SMTA International

Conference: September 25-29, 2016
Exhibition: September 27-28, 2016

Donald Stephens Convention Center
Rosemont, IL, USA
More About SMTA


The following Evolving Technologies Summit and symposia feature paper sessions and panel discussions organized by industry experts, and they are included with either a VIP or Technical Conference registration.

Please note that speakers with a Speaker of Distinction icon are recognized as Speakers of Distinction. Over the past 15 years they have been identified by SMTAI attendees as giving the strongest technical presentations. Congratulations to each of these authors for a job exceptionally well done.


Evolving Technologies Summit
FREE with a VIP or Technical Conference Registration!
Organized by Reza Ghaffarian, Ph.D., Jet Propulsion Laboratories, Steve Greathouse, Plexus Corp. and Richard Coyle, Ph.D., Alcatel-Lucent
Monday, September 28 | 9:00am - 5:00pm

Co-Sponsored by


Alternate Alloys

Chair: Richard Coyle, Ph.D., Alcatel-Lucent
Co-Chair: Keith Sweatman, Nihon Superior Co., Ltd.
Monday, September 28 | 9:00am - 10:30am

Near-eutectic, high Ag SAC305 solder is the accepted choice for most electronic assembly applications, but some concerns have been raised over the performance of SAC305 in harsh thermal cycling environments, particularly if vibration and shock loading are involved. Additionally, there are problems associated with the high temperature processing required for SAC305, and the cost of high Ag alloys is an issue in some market segments. These recent observations and findings indicate that high Ag alloys are not an optimum or even acceptable solution for other applications. Further, it appears unlikely that a single-alloy solution may not exist across all electronic applications. These sessions share recent process and reliability work done on alloys being considered as alternatives to high Ag SAC305.

  • Comprehensive Report on Low Temperature Solder Alloys for Portable Electronics
    Morgana Ribas, Ph.D., Anil Kumar, Ranjit Pandher, Ph.D., Rahul Raut, Sutapa Mukherjee, Siuli Sarkar, Ph.D., and Bawa Singh, Ph.D., Alpha
  • Development and Characterization of Solder Pastes Based on Two Alternative Alloys: Bismuth-Tin-Silver (BiSn42Ag0.4-1%) for Low Temperature and Tin-Antimony (SnSb5-8.5) for High Temperature
    Emmanuelle Guéné, P.E., Inventec
  • Effect of Bi Content on Properties of Low Silver SAC Solders
    Mehran Maalekian, Ph.D., Yuan Xu, AIM Metals & Alloys; Karl Seelig, AIM Metals & Alloys


    Alternate Alloys (Continued)

    Chair: Richard Coyle, Ph.D., Alcatel-Lucent
    Co-Chair: Keith Sweatman, Nihon Superior Co., Ltd.
    Monday, September 28 | 11:00am - 12:30pm

  • Long Term Aging Effects on the Reliability of Lead Free Solder Joints In Ball Grid Array Packages With Various Pitch Sizes and Ball Alignments
    Cong Zhao, Chaobo Shen, Zhou Hai, Jiawei Zhang, M.J. Bozack, and J. L. Evans, Ph.D., Auburn University
  • Factors Impacting the Reliability of Ultra-Low Silver Lead-Free Alloys
    Speaker of DistinctionBrian Toleno, Ph.D., Neil Poole, Ph.D., Mark Curie, Ph.D., Henkel Electronic Materials LLC
  • Mechanical Shock and Drop Reliability Evaluation of the BGA Solder Joint Stack-Ups Formed by Reflow Soldering SAC Solder Ball BGAs with BiSnAg and Resin Reinforced BiSn Based Solder Pastes
    Olivia Chen, Al Molina, Kok Kwan Tang, Kevin Byrd, Scott Mokler and Raiyo Aspandiar, Ph.D., Intel Corporation

    ET Keynote Lunch

    Chair: Reza Ghaffarian Ph.D., Jet Propulsion Laboratory
    Monday, September 28 | 12:30pm - 1:30pm

    Wearables Technology - The Next Manufacturing Wave

    Murad Kurwa, Flex

    A new wave of wearables brings with it plenty of manufacturing and process development concerns. Kurwa will discuss substrate advances like stretchable conductive fabrics, interconnects, new sensor technology including printed sensors (ECG) and OLED, assembly concerns for flexible conductive adhesive and nano-sintering, and encapsulation techniques such as low pressure molding and water proof coating. New equipment like R2R printing and assembly, fabric laser cutting, and ultrasonic welding on fabric will be discussed. The presentation will also address how reliability testing has adapted with flexibility testing, washability, salt spray, and sweat testing.

