The following Evolving Technologies Summit and symposia feature paper sessions and panel discussions organized by industry experts, and they are included with either a VIP or Technical Conference registration.
Please note that speakers with a icon are recognized as Speakers of Distinction. Over the past 15 years they have been identified by SMTAI attendees as giving the strongest technical presentations. Congratulations to each of these authors for a job exceptionally well done.
Evolving Technologies Summit
FREE with a VIP or Technical Conference Registration!
Organized by Reza Ghaffarian, Ph.D., Jet Propulsion Laboratories, Lars Böettcher, Fraunhofer IZM Berlin, and Steve Greathouse, Plexus Corp.
Monday, September 29 | 8:30am - 5:00pm | Room 48
Chair: Charles Woychik, Ph.D., Invensas Corporation
Co-Chair: Reza Ghaffarian, Ph.D., Jet Propulsion Laboratories
Monday, September 29 | 8:30am - 10:30am | Room 48
The goal of reducing size, weight, and power (SWaP) necessitates designs that increase functionality while, at the same time, further miniaturization. Embedded technology allows the designer to meet these objectives but, it is not without its challenges. This session examines advancements being made in the use of embedded components. The presentations will begin with an analysis of embedded passive devices that have had their use envelope extended to high frequency applications. Follow-on papers consider embedded active devices that include SiC and GaN for high-power assemblies. Device construction, circuit board materials, and interconnection technologies are all critical to the successful execution of embedded technologies in these more demanding applications.
PCB Design and Fabrication Process Variations for Embedding Passive and Active Components
Vern Solberg, Solberg Technical Consulting
Embedded Passive Technology Materials, Design and Process
Hikmat Chammas, Honeywell
Power Overlay (POL) - Advanced Embedding Packaging Technology Platform
Arun Gowda, Ph.D., Risto Tuominen, and Paul McConnelee, GE Global Research
Embedding of Power Semiconductors for Innovative Packages and Modules
Lars Böttcher, S. Karaszkiewicz and A. Ostmann, Fraunhofer IZM Berlin, and D. Manessis, TU Berlin
How Will Additive Manufacturing Effect Electronics Manufacturing?
Chair: Irene Sterian, P.E., Celestica Inc.
Co-Chair: Reza Ghaffarian, Ph.D., Jet Propulsion Laboratories
Monday, September 29 | 11:00am - 12:30pm |
Additive manufacturing or 3D printing is rapidly changing the way we prototype and manufacture plastic and metal parts. Will electronics manufacturing be influenced and impacted by this disruptive technology? In this session, three presentations will explore the advances in printed electronics, whether incorporated into the 3D structures, or using new materials, and processes. Printed electronics may become as disruptive a technology, especially when combined with additive manufacturing.
An Update on Manufacturing with Additive Processes
Dan Gamota and Girish Wable, Jabil Circuit, Inc.
Overview of Printed Electronics for PCB/SMT Industry
Happy Holden, Gentex Corporation (Retired)
Turning Printed Circuit Boards Into Printed Circuit Structures Using 3D Printing
Kenneth Church and Xudong Chen, nScrypt Inc.; Paul Deffenbaugh, Casey Perkowski, Sam LeBlanc, Sciperio Inc.; Eduardo Rojas and Thomas Weller, University of South Florida.
ET Keynote Lunch
Chair: Reza Ghaffarian Ph.D., Jet Propulsion Laboratory
Monday, September 29 | 12:30pm - 2:00pm |
Embedded Technology, Why Now?
Jan Vardaman, TechSearch International, Inc.
*To ensure an adequate number of lunches, you must pre-register in advance by checking "Evolving Technologies Summit" (Monday) on the registration form.
Understanding Your Next Generation Adhesives – Using Nano Fillers
Chair: Steve Greathouse, Plexus Corp.
Co-Chair: Lars Böettcher, Fraunhofer IZM Berlin
Monday, September 29 | 2:00pm - 3:00pm |
Conductive adhesives based on nano-technologies are revolutionizing the methods of connecting electronic materials and components by showing improved service temperature, thermal conductivity, electrical conductivity, and reliability. An overview of how nanoparticles can alter the mechanical properties (i.e., stiffness), electrical properties (i.e., conductivity), material properties (i.e., permeability, glass transition temperature), and fracture performance is outlined. Nano particles are in your future products. Come see how to start using them in your application.
Understanding Nano-Sized Fillers in Conductive Adhesives
Herb Neuhaus, Ph.D. and Charles Bauer, Ph.D., TechLead Corporation
Low Porosity Pressureless Sintering of Novel Nano-Ag Paste For Die Attach
Ning-Cheng Lee, Ph.D., Sihai Chen, Guangyu Fan, Xue Yan and Lee Kresge, Indium Corporation
Evolving Technologies Panel: Covering Key Technologies Including: Embedded Actives/Passives, 3D/TSV, Printed Electronics, Advanced Packaging Trends, EMS Trends, and Lead-Free Status
FREE BEER AND PRETZELS!
