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October 24 - 28, 2010
Walt Disney World Swan and Dolphin Resort
Orlando, FL
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The opportunity to gain new skills and update your technical knowledge is around every corner at SMTA International. From the exhibition area to the conference, you are sure to find valuable information that will prepare you to succeed in today's highly competitive market.
Many events below are free and some require fees and advance registration. See the registration form for complete information.
AIMS (Harsh Environments Symposium)
NEW THIS YEAR: Included with a VIP or Technical Conference Registration, saving you MONEY!
Monday, October 25
8:00am – 5:00pm, Oceanic 7
This symposium will address the concerns related to harsh environment electronics and the challenges within the electronics community, with an added emphasis on military and space. It is intended to bring together the needs of “end-users” with the capabilities of the research community and the industrial supply base. Specifically, the Symposium addresses the challenges of meeting expanding temperature ranges (-55C to +150C/+200C) with increased vibration, higher package density and longer reliability. Next generation requirements for automotive electronics are explored from the system level and potential supply-based solutions are presented. In addition, requirements and solutions for non-automotive vehicles and industrial electronics applications will be addressed.
HE1 Pb-Free Technology Insertion
8:00am – 9:30am
HE2 Component Packaging Challenges in Harsh Environments
10:00am – 12:00pm
HE Keynote Lunch: "The Tech in Green Tech"
12:00pm – 1:00pm
HE3 Organic Materials Adapted for Harsh Environments
1:00pm – 2:30pm
HE4 Pb-Free Interconnection Reliability
3:00am – 5:00pm
Evolving Technologies Summit
FREE with VIP or Technical Conference Registration
Monday, October 25
8:00am – 5:00pm, Asia 1
The time is right to stimulate your thinking and catalyze new success - be ready for the new market rise. Innovation always leads the way so join us as we explore emerging and evolving technologies from around the world. The 2010 ET Summit has the largest array of timely topics we've ever assembled. Learn the challenges of implementing Micro Electrical Mechanical Systems (MEMs) and sensor technology, packaging and reliability that is needed for wider use. Gain insight as how advancements in exotic packaging and through silicon vias (TSVs) is being pursued. Learn all about rapidly growing printed electronics starting with luncheon speaker covering challenges and an outlook followed by three other excellent paper presentations. The ET Panel will discuss and debate timely topics that include: Challenges in discrete and embedded capacitors, solar energy and extreme density electronics. So bring your questions and ideas as we power ahead into a brighter future.
ET1 MEMS and Image Sensor Assembly Processing and Reliability
8:00am – 9:30am
ET2 Advanced Packages and Processes
10:00am – 12:00pm
ET Keynote Lunch Reading the Fine Print: Challenges and Outlook for Printed Electronics
12:00pm – 1:30pm
ET3 Printed Electronics: Solar, Lighting, Batteries, Etc.
1:30pm – 3:00pm
ET4 Evolving Technology and Current Issues Panel
3:30pm – 5:00pm
Women's Leadership Connection
Monday, October 25th
5:00 - 6:30pm, Oceanic 3
We extend a cordial invitation to all women attending SMTAI to join us for a wine and cheese reception. This is a great opportunity for you to join with other women in our industry for networking and socializing. We look forward to seeing you.
Opening Session
Technology Turning Point
Tuesday, October 26
8:00am – 9:30am, Atlantic A
FREE to All Attendees!
First we look back as we honor the 2009 BEST PAPER/PRESENTATION AWARD WINNERS who captured the honors. Join us as we celebrate their work and discuss how the industry benefits from it today.
Then, we turn to the future and focus on two critical industry guidelines that will shape the face of global electronics assembly for years to come. “Bottom Terminations Components” (IPC 7093), and “Printed Board Storage and Handling” (IPC 1601) will directly affect many, and influence most, electronics assemblers. Listen as Ray and Michael introduce these powerful guidelines, then join in a conversation with your peers.
Bottom Terminations Components (IPC 7093)
Ray Prasad, Ray Prasad Consultancy Group
7093 is a companion document to IPC-7094 and IPC-7095 that describes the design and assembly challenges for implementing Bottom Termination Components (BTCs) whose external connections consist of metallized terminations that are an integral part of the component body.
Printed Board Storage and Handling (IPC 1601)
Michael J. Gay, Isola Group
A new standard focused on the proper handling, shipping and storage of printed boards and printed board assemblies.
The 2009 SMTA International Conference Award Winners will also be recognized:
Best of Conference Presentation
Pb-Free Solder and Beyond - Trends and Challenges 'A View from the Bottom'
Paul Vianco, Ph.D.,** Sandia National Laboratories
Best of Proceedings Papers
Closed-Form, Strain-Energy Based Acceleration Factors for Thermal Cycling of Lead-Free Assemblies
Jean-Paul Clech, Ph.D.,** EPSI Inc; Gregory Henshall, Ph.D.,** and Jian Miremadi, Hewlett-Packard Company
Best International Paper
Assembly and Reliability Assessment of Fine Pitch TMV Package on Package (PoP) Components
Heather McCormick** and Jimmy Chow, Celestica Inc.; Lee Smith, Ahmer Syed**, Corey Reichman, and C.J. Berry, Amkor Technology, Inc.
SMTA Annual Meeting/Keynote Luncheon
"Counterfeit Components Are Everywhere - What's Your Strategy?"
Tom Sharpe, SMT Corporation
Wednesday, October 27
12:00pm - 2:00pm
 The counterfeiting and resale of electronic components is alive, well and flourishing. A first-hand narration of a photo-documented tour provides compelling and clear evidence showing this threat is far worse than we imagine and here to stay. The recent refinements of the counterfeiter's craft demonstrate clearly that we are battling very well-informed and well-funded groups of criminal enterprise.
This counterfeit material is produced to target both commercial applications and the defense and aerospace industry. The dire consequences this situation exposes to our national security, our power grids and our overall industrial infrastructure cannot be over-stated.
The only reasonable response from quality component distributors to this continually evolving threat can be to constantly re-evaluate, revise and improve all aspects of inspection techniques, processes and equipment used for component testing and authentication.
Biography:
Tom Sharpe is the Vice President of SMT Corporation, located in Sandy Hook Connecticut. Tom co-founded SMT with his wife Kirsten in 1995 and they have since built SMT into one of the industry's leading Independent Stocking Distributors of electronic components. In addition to being a long-time member of ERAI, Tom is the current Vice President of IDEA where he has served continuously on the Board of Directors since the year of it's formation in 2003.
Tom is a member of Aerospace Industry Association's Counterfeit Parts IPT, and a member of SAE International's G-19 committee that is currently developing the new Independent Distributor certification standard. Tom is very active on the Defense & Aerospace Industry speaking tour and has become a leading voice from the Independent sector in the fight against counterfeit components in the electronics industry. Tom's presentations serve to educate all sectors of the electronics industry about the growing dangers of counterfeits in today's market, and best practices to detect and mitigate those dangers.
Contract Manufacturing Symposium
Organized by Mike Buetow, CIRCUITS ASSEMBLY Magazine
and Sue Mucha, Powell-Mucha Consulting, Inc.
Tuesday, October 26
2:00pm – 5:30pm, Europe 1
FREE with VIP or Technical Conference Registration!
As outsourcing continues to be a growing trend in the electronics manufacturing industry, SMTA International provides the skills and information that you need to form profitable relationships. Whether you are a contract manufacturer, a customer, or an investor, you’ll benefit from the Contract Manufacturing Symposium.
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Golf Tournament Sponsors:
Closest to the Pin and Drink Cart Sponsor
Longest Drive Sponsor
Hole Sponsors
 Stone Mountain Tool
Luncheon Sponsor
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3rd Annual SMTAI Golf Tournament
Celebration Golf Club
Celebration, Florida
Thursday, October 28, 2010
Come…to golf with friends
Come…to entertain customers
Join us for the 3rd Annual SMTAI Golf Tournament at Celebration Golf Club in Celebration, Florida. The course is just minutes away from the Walt Disney World Swan and Dolphin Resort, the site for SMTA International. We guarantee that you will enjoy yourself and have a challenging game! The tournament begins with a shotgun start at 8:00am and ends with a delicious awards luncheon.
The renowned father-son team of Robert Trent Jones, Sr. and Jr. sculpted a park-like atmosphere within the natural wetland environment, creating a truly serene golf experience. The course boasts rolling terrain that weaves through a series of pristine lakes and periodic clusters of native oak, pine and magnolia. Designed with shot-making strategy in mind, the championship caliber course demands accurate approach shots and consistent putting. Featuring strategic hazards and challenging greens, and sporting five sets of tees on every hole, the course invites competition for many skill levels. Host to prestigious events and now the 3rd Annual SMTAI Golf Tournament! See more about Celebration Golf Club at: www.celebrationgolf.com/welcome.htm
Golf Club Rental:
Celebration Golf Club offers Ping and Taylormade rental clubs. Players will be required to purchase them in the pro shop using a credit card and will need to fill out a rental club agreement. SMTA receives a discounted rate of $42.80 inclusive per set of clubs.
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Golf Registration Now Open
Register today!
LOCATION: Celebration Golf Club
Celebration, Florida
TIME: 8AM Shotgun Start
SPONSORSHIPS:
Hole sponsors, $150 (sold)
New! Golf Luncheon, $100 (4 available)
Closest to the Pin, $250 (sold)
Longest Drive $250 (sold)
Drink Cart $250 (sold)
View all sponsorship opportunities.
Register to be a sponsor online.
CONTACT:
About registering: Contact the SMTA at 952-920-7682
About the tournament: Contact Eileen Hibbler at 866-452-5828 (toll free)
About sponsorship opportunities: Gayle Jackson 952-920-7682 or by email at gayle@smta.org.
COST:
$75/player, $300/team
Golf Registration Now Open
Register Today!
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Golf Tournament Committee:
Eileen Hibbler (EHibbler@stanleyworks.com), Stanley Supply & Services, Chair
Greg Hayes (ghayes@indium.com), Indium Corporation
Ed Corson (ecorson@emc3group.com), The EMC3 Group
Jim Sharp (james.sharp@henkel.com), Henkel Corporation
David Duke (david_duke@stonemountaintool.com), Stone Mountain Tool, Inc.
Mark Bottoms (mark@ptiassembly.com), PTI Assembly
Announcing the 6th Annual GLOBAL Technology Awards
Global SMT & Packaging is proud to announce the sixth annual GLOBAL Technology Awards. The industry's largest global awards, Global Technology Awards recognize the world's best new innovations in the printed circuit assembly and packaging industries.
Winning companies will be presented at a ceremony to be held during SMTA International in Orlando, Florida.
A complete list of categories is available here.
Showcase your products and services
Entries are invited from equipment, materials and EMS companies of all sizes. Entries will judged by an independent, international panel based on:
- Innovation
- Speed/throughput improvements
- Quality contribution
- Cost benefits
- Environmental consideration
- Ease of use/implementation
- Maintainability/repairability
Winners will receive a crystal award, publicity through Global SMT & Packaging's print & online magazines, winner's logo and more.
Learn more at the GLOBAL Technology Awards website.
Lead-Free Soldering Technology Symposium
Organized by Organized by Paul Vianco, Ph.D., Sandia National Laboratories and Matthew Kelly, P. Eng., MBA, IBM Corporation
Thursday, October 28
8:00am – 5:00pm, Asia 1
Free With VIP or Technical Conference Registration
The present research and development thrust in Pb-free soldering technology is towards understanding the reliability of interconnections