples of each will be detailed. Examples of the many ways that leaded, leadless and BGA solder joints fail to form properly in reflow or become open or shorted after forming correctly will be covered. Special mention will be made of failure modes that are more prevalent with the transition to Pb-free such as solder joint fracture from drop or shock, possible increased component or PCB warpage due to higher soldering temperatures, soldering failures related to utilizing mixed Pb-free and SnPb metallurgies and solderability failures with Pb-free terminations. Failures observed with new package types such as package on package (PoP) and fine pitch leadless packages will be covered. Finally, some internal package failure modes such as delamination, various opens that occur within packages such as the failures of vias and traces in organic substrates will be discussed. The emphasis will be on the prevention of all the failure types discussed and solutions and strategies to that end will be outlined. Finally, various analytical techniques used to analyze and understand failures in electronic assemblies will be reviewed.
Who Should Attend
This course will benefit anyone involved not only in the design, assembly or troubleshooting of PCB assemblies containing a range of leaded, leadless or BGA packages, but also those within the system reliability or supplier quality functions. Also, people who are responsible for carrying out or interpreting failure analysis would greatly benefit from the material presented. Since Pb-free will be a theme throughout the course, anyone involved with transitioning products or processes to Pb-free will find the course very informative.
Topics Covered
- General Soldering Discussion
- Reflow profiles
- Thermocouple attachment
- Profile optimization
- BGA Solder Joint Failure Modes
- Ball in cup opens
- Soldermask lifting
- Pb-free spheres with SnPb paste
- Package/PCB warpage
- Package on package shorting
- Fatigue failure
- PCB non-wetting
- Black pad
- Secondary reflow
- PCB/trace/IMC fracturing
- Heat sink induced fracturing
- Leaded Package Solder Joint Failure Modes
- Pads under package/lifting
- Foreign matter/contamination
- Insufficient solder
- Solder height vs. lead cop fails
- PCB warpage
- Shorting
- Sn whiskers
- Leadless Package Failure Modes
- Types of leadless packages
- Design for leadless packages
- Insufficient solder
- Tilting
- Uncured flux residue
- Rework Issues
- Internal Component Failure Modes
- Analysis and Characterization Techniques
- C-SAM
- Real time X-Ray
- Dye penetrant analysis
- Solderability testing
- Focused ion beam
- Laser decapsulation
- Surface analysis-Auger/XPS
Substrates -
Monday
T15 Blurring the Line between Packaging & Assembly: Embedded Components
Herbert Neuhaus, Ph.D., TechLead Corporation
(Instructor
Bio)
Monday, October 5
8:00am – 11:30am
What You Will Learn
Embedding active and passive components in the interconnect substrate offers improved performance by cutting interconnect parasitics, reliability gains by eliminating wire-bonds and solder-bumps, and reduced cost and size by parts list reduction. Like every new development, these benefits come at a price: disrupted logistics, yield management concerns, and limited rework and repair options.
This course covers the application and implementation of commercial and developmental technologies to embed active as well as passive components. Topics include advanced material options, die contact metallurgy and processes, embedded chip packaging, and options for embedded passives. Solutions include ceramic-based (thick film, LTCC, and HTCC) and organic-based (PWB, flex, and thin film) systems Examples of specific embedded component structures, including Verdant’s Occam and Freescale’s RCP technologies, demonstrate both the power and limitations of these approaches.
Further considerations for embedded components include yield management strategies, WEEE and ROHS concerns, system reliability, and supply chain restructuring. The course concludes by reviewing the drivers behind embedded active and passive components and analysis of multiple examples of today’s real life embedded component applications.
Who Should Attend
This course covers basic and advanced topics for product and design engineers, manufacturing, process and assembly/packaging engineers, engineering managers, senior design technicians, consultants and academic specialists as well as marketing and sales personnel requiring an understanding of the capabilities, implications, and options of embedded active and passive component technologies.