Chair: Reza Ghaffarian, Ph.D., Jet Propulsion Lab
Co-Chair: Paul Wang, Ph.D., Mitac International
Monday, September 29 | 3:30pm - 5:00pm |
Lars Böttcher, Fraunhofer IZM Berlin
Steve Greathouse, Plexus Corp.
Happy Holden, Gentex Corporation (Retired)
Irene Sterian, P.E., Celestica, Inc.
E. Jan Vardaman, TechSearch International
Paul Vianco, Ph.D., Sandia National Labs
Chuck Woychik, Ph.D., Invensas
Harsh Environments Symposium
FREE with a VIP or Technical Conference Registration!
Organized by John Evans, Ph.D.,
and Pradeep Lall, Ph.D., Auburn University; Robert Kinyanjui, Ph.D., John Deere Electronic Solutions
Monday, September 29 | 8:30am - 5:00pm | Room 45
(Note: this symposium continues on Tuesday)
Harsh Environment Challenges with Lead-Free Solder
Chair: John Evans, Ph.D., Auburn University
Co-Chair: Dock Brown, DfR Solutions
Monday, September 29 | 8:30am - 10:00am
This session investigates the issues concerning the insertion of lead free solder materials in harsh environment applications. This includes alternatives to SAC305 solder materials.
Component Level Reliability for High Temperature Power Computing with SAC305 and Alternative High Reliability Solders
Sivasubramanian Thirugnanasambandam, Ph.D., Auburn University
Can Sintered Silvers be Used in Surface Mount Applications
Chris Hunt, Ph.D., National Physical Laboratory
Measurement of the High Strain Rate Mechanical Behavior of SAC305 Alloy at Product Operating Temperature and Derivation of Anand Viscoplasticity Constants
Pradeep Lall, Ph.D., Di Zhang and Vikas Yadav, Auburn University; David Locker, US Army RDECOM
Thermal Solutions for Power Electronics
Chair: Pradeep Lall, Ph.D., Auburn University
Co-Chair: Marie Cole, IBM Corporation
Monday, September 29 | 10:30am - 12:00pm
Power electronics has found wide applications in automotive electronics. Electronic systems in automotive applications may be subjected to high temperatures over extended periods of time. In this session, thermal management, interconnect, and component deployment solutions for sustained reliable operation in automotive environments will be discussed. The first paper deals with the use of die attach materials for thermal management of high power modules. The second and third papers deal with interconnects for high temperature applications.
Die Attach Material as a Solution to Improve Thermal Performance of High Power Modules
Mohammed Mansi, Bruce Fried, Ross Havens, Daryl Santos, Krishnaswami Srihari and Julia Zhao, Binghamton University
High Temperature Interconnects for Power Electronics
Hans-Juergen Albrecht, Ph.D., Siemens AG
New Interconnection for High Temperature Application: HotPowCon (HPC)
Joerg Trodler, Heraeus Materials Technology GmbH & Co. KG and A. Fix, Robert Bosch and M. Nowottnick, University of Rostock
Reliability of Pb-Free Electronics in Harsh Environments
Chair: Robert Kinyanjui, Ph.D., John Deere Electronic Solutions
Co-Chair: Raiyo Aspandiar, Ph.D., Intel Corporation
Monday, September 29 | 1:30pm - 3:00pm
The first paper opens this session by looking at the effect of silver composition on high strain-rate fracture of Pb-free Tin-Silver-Copper (SAC) solder joints. The paper next discusses the critical strain energy release rate for crack initiation for SAC305, SAC0807 and SAC0307 Pb-free solder joints. The second paper presents results of accelerated thermal cycle tests (-55°C/125°C) of Pb-free DDR3 SDRAMs (in BGA packaging format), with and without high-Tg underfill materials. The third paper concludes the session by presenting modeling results of board-level life prediction based on accelerated thermal cycling and materials aspects.
Effect of Solder Alloy, Aging and TAL on High Strain-Rate Fracture of Lead-Free Solder Joints
Amir Nourani and Jan K. Spelt, University of Toronto
Impact of Solder Interconnect Geometry Modeling on Reliability Assessment Results of Electronic Assemblies
Jingsong Xie, Ph.D., RelEng Technologies, Inc.
Temperature Cycling in Electronics
Cheryl Tulkoff and Tom O'Connor, DfR Solutions
Protecting Your Electronics Under Harsh Environment Conditions
Chair: Scott Priore, Cisco Systems, Inc.
