SymposiaThe following Evolving Technologies Summit and symposia feature paper sessions and panel discussions organized by industry experts, and they are included with either a VIP or Technical Conference registration.
Please note that speakers with a icon are recognized as Speakers of Distinction. Over the past 15 years they have been identified by SMTAI attendees as giving the strongest technical presentations. Congratulations to each of these authors for a job exceptionally well done.
Evolving Technologies Summit
FREE with a VIP or Technical Conference Registration!
Organized by Reza Ghaffarian, Ph.D., Jet Propulsion Laboratories, Steve Greathouse, Plexus Corp. and Richard Coyle, Ph.D., Alcatel-Lucent
Monday, September 28 | 9:00am - 5:00pm
Alternate AlloysChair: Richard Coyle, Ph.D., Alcatel-Lucent
Co-Chair: Keith Sweatman, Nihon Superior Co., Ltd.
Monday, September 28 | 9:00am - 10:30am
Near-eutectic, high Ag SAC305 solder is the accepted choice for most electronic assembly applications, but some concerns have been raised over the performance of SAC305 in harsh thermal cycling environments, particularly if vibration and shock loading are involved. Additionally, there are problems associated with the high temperature processing required for SAC305, and the cost of high Ag alloys is an issue in some market segments. These recent observations and findings indicate that high Ag alloys are not an optimum or even acceptable solution for other applications. Further, it appears unlikely that a single-alloy solution may not exist across all electronic applications. These sessions share recent process and reliability work done on alloys being considered as alternatives to high Ag SAC305.
Morgana Ribas, Ph.D., Anil Kumar, Ranjit Pandher, Rahul Raut, Sutapa Mukherjee, Siuli Sarkar and Bawa Singh, Alpha
Emmanuelle Guene, P.E., Inventec Performance Chemicals
M. Maalekian, Y. Xu, K. Seelig, AIM Solder
Alternate Alloys (Continued)Chair: Richard Coyle, Ph.D., Alcatel-Lucent
Co-Chair: Keith Sweatman, Nihon Superior Co., Ltd.
Monday, September 28 | 11:00am - 12:30pm
Cong Zhao, Chaobo Shen, Zhou Hai, Jiawei Zhang, M.J. Bozack, and J. L. Evans, Auburn University
Brian Toleno, Ph.D., Neil Poole, Ph.D., Mark Curie, Ph.D., Henkel Electronic Materials LLC
Olivia Chen, Al Molina, Kok Kwan Tang, Kevin Byrd, Scott Mokler and Raiyo Aspandiar, Ph.D., Intel Corporation
ET Keynote LunchChair: Reza Ghaffarian Ph.D., Jet Propulsion Laboratory
Monday, September 28 | 12:30pm - 1:30pm
Wearables Technology - The Next Manufacturing WaveMurad Kurwa, Flextronics International
A new wave of wearables brings with it plenty of manufacturing and process development concerns. Kurwa will discuss substrate advances like stretchable conductive fabrics, interconnects, new sensor technology including printed sensors (ECG) and OLED, assembly concerns for flexible conductive adhesive and nano-sintering, and encapsulation techniques such as low pressure molding and water proof coating. New equipment like R2R printing and assembly, fabric laser cutting, and ultrasonic welding on fabric will be discussed. The presentation will also address how reliability testing has adapted with flexibility testing, washability, salt spray, and sweat testing.
*To ensure an adequate number of lunches, you must pre-register in advance by checking "Evolving Technologies Summit" (Monday) on the registration form.
Wearable Electronics Technology DevelopmentChair: Alex Chen, Celestica Inc.
Co-Chair: Brian Toleno, Ph.D., Henkel Electronic Materials LLC
Monday, September 28 | 1:30pm - 3:00pm
Wearable electronics devices are expanding from fitness and wellness applications to almost anything, including health-tech and medical industry, automotive industry, security and defense industry. This brave new sector is propelled by technology advances and experiencing some growing pains – technological challenges, such as selecting the right interconnect technology, how to make textiles smart, or how to manufacture new and innovative high-mix products at high volume but low cost. The session on wearable electronics will bring insights on some exciting technological advances and ways of managing the challenges.