    *To ensure an adequate number of lunches, you must pre-register in advance by checking "Evolving Technologies Summit" (Monday) on the registration form.


    Wearable Electronics Technology Development

    Chair: Alex Chen, Celestica Inc.
    Co-Chair: Brian Toleno, Ph.D., Microsoft
    Monday, September 28 | 1:30pm - 3:00pm

    Wearable electronics devices are expanding from fitness and wellness applications to almost anything, including health-tech and medical industry, automotive industry, security and defense industry. This brave new sector is propelled by technology advances and experiencing some growing pains – technological challenges, such as selecting the right interconnect technology, how to make textiles smart, or how to manufacture new and innovative high-mix products at high volume but low cost. The session on wearable electronics will bring insights on some exciting technological advances and ways of managing the challenges.

  • Smart Textiles for Wearable Technology
    Speaker of DistinctionChris Hunt, Ph.D., Roya Ashayer-Soltani and Kathryn Wills, National Physical Laboratory
  • Connector Design for Wearables
    Speaker of DistinctionRandy Schueller, Ph.D., DfR Solutions
  • Wearable Electronics & Big Data = High Volume, High Mix SMT!
    Speaker of DistinctionCharles E. Bauer, Ph.D. and Herbert J. Neuhaus, Ph.D., TechLead Corporation


    Evolving Technologies Panel: Covering Key Technologies Including: 3D Packaging Technology Trends, Emerging Technologies, Renewable Energy, Optics and Photonics, Wearable Electronics, and Next Generation PCBs for Embedded Technologies

    Chair: Reza Ghaffarian, Ph.D., Jet Propulsion Lab
    Co-Chair: Paul Wang, Ph.D., Mitac International
    Monday, September 28 | 3:30pm - 5:00pm

    Panelists include:
  • Lars Böttcher, Fraunhofer IZM Berlin
  • Richard Coyle, Ph.D., Alcatel-Lucent
  • Steve Greathouse, Plexus Corp.
  • Irene Sterian, P.E., Celestica, Inc.
  • Chuck Woychik, Ph.D., Invensas Corporation

  • Harsh Environments Symposium
    FREE with a VIP or Technical Conference Registration!
    Organized by Robert Kinyanjui, Ph.D., John Deere Electronic Solutions, John Evans, Ph.D. and Pradeep Lall, Ph.D., Auburn University
    Monday, September 28 | 8:00am — 3:00pm
    Tuesday, September 29 | 11:00am - 4:00pm
    (Note: this symposium continues on Tuesday)


    Reliability of Components in Harsh Environments

    Chair: Matt Kelly, P.Eng., MBA, IBM Corporation
    Co-Chair: Robert Kinyanjui, Ph.D., John Deere Electronic Solutions
    Monday, September 28 | 8:00am — 10:00am

    Reliability of Lead-Free assembled hardware continues to be a focus item for a variety of harsh environment applications including deep well drilling, automotive under the hood, and avionics. This session examines hardware reliability performance including mirrored memory with underfill configurations, isothermal fatigue of doped lead-free alloys, and mechanical vibration conditions. Application needs, field use simulation conditions, and resulting failure analysis will be discussed.

  • Thermal Shock Reliability Test on Multiple Doped Low Creep Lead Free Solder Paste and Solder Ball Grid Array Packages
    Anto Raj, Sivasubramanian Thirugnanasambandam, Thomas Sanders, Sharath Sridhar, John Evans, Ph.D., and Michael Bozack, Ph.D., Auburn University; Wayne Johnson, Ph.D., Tennessee Tech University
  • Solder Joint Fatigue Characterization of DDR3 SDRAMs and Other Advanced BGA Packaging Memory Types
    Arnaud Grivon, Damien Baudet, Michel Brizoux, Aurélien Lecavelier and Wilson Maia, Thales Global Services
  • Avionics Vibration Durability Between Sn-Pb and Lead-free Solder Interconnects
    Speaker of DistinctionJoseph Juarez, Ph.D., Honeywell International
  • Isothermal-Fatigue of High-Temperature Solder Joints
    Harry Schoeller, Ph.D., Universal Instruments Corporation


    Electronics in Corrosive Environments

    Chair: Marie Cole, IBM Corporation
    Co-Chair: John Evans, Ph.D., Auburn University
    Monday, September 28 | 10:30am — 12:30pm

    Electronics in data centers that may have harmful environments resulting from the ingress of outdoor particulate and/or gaseous contamination can be at risk for corrosion. Supplying robust hardware for these data centers, mostly in emerging markets, can be a challenge if the risk of corrosion failures is not well understood. In this session, you will learn about the corrosion risk associated with various PCB finishes and memory module components, how to mitigate corrosion risks for electronics. and methods to predict field performance in high sulfur environments through accelerated laboratory testing.