Topics Covered
- Embedded Component Drivers & Trends
- Embedding Active Components
- Embedding Passive Components
- Discrete passives
- Integral passives
- Commercial & Developmental Applications
- Technical & Business Implications for SMT Assemblers
- Process changes & revised yield management strategies
- Supply chain shift & value capture opportunities
- Cost Analysis for Embedded Components
- Embedded Packaging Intellectual Property Landscape
T16 Advanced PCB Troubleshooting: The Big, the Bad and the Ugly
Michael Carano, OMG Electronic Chemicals
(Instructor
Bios)
Monday, October 5
8:00am – 11:30am
What You Will Learn
This new course will address advanced problem solving of printed wiring board defects. Some defects, such as interconnect separation, delamination, wedge voids, plating folds, microvoids, surface pitting, and hole wall pull-away, carry significant costs. Many are difficult to solve because the root cause may not be readily apparent and multiple factors may contribute. This course will explore the most intricate of these factors, and how the interrelationship of both up and downstream processes contribute to scrap product. What effect does drilling have on hole wall quality and the subsequent metalization process? Participants will learn how to recognize problems like this and take corrective action before it is too late. The course will explore a myriad of electrodeposition defects, such as mouse bites, pitting, and domed or crown plating. Solderability and assembly related issues such as outgassing and blow holes will also be discussed. Participants should have some knowledge of the PCB fabrication process.
The course will conclude with a discussion on imaging, including liquid-photoimageable solder masks. Strategies to solve solder mask peeling, poor circuit trace coverage, skips, bubbles, and poor adhesion in nickel gold plating will be discussed in detail. Solder mask equipment and its effect on soldermask quality will also be explored.
Who Should Attend
Attendees will learn that these most devastating, yield-reducing defects are often not apparent in their root cause. Participants will see first hand that defects that manifest themselves in one process may have their origin several process steps back. Participants should have some knowledge of the PCB fabrication process.
Topics Covered
Lamination and Other Multiplayer Related Defects
Electrodeposition Defects: mouse bites, pitting, nodules, crown or dome plating, dog bone defects
Copper Plating Reliability
How to improve plating distribution & throwing power
Metalization: microvoids/voiding, interconnect separation, hole wall pullaway, glass coverage, metalizing high performance resins, wedge voids
Solderability & Assembly Issues
Why assemblers want to blame the fabricators for defects
Black pad phenomenon: new details on its cause & how to eliminate it
Issues effecting solder hole fill & solder paste spreadability
Effect of reflow profile and flux on solderability
Imaging: defects, surface preparation, soldermask issues & defects, process control
Business Issues - Monday
T17 Counterfeit Component-Causes and Cure
Bob Willis, ASKbobwillis.com
(Instructor
Bios)
Monday, October 5
1:30pm – 5:00pm
What You Will Learn
Quality, purchasing, design, and production engineers need to review the growing commercial and technical issues surrounding counterfeit electronic components. They can look right, solder to the PCB, but just fail to function. A typical first assumption by test engineering, it’s a component failed due to the assembly process, but it’s what’s inside the package that counts, sometimes its nothing at all. Rather than making complicated copies of parts, the simplest thing is to remark the packaging or the component body. Remarking the packaging is simple and quick, provided the component identification is not checked; all the parts would be placed and soldered to the board before the problem was identified. AOI should find incorrectly marked or variations on the parts but the level of sophistication in marking is now becoming very sophisticated.
The course will not only illustrate the problems raised by counterfeit components within the
electronics industry but it will also show you some of the different test methods that can be used to confirm the integrity of the components. Failure analysis techniques are now frequently being used to see if components are what they say they are rather than finding failure modes. Regular workshops with ITRI innovation in the UK show that counterfeiting is on the increase, we can find them, and there is no hiding place! The course also includes a FREE set of 28 wall charts covering testing and counterfeit avoidance procedures for each delegate to use on site.
Who Should Attend
This workshop is designed for design, process, and quality engineers responsible for introducing procedures and testing to avoid the counterfeit components being integrated to products. Much of the material presented is extremely visual and practical making it ideal for manufacturing staff, like all the instructors workshops it not just theory, it’s a “How to Do It Session”.