Chris Hunt, Ph.D., Roya Ashayer-Soltani and Kathryn Wills, National Physical Laboratory
Randy Schueller, Ph.D., DfR Solutions
Charles E. Bauer, Ph.D. and Herbert J. Neuhaus, Ph.D., TechLead Corporation
Evolving Technologies Panel: Covering Key Technologies Including: 3D Packaging Technology Trends, Emerging Technologies, Renewable Energy, Optics and Photonics, Wearable Electronics, and Next Generation PCBs for Embedded TechnologiesCOMPLIMENTARY BEER AND PRETZELS!
Chair: Reza Ghaffarian, Ph.D., Jet Propulsion Lab
Co-Chair: Paul Wang, Ph.D., Mitac International
Monday, September 28 | 3:30pm - 5:00pm
Harsh Environments Symposium
FREE with a VIP or Technical Conference Registration!
Organized by Robert Kinyanjui, Ph.D., John Deere Electronic Solutions, John Evans, Ph.D. and Pradeep Lall, Ph.D., Auburn University
Monday, September 28 | 8:00am — 3:00pm
Tuesday, September 29 | 11:00am - 4:00pm
(Note: this symposium continues on Tuesday)
Reliability of Components in Harsh EnvironmentsChair: Matt Kelly, P.Eng., MBA, IBM Corporation
Co-Chair: Robert Kinyanjui, Ph.D., John Deere Electronic Solutions
Monday, September 28 | 8:00am — 10:00am
Reliability of Lead-Free assembled hardware continues to be a focus item for a variety of harsh environment applications including deep well drilling, automotive under the hood, and avionics. This session examines hardware reliability performance including mirrored memory with underfill configurations, isothermal fatigue of doped lead-free alloys, and mechanical vibration conditions. Application needs, field use simulation conditions, and resulting failure analysis will be discussed.
Anto Raj, Sivasubramanian Thirugnanasambandam, Thomas Sanders, Sharath Sridhar, John Evans, Ph.D., Michael Bozack, Ph.D. and Wayne Johnson, Ph.D., Auburn University
Arnaud Grivon, Michel Brizoux, Damien Baudet, Aurélien Lecavelier and Wilson Maia, Thales
Joseph Juarez, Ph.D., Honeywell International
Harry Schoeller, Ph.D., Universal Instruments Corporation
Electronics in Corrosive EnvironmentsChair: Marie Cole, IBM Corporation
Co-Chair: John Evans, Ph.D., Auburn University
Monday, September 28 | 10:30am — 12:30pm
Electronics in data centers that may have harmful environments resulting from the ingress of outdoor particulate and/or gaseous contamination can be at risk for corrosion. Supplying robust hardware for these data centers, mostly in emerging markets, can be a challenge if the risk of corrosion failures is not well understood. In this session, you will learn about the corrosion risk associated with various PCB finishes and memory module components, how to mitigate corrosion risks for electronics. and methods to predict field performance in high sulfur environments through accelerated laboratory testing.
Matthew Weeks, Ph.D. and David J. Zueck, Western Digital Technologies, Inc.
Prabjit Singh, IBM Corporation; Haley Fu, iNEMI; Aamir Kazi and Wallace Ables, Dell Corporation; Dem Lee and Jeffrey Lee, iST-Integrated Service Technology, Inc.; Karlos Guo and Jane Li, Lenovo (Beijing) Limited Corporation; Simon Lee and Geoffrey Tong, The Dow Chemical Company; Tao Yoon, Hsien Taiwan
Sungwon Han, Samsung Electronics
Vasu Vasudevan, Karumbu Meyyappan, Anil Kurella, Karl Pazdernik, and Balu Pathangey, Intel Corporation
HE Keynote LunchChair: Pradeep Lall, Ph.D., Auburn University
Monday, September 28 | 12:30pm — 1:30pm
Extreme Environment Electronics - Where We've Been, Where We Are Going and What Could Be NextJim Springer, John Deere Electronic Solutions
To feed the world population in 2050 it is estimated the current agricultural production must double. Technology is critical to increasing agricultural equipment's utilization and output leading to more efficient farming methods and improved yields. The quality and reliability of electronics used for precision guidance, sensing, controlling engines and other key technologies is essential to optimizing equipment performance. Improving reliability in electronics used in farming is challenging, both in electronic design and manufacturing as well as material selection. This has become more apparent following the global transition of electronic manufacturing from the conventional leaded component technology to lead-free technology. Jim will provide a genesis and the evolution of electronics designed for use in harsh physical and electrical environments, particularly those used in farming and automotive industries. Examples of ruggedization protocols will be discussed.