Co-Chair: Rod Howell, Libra Industries
Monday, September 29 | 3:30pm - 5:00pm
These papers will look at several harsh conditions and propose ways in mitigating the effects they have on your electronics. From using Anti Sulfuric Resistor (ASR) to BGA protection, you will see what others have done to understand and reduce the environment's impact.
Mitigation of Resistor Silver Sulfide Corrosion Through Design and SMT Process Optimization
Marie Cole, Biao Cai and Jing Zhang, IBM Corporation; Bae Byung Kwon, Jang In Seok, Ryu Jang Hwan and DongChul Gack, SK Hynix
Silver Sulfidation Kinetics in Flowers of Sulfur Environment
Barry Hindin, Battelle and Michah Pledger, HzO, Inc.
Hydrophobic Coatings as an Approach for Preventing Corrosion Under BGAs
J.D. Clifton, P.A. Panackal and K.F. Schoch Jr., Northrop Grumman Electronic Systems
Reliability and Qualification Considerations for Today's High Performance Electronic Assemblies
Chair: Scott Nelson, Harris Corporation
Co-Chair: Polina Snugovsky, Ph.D., Celestica, Inc.
Tuesday, September 30 | 11:00am - 12:30pm
Lead-free solder, wire-bondable substrate finishes, area array components, component miniaturization, and high density assembly are just a few of today’s material and process concerns facing the high performance electronics assembly industry. Proper qualification and implementation of these technologies is crucial to their insertion into high performance electronics used in modern automotive, medical, military, avionics, and space applications.
Effect of Gold and Copper on AuSn4 Redeposition and Isothermal Durability of SAC305 Solder Joints
Subhasis Mukherjee and Abhijit Dasgupta, University of Maryland College Park; Julie Silk, Keysight Technologies and Lay-ling Ong, Keysight Technologies Malaysia
Assessment of the Effect of Mean Temperature on Thermal Cycling Reliability of SAC Solder Joints Using Leading Indicators of Failure
Pradeep Lall, Ph.D. and Kazi Mirza, Auburn University
Flip Chip Component Technology Qualification for High Performance Avionics Products
David Hillman, Ross Wilcoxon, Lauren Schlueter and Ryan Walker, Rockwell Collins; Mario Scalzo and Dela Lara, Indium Corporation
Lead-Free Soldering Technology Symposium
Organized by Paul Vianco, Ph.D., Sandia National Laboratories, and Matthew Kelly, P. Eng., MBA, IBM Corporation
Thursday, October 2 | 8:00am - 5:00pm | Room 49
Free with a VIP or Technical Conference Registration!
Material Evaluation for High Reliability Applications: A.R.E.A. Consortium
Chair: Richard Coyle, Ph.D., Alcatel-Lucent
Co-Chair: Matthew Kelly, P.Eng., MBA, IBM Corporation
Thursday, October 2 | 8:00am - 9:30am
This session provides attendees with a snapshot into some of the material selection options for high reliability RF and high speed product design. Material aspects such as laminate material, surface finish, and TIMs are evaluated. In this case, results from various accelerated tests are interpreted and discussed such as specific laminates are evaluated for cratering resistance, the impact of surface finishes on solder joint reliability are compared in thermal cycling reliability and microstructure, and TIM thermal resistance measurements were compared to data published by the manufacturer.
A.R.E.A. - Low Loss Laminate Material Pad Cratering Resistance Resistance
Michael Meilunas and Martin Anselm, Ph.D., Universal Instruments Corporation
A.R.E.A. - Effect of PCB Surface Finish on Sn Grain Morphology and Thermal Fatigue Performance of SnPb and Lead Free Solder Joints
Babak Arfaei, Ph.D., Francis Mutuku and Martin Anselm, Ph.D., Universal Instruments Corporation
A.R.E.A. - Component Level Testing of Thermal Interface Materials
Harry Schoeller, Ph.D. and Martin Anselm, Ph.D., Universal Instruments Corporation
On-Going, Lead-Free Research, Development and Knowledge Sharing Priorities
Chair: Matthew Kelly, P.Eng., MBA, IBM Corporation
Co-Chair: Paul Vianco, Ph.D., Sandia National Laboratories
Thursday, October 2 | 10:00am - 11:30am
Even with the significant progress made to date, there are still several key areas of R&D and knowledge sharing that remain as portions of the industry continue their transition to lead-free solder assembly. Several market segments continue to learn more about reliability implications and risk mitigation options for tin whiskers, temperature sensitive components, and assembly chemistry electro-migration. This session brings together these topics in three publications from the IPC PERM (Pb-free Electronics Risk Mitigation) Council, HDPug (High Density Packaging User Group), and leading research from an industry materials and solder manufacturer. Together, they encompass today's on-going lead-free R&D and knowledge sharing priorities.
Recalling the Lead-Free Manhattan Project: Pb-free Technology Knowledge Gaps Priorities
Anthony Rafanelli, Ph.D., P.E., Raytheon Company and Linda Woody, Lockheed-Martin
Process Sensitive Components Guideline-a Primer for the Industry
Marie Cole, Curtis Grosskopf, Michelle Lam, and Michael Lauri, IBM Corporation; David Geiger, Flextronics; Holly-Dee Rubin, Alcatel-Lucent; Thilo Sack, Celestica; Mike Bixenman, Kyzen Corporation; Laurence Schultz and James Wilcox, HDPUG
"Smart" Chemistry Towards Highly Efficient Soldering Material Formulation
Yanrong Shi, Ph.D. and Xiang Wei, Ph.D., Kester Inc.
Tin Whisker Research and Mitigation
Chair: Jeff Kennedy, Celestica Inc.
Co-Chair: Elizabeth Benedetto, Hewlett-Packard
Thursday, October 2 | 12:30pm - 2:30pm
Pb-Free challenges for high reliability products are driving research to explore solutions that will reduce the risk of tin whiskers causing short circuits. This session will give an overview of the problem and summaries of the current research being done to understand tin whisker formation and growth mechanisms as well as novel and unique conformal coating material developments to mitigate the risk that will contain or alter the surface growth mechanisms to lower the risk to an acceptable value.
Risk and Mitigation for Tin Pest and Tin Whiskers
Ronald Lasky, Ph.D., P.E., Indium Corporation
Strategic Environmental Research and Development Program (SERDP) Tin Whisker Testing and Modeling: Tin Whisker Growth on SAC305 Assemblies
Stephan Meschter, Ph.D., BAE Systems; P. Snugovsky, J. Kennedy, Z. Bagheri and E. Kosiba, Celestica, Inc.
Tin Whisker Inorganic Coating Evaluation (TWICE)
David Hillman, Dan Grossman, Ross Wilcoxon and Nate Lower, Rockwell Collins
Strategic Environmental Research and Development Program (SERDP) Nanoparticle Enhanced Conformal Coating for Whisker Mitigation
Stephan Meschter, Ph.D., BAE Systems; Junghyun Cho and Suraj Maganty, Binghamton University; Dale Starkey, Mario Gomez and David Edwards, Henkel Electronic Materials; Abdullah Ekin and Kevin Elsken, Bayer Material Science; Jason Keeping, Polina Snugovsky, Ph.D., Eva Kosiba, Zohreh Bagheri, and Jeff Kennedy, Celestica
Lead-Free Solder Joint Reliability
Chair: Paul Vianco, Ph.D., Sandia National Laboratories
Co-Chair: Kola Akinade, Ph.D., Cisco Systems, Inc.
Thursday, October 2 | 3:00pm - 5:00pm
As Pb-free soldering makes further inroads into the high-reliability electronics community, solder joint reliability modeling is taking on many new and exciting pathways. The papers in this session include a re-examination the Norris-Landzberg model that had its beginnings in some of the earliest efforts to predict Sn-Pb fatigue. The second presentation describes the ability to adapt the constitutive model to the microstructural evolution of the solder as a means to improve the fidelity of the predictions. The last two papers summarize an important iNEMI test program that investigated, specifically, the effect of silver (Ag) content on the thermal mechanical fatigue and drop shock resistance of Sn-Ag-Cu solders.
A Closed-Form Norris-Landzberg Solder Reliability Model
Emad Al-Momani, Ph.D., Intel Corporation
Microstructurally Adaptive Constitutive Relations and Reliability Assessment Protocols for Lead Free Solder
Peter Borgesen, Ph.D. and E. Cotts, Binghamton University; I. Dutta, Washington State University
INEMI PB-Free Alloy Characterization Project Report: Part VIII – Thermal Fatigue Results for High-AG Alloys at Extended Dwell Times
Richard Coyle, Ph.D., Alcatel-Lucent; Richard Parker, Delphi; Keith Howell and Keith Sweatman, Nihon Superior Co. Ltd.; Aileen Allen and Elizabeth Benedetto, Hewlett-Packard Co., Stuart Longgood, Delphi and Joseph Smetana, Alcatel-Lucent
iNEMI PB-Free Alloy Characterization Project Report: Part VII – Thermal Fatigue Results for Low-AG Alloys at Extended Dwell Times
Keith Sweatman, Nihon Superior Co., Ltd.; Richard Coyle, Ph.D., Alcatel-Lucent; Richard Parker, Delphi; Keith Howell, Nihon Superior Co. Ltd.; Elizabeth Benedetto and Aileen Allen, Hewlett Packard Co.; Joseph Smetana, Alcatel-Lucent; Stuart Longgood, Delphi; Weiping Lui, Indium Corporation and Julie Silk, Keysight Technologies
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