Topics Covered
Component trends in industry
Counterfeit avoidance strategy
Component identification check sheet
Component obsolescence
Impact of lead-free on component availability
Typical examples of component counterfeits
Guidelines on reducing the possibility of counterfeits
The different types of counterfeit
Mechanical testing component packaging
Destructive and non-destructive
Electrical testing of components
Visual & microscopic inspection
Solvent testing
XRF techniques
X-ray inspection of passive and active parts
Practical examples of counterfeit components found
Using free on-line defect database
THURSDAY,
October 8
Manufacturing - Thursday
**SMTA's 25th Anniversary gift to everyone who has registered for the SMTAI Conference. You DO need to register for the course to ensure adequate handouts, but there is NO CHARGE for this practical course presented by STAR instructor, Rob Rowland.**
T18 Pb-free Reflow and Wave Soldering Yield Improvement
Rob Rowland, RadiSys Corporation
(Instructor
Bio)
Thursday, October 8
8:00am – 11:30am
What You Will Learn
Surface mount and through hole soldering processes are challenging and Pb-free soldering adds another level of complexity. This workshop identifies and examines the critical process parameters associated with Pb-free reflow and wave soldering. Participants will examine these processes from multiple viewpoints including components, substrates, flux, solder alloys and the equipment. The goal is to successfully merge these topics into robust Pb-free reflow and wave soldering processes. Each topic uses a “what changed” approach to examine the differences between SnPb and Pb-free soldering plus the basic theory of operation, recommended operating parameters, monitoring and measuring concepts, and related industry standards.
Soldering profiles should be based on the physical and chemical parameters that influence the soldering process; they should not be developed by trial and error and they should not be tweaked after they have been approved. Reflow soldering profiles are influenced by zone temperature settings and conveyor speed. Wave soldering profiles are influenced by preheat temperature, solder pot temperature and conveyor speed. A time and temperature soldering profile strategy must be developed before a reflow or wave soldering method is defined or equipment is selected. Infrared dominant ovens typically required PCBA specific reflow soldering profiles. Convection dominant ovens are more flexible – a few reflow soldering profiles can cover a range of PCBAs. Wave soldering machine design has not changed much over the past decade but there are some important changes associated with Pb-free wave soldering, especially solder pot and solder alloy compatibility.
Four critical factors – substrates, components, flux, and solder – influence soldering profiles. This workshop will cover these topics plus time and temperature profiles, zone and preheat parameters, conveyor speed calculation, profiling methods, profiling equipment and mixed alloy (Sn/Pb and Pb-free) soldering. The reliability of Pb-free substrates and solder joints are key concerns; reliability testing and failure analysis for both of these topics will be covered. In particular, substrate (PCB) reliability has been hit hard by the transition to Pb-free. Another interesting Pb-free topic, tin whiskers, will also be covered in detail. A list of reflow soldering, wave soldering and inspection equipment suppliers is included.
Who Should Attend
This course is intended for individuals who are involved in the transition to Pb-free reflow and wave soldering. The information presented in this workshop will be beneficial to anyone involved with Pb-free reflow and wave soldering including engineers, operators, and managers. Some basic knowledge of surface mount technology is helpful but not essential.
Topics Covered
Steps to creating reflow and wave profiles
Component peak temperature
Component ramp up and ramp down rates
Component surface finish
Tin whisker theory and risk
Moisture sensitive devices
PCB glass transition temperature
PCB coefficient of thermal expansion
PCB material decomposition temperature
PCB time to delamination
PCB surface finish
Flux activation temperature and time
Rosin, water soluble and no-clean flux
Flux classification per J-STD-004
SnPb and Pb-free solder alloy options
Pb-free solder joint appearance
SnPb and Pb-free soldering scenarios
Mixed alloy (Sn/Pb and Pb-free) soldering
Pb-Free BGAs with SnPb Solder
Solder paste basics per J-STD-005
Stencil apertures and wetting after reflow
Reflow and wave soldering phases
Reflow and wave soldering profiles
Conveyor speed calculation
Reflow oven zone settings
Pb-free solder pots
Pb-free substrate (PCB) reliability
Pb-free solder joint reliability
Voiding and head in pillow defects
Pad cratering and CAF defects
Related industry standards
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