*To ensure an adequate number of lunches, you must pre-register in advance by checking “Harsh Environments Summit” (Monday) on the registration form.
Materials for Harsh EnvironmentsChair: Raiyo Aspandiar, Ph.D., Intel Corporation
Co-Chair: Iulia Muntele, Ph.D., Sanmina Corporation
Monday, September 28 | 1:30pm — 3:00pm
The requirements and demands placed on heat sinking and soldering materials for applications in aerospace, automotive, defense and telecommunication electronic products are far more stringent than other industries. This session will describe newly developed solder alloys, solder pastes and evaluate promising thermal pastes for use in harsh environments prevalent for these industries.
Jeff Jennings, Susan M. Marlowe and Peter F. Ruggiero, Harris Corporation
*Ning-Cheng Lee, Ph.D. and Weiping Liu, Indium Corporation
Rahul Raut, Westin Bent and Michael Liberatore, Alpha, an Alent plc Company
Electronics Ruggedization Through CoatingChair: Chair: Iulia Muntele, Ph.D., Sanmina Corporation
Co-Chair: Pradeep Lall, Ph.D., Auburn University
Tuesday, September 29 | 11:00am - 12:30pm
Whether it is protection from hostile environments (temperature and/or pressure extreme values, humidity, corrosive atmosphere, UV light, shock and/or vibration), or to aid in the electrical design parameters of a PCBA, conformal coating has been the method of choice for designers. Despite a wide range of coating materials availability, ongoing research efforts continue to close gaps and expand the quest for lighter, easier application and reworkable materials. Both consumer and high-reliability electronics benefit from the results of these research efforts. This session’s presentations bring forth the data acquired in recent investigations of epoxy, silicone, parylene, fluoropolymer coatings, and highlight their applicability in harsh environments with hard to control temperature and moisture levels.
Erik Olson, Molly Smith, Greg Marszalek and Karl Manske, 3M Company
Prabjit Singh, Ph.D., IBM Corporation
Rakesh Kumar, Ph.D., Specialty Coating Systems, Inc.
Thermal Management (Get the Heat Out!)Chair: Robert Kinyanjui, Ph.D., John Deere Electronic Solutions
Co-Chair: Raiyo Aspandiar, Ph.D., Intel Corporation
Tuesday, September 29 | 2:00pm - 4:00pm
Efficient thermal relief is required in order to obtain expected performance of electronic components, especially those operating in high temperature environments. The Get the Heat Out session presents works on different heat management technologies as well as the unintended consequences of some thermal relief methods to the reliability of electronic components.
Jeff Luttrell, Abhishek Guhe and Dereje Agonafer, Ph.D., University of Texas - Arlington
Mathias Nowottnick, Andrej Novikov and Daniel Lexow, University of Rostock
Markus Wille, Schoeller Electronics GmbH
*Brian Roggeman, Jintao Zheng, Mark Schwarz and Ahmer Syed, Qualcomm Inc.
Lead-Free Soldering Technology Symposium
Organized by Paul Vianco, Ph.D., Sandia National Laboratories, Matthew Kelly, P.Eng., MBA, IBM Corporation and Elizabeth Benedetto, Hewlett-Packard Company
Thursday, October 1 | 8:00am - 4:30pm
Free with a VIP or Technical Conference Registration!
Universal Instruments Consortium Pb-Free Project UpdateChair: Paul Vianco, Ph.D., Sandia National Laboratories
Co-Chair: Matt Kelly, P.Eng., MBA, IBM Corporation
Thursday, October 1 | 8:30am — 10:00am
Consortia activities continue to fill the gaps in Pb-free technology and, in particular, long term reliability. This session begins with the results of a study to examine the effects of surface finishes on the reliability of Pb-free interconnections used with wafer-level, chip-scale packages (WLCSPs). The second presentation investigates the role of conformal coatings on the survivability of quad flat pack, no lead (QFN) packages when the latter are targeted for harsh environments applications. The session is rounded out with an analysis of new Pb-free die attach materials and their performance in thermo-mechanical conditions.