  • Sulfur Corrosion of Printed Circuit Board Surface Finishes in Three Different Sulfur-Rich Environments
    Matthew Weeks, Ph.D. and David J. Zueck, Western Digital Technologies, Inc.
  • Testing Printed Circuit Boards for Creep Corrosion in Flowers of Sulfur Chamber: Phase 2
    Haley Fu, iNEMI; Prabjit Singh, IBM Corporation; Aamir Kazi and Wallace Ables, Dell Corporation; Dem Lee and Jeffrey Lee, iST-Integrated Service Technology, Inc.; Karlos Guo and Jane Li, Lenovo (Beijing) Limited Corporation; Simon Lee and Geoffrey Tong, The Dow Chemical Company
  • The Corrosion Failure Risk Assessment of Memory Module at Data Center in Harsh Environmental Conditions
    Sungwon Han and Yuchul Hwang, Samsung Electronics; Biao Cai and Marie Cole, IBM Corporation
  • An Attempt to Study the MFG Test Pollutant Chemistry Effect to Match Filed Data
    Vasu Vasudevan, Karumbu Meyyappan, Anil Kurella, Karl Pazdernik, and Balu Pathangey, Intel Corporation

    HE Keynote Lunch

    Chair: Pradeep Lall, Ph.D., Auburn University
    Monday, September 28 | 12:30pm — 1:30pm

    Extreme Environment Electronics - Where We've Been, Where We Are Going and What Could Be Next

    Jim Springer, John Deere Electronic Solutions

    To feed the world population in 2050 it is estimated the current agricultural production must double. Technology is critical to increasing agricultural equipment's utilization and output leading to more efficient farming methods and improved yields. The quality and reliability of electronics used for precision guidance, sensing, controlling engines and other key technologies is essential to optimizing equipment performance. Improving reliability in electronics used in farming is challenging, both in electronic design and manufacturing as well as material selection. This has become more apparent following the global transition of electronic manufacturing from the conventional leaded component technology to lead-free technology. Jim will provide a genesis and the evolution of electronics designed for use in harsh physical and electrical environments, particularly those used in farming and automotive industries. Examples of ruggedization protocols will be discussed.

    *To ensure an adequate number of lunches, you must pre-register in advance by checking “Harsh Environments Summit” (Monday) on the registration form.


    Materials for Harsh Environments

    Chair: Raiyo Aspandiar, Ph.D., Intel Corporation
    Co-Chair: Iulia Muntele, Ph.D., Sanmina Corporation
    Monday, September 28 | 1:30pm — 3:00pm

    The requirements and demands placed on heat sinking and soldering materials for applications in aerospace, automotive, defense and telecommunication electronic products are far more stringent than other industries. This session will describe newly developed solder alloys, solder pastes and evaluate promising thermal pastes for use in harsh environments prevalent for these industries.

  • Assessment of Thermal Pastes for Use in Space Electronics
    Jeff Jennings, Susan M. Marlowe and Peter F. Ruggiero, Harris Corporation
  • Novel Lead-Free Solder Alloys Development for Automotive Applications
    Weiping Liu, Ph.D., *Ning-Cheng Lee, Ph.D. and, Indium Corporation
  • Low Voiding, High Reliability Solder Paste for Automotive, LED and Other Demanding Applications
    Rahul Raut, Westin Bent and Michael Liberatore, Alpha, an Alent plc Company



    Electronics Ruggedization Through Coating

    Chair: Chair: Iulia Muntele, Ph.D., Sanmina Corporation
    Co-Chair: Pradeep Lall, Ph.D., Auburn University
    Tuesday, September 29 | 11:00am - 12:30pm

    Whether it is protection from hostile environments (temperature and/or pressure extreme values, humidity, corrosive atmosphere, UV light, shock and/or vibration), or to aid in the electrical design parameters of a PCBA, conformal coating has been the method of choice for designers. Despite a wide range of coating materials availability, ongoing research efforts continue to close gaps and expand the quest for lighter, easier application and reworkable materials. Both consumer and high-reliability electronics benefit from the results of these research efforts. This session’s presentations bring forth the data acquired in recent investigations of epoxy, silicone, parylene, fluoropolymer coatings, and highlight their applicability in harsh environments with hard to control temperature and moisture levels.