Jim Wilcox and Michael Meilunas, Universal Instruments Corporation
Jim Wilcox and Michael Meilunas, Universal Instruments Corporation; Martin Anselm, Rochester Institute of Technology
Harry Schoeller, Ph.D., Universal Instruments Corporation, Sandeep Mallampati and Junghyun Cho, Ph. D., Binghamton University
Corrosion and Flux Residue Impacts of Lead Free SoldersChair: Matthew Kelly, P.Eng., MBA, IBM Corporation
Co-Chair: Richard Coyle, Ph.D., Alcatel-Lucent
Thursday, October 1 | 10:30am — 12:00pm
Today, electronic systems must operate in a wide variety of field conditions. These systems are now generally built using lead-free no-clean solders per EU RoHS regulations. Understanding environmental corrosion and surface electromigration failure mechanisms is critical in ensuring reliable system performance. This session reports the latest research in better understanding corrosion and flux residue impacts relating to surface electromigration failure mechanisms.
Mike Bixenman, DBA, Kyzen Corporation; Wallace Ables, Dell Computer; Richard Kraszewski, Plexus Corporation; Julie Silk, Keysight Technologies; Keith Howell, Nihon Superior; Jim Hartzell, Enthone; Karl Sauter, Oracle; Robert Smith, HDPUG
Terry Munson, Foresite Inc.
Bruno Tolla, Ph.D., Xiang (Shawn) Wei, Yanrong Shi, Hemal Bhasvar, Jennifer Allen and Kyle Loomis, Kester
Research Challenges with Tin Whiskers and MitigationChair: Jeff Kennedy, Celestica Inc.
Co-Chair: Elizabeth Benedetto, Hewlett-Packard
Thursday, October 1 | 1:00pm — 2:30pm
This session will explore the latest research initiatives in the areas of Tin Whiskers and mitigation. Continued examination from last year’s presentation of what promotes the Tin Whisker growth and the related risk associated with these fine metallic filaments for products in the high reliability products will be covered. Mitigation of the risk associated with these Tin Whiskers will also be discussed as well as some novel material developments using nano-particles in conformal coating. A presentation of what is required to use coating as a Tin Whisker mitigation method and how to perform the required material study to support this new performance objective for conformal coatings will conclude the session.
Stephan Meschter, Ph.D. and S. McKeown, BAE Systems; P. Snugovsky, Ph.D., J. Kennedy, Z. Bagheri, J. Keeping, P.E. and E. Kosiba, Celestica, Inc.; J. Cho, Binghamton University; David Edwards, Henkel LLC; K. Elsken, Bayer Material Science
Chris Hunt, Ph.D., Owen Thomas, Martin Wickham, and Kate Clayton, National Physical Laboratory
Junghyun Cho, Ph.D. and Suraj Maganty, Binghamton University; Stephan J. Meschter, Ph.D., BAE Systems - Electronic Systems
Lead-Free Solder Joint Reliability: Recent AdvancesChair: Jean-Paul Clech, Ph.D., EPSI, Inc.
Co-Chair: Kola Akinade, Ph.D., Cisco Systems, Inc.
Thursday, October 1 | 3:00pm - 4:30pm
Material and reliability experts will share recent findings on lead-free alloys and solder joint reliability characterization. Topics to be discussed include: the impact of test specimens on fracture properties; the effect of bismuth additions to SnCu alloys on solder joint reliability; and the effect of pre-conditioning and thermal cycling profiles on the reliability of test vehicles assembled with varied SAC solder compositions.
Amir Nourani, Saeed Akbari and Jan K. Spelt, University of Toronto
Takatoshi Nishimura, Keith Sweatman, Akira Kita and Shuhei Sawada, Nihon Superior Co., Ltd.
Richard Coyle, Ph.D. and Joe Smetana, Alcatel-Lucent; Richard Parker, iNEMI; Elizabeth Benedetto and Aileen Allen, Hewlett Packard; Keith Howell and Keith Sweatman, Nihon Superior Co.; Weiping Liu, Indium Corporation; Michael Osterman, CALCE; Julie Silk, Keysight Technologies; Rafael Padilla and Tomoyasu Yoshikawa, Senju Metal Industry Co.; Mitch Holtzer, Alpha