  • Ultrathin Fluoropolymer Coatings to Mitigate Damage of Printed Circuit Boards Due to Environmental Exposure Electronics
    Erik Olson, Molly Smith, Greg Marszalek and Karl Manske, 3M Company; Nikesh Dhar, Google
  • Characterization of Conformal Coatings
    Prabjit Singh, Ph.D., IBM Corporation
  • Ensuring Performance and Reliability of High Temperature Electronics Through Thermally Stable Parylene HT at Nano/Micro Levels
    Rakesh Kumar, Ph.D., Specialty Coating Systems, Inc.


    Thermal Management (Get the Heat Out!)

    Chair: Robert Kinyanjui, Ph.D., John Deere Electronic Solutions
    Co-Chair: Raiyo Aspandiar, Ph.D., Intel Corporation
    Tuesday, September 29 | 2:00pm - 4:00pm

    Efficient thermal relief is required in order to obtain expected performance of electronic components, especially those operating in high temperature environments. The Get the Heat Out session presents works on different heat management technologies as well as the unintended consequences of some thermal relief methods to the reliability of electronic components.

  • Design Considerations in the Use of Phase Change Materials in Data Center Cooling
    Jeff Luttrell, Abhishek Guhe and Dereje Agonafer, Ph.D., University of Texas - Arlington
  • Peak Temperature Limitation of Electronic Assemblies with Phase Change Materials
    Mathias Nowottnick, Andrej Novikov and Daniel Lexow, University of Rostock
  • High Efficient Heat Dissipation on Printed Circuit Boards
    Markus Wille, Schoeller Electronics GmbH
  • Defining Mechanical Load Limits for Thermal Solutions on High Performance fcBGA Packages
    *Brian Roggeman, Jintao Zheng, Mark Schwarz and Ahmer Syed, Qualcomm Inc.


    Lead-Free Soldering Technology Symposium
    Organized by Paul Vianco, Ph.D., Sandia National Laboratories, Matthew Kelly, P.Eng., MBA, IBM Corporation and Elizabeth Benedetto, Hewlett-Packard Company
    Thursday, October 1 | 8:00am - 4:30pm

    Free with a VIP or Technical Conference Registration!


    Universal Instruments Consortium Pb-Free Project Update

    Chair: Paul Vianco, Ph.D., Sandia National Laboratories
    Co-Chair: Matt Kelly, P.Eng., MBA, IBM Corporation
    Thursday, October 1 | 8:30am — 10:00am

    Consortia activities continue to fill the gaps in Pb-free technology and, in particular, long term reliability. This session begins with the results of a study to examine the effects of surface finishes on the reliability of Pb-free interconnections used with wafer-level, chip-scale packages (WLCSPs). The second presentation investigates the role of conformal coatings on the survivability of quad flat pack, no lead (QFN) packages when the latter are targeted for harsh environments applications. The session is rounded out with an analysis of new Pb-free die attach materials and their performance in thermo-mechanical conditions.

  • Metallization and Surface Finish Effects on Pb-free WLCSP Thermal Cycle Reliability
    Michael Meilunas and Speaker of DistinctionJim Wilcox, Universal Instruments Corporation
  • Harsh Environment Reliability of Micro-Leadframe (QFN) Components and Conformal Coating Effects
    Speaker of DistinctionJim Wilcox and Michael Meilunas, Universal Instruments Corporation; Martin Anselm, Ph.D., Rochester Institute of Technology
  • Thermo-Mechanical Evaluation of Alternative Pb-free Die Attach Materials
    Harry Schoeller, Ph.D., Universal Instruments Corporation, Sandeep Mallampati and Junghyun Cho, Ph. D., Binghamton University


    Corrosion and Flux Residue Impacts of Lead Free Solders

    Chair: Matthew Kelly, P.Eng., MBA, IBM Corporation
    Co-Chair: Richard Coyle, Ph.D., Alcatel-Lucent
    Thursday, October 1 | 10:30am — 12:00pm

    Today, electronic systems must operate in a wide variety of field conditions. These systems are now generally built using lead-free no-clean solders per EU RoHS regulations. Understanding environmental corrosion and surface electromigration failure mechanisms is critical in ensuring reliable system performance. This session reports the latest research in better understanding corrosion and flux residue impacts relating to surface electromigration failure mechanisms.

  • Electronic Assembly Pitting / Crevice Corrosion Research
    Speaker of DistinctionMike Bixenman, DBA, Kyzen Corporation; Wallace Ables, Dell Computer; Richard Kraszewski, Plexus Corporation; Chin Siang Kelvin Tan, Julie Silk, Keysight Technologies; Keith Howell and Takatoshi Nishimura, Nihon Superior; Jim Hartzell, Enthone; Karl Sauter, Oracle; Robert Smith, HDPug
  • Critical Parameters of a No-Clean Process
    Terry Munson, Foresite, Inc.
  • Reactivity of No-Clean Flux Residues in Electronic Assemblies: A Systematic Study
    Bruno Tolla, Ph.D., Denis Jean , Hemal Bhasvar, Yanrong Shi, Xiang (Shawn) Wei, and Kyle Loomis, Kester, Inc.


    Research Challenges with Tin Whiskers and Mitigation

    Chair: Jeff Kennedy, Celestica Inc.
    Co-Chair: Elizabeth Benedetto, Hewlett-Packard
    Thursday, October 1 | 1:00pm — 2:30pm

    This session will explore the latest research initiatives in the areas of Tin Whiskers and mitigation. Continued examination from last year’s presentation of what promotes the Tin Whisker growth and the related risk associated with these fine metallic filaments for products in the high reliability products will be covered. Mitigation of the risk associated with these Tin Whiskers will also be discussed as well as some novel material developments using nano-particles in conformal coating. A presentation of what is required to use coating as a Tin Whisker mitigation method and how to perform the required material study to support this new performance objective for conformal coatings will conclude the session.

  • SERDP Nanoparticle Enhanced Conformal Coating Project: Modeling for Tin Whisker Mitigation
    Speaker of DistinctionStephan Meschter, Ph.D. and S. McKeown, BAE Systems; P. Snugovsky, Ph.D., J. Kennedy, Z. Bagheri, J. Keeping, P.E. and E. Kosiba, Celestica, Inc.; J. Cho, Binghamton University; David Edwards, Henkel LLC; K. Elsken, Bayer Material Science
  • Long Term Monitoring and Failure Detection of Tin Whiskers Bridging Adjacent Leads on SOIC Components
    Owen Thomas, *Chris Hunt, Ph.D., Martin Wickham, and Kate Clayton, National Physical Laboratory
  • Innovating the Microstructure of Polyurethane Conformal Coatings for Tin Whisker Mitigation
    Junghyun Cho, Ph.D. and Suraj Maganty, Binghamton University; Stephan J. Meschter, Ph.D., BAE Systems - Electronic Systems


    Lead-Free Solder Joint Reliability: Recent Advances

    Chair: Jean-Paul Clech, Ph.D., EPSI, Inc.
    Co-Chair: Kola Akinade, Ph.D., Cisco Systems, Inc.
    Thursday, October 1 | 3:00pm - 4:30pm

    Material and reliability experts will share recent findings on lead-free alloys and solder joint reliability characterization. Topics to be discussed include: the impact of test specimens on fracture properties; the effect of bismuth additions to SnCu alloys on solder joint reliability; and the effect of pre-conditioning and thermal cycling profiles on the reliability of test vehicles assembled with varied SAC solder compositions.

  • Effect of Test Specimen on Fracture Behavior of Lead-free Solder Joints
    Amir Nourani, Saeed Akbari and Jan K. Spelt, University of Toronto
  • A New Method of Increasing the Reliability of Lead-free Solder
    Takatoshi Nishimura, Keith Sweatman, Akira Kita and Shuhei Sawada, Nihon Superior Co., Ltd.
  • iNEMI Pb-Free Alloy Characterization Project Report: Part IX – Summary of the Effect of Isothermal Preconditioning on Thermal Fatigue Life
    Speaker of DistinctionRichard Coyle, Ph.D., Alcatel-Lucent; Richard Parker, iNEMI; Joe Smetana, Alcatel-Lucent; Elizabeth Benedetto, Hewlett Packard; Keith Howell and Keith Sweatman, Nihon Superior Co.; Weiping Liu, Indium Corporation; Michael Osterman, CALCE; Julie Silk, Keysight Technologies; Aileen Allen, Hewlett Packard; Mitch Holtzer, Alpha; Rafael Padilla and Tomoyasu Yoshikawa, Senju Metal Industry Co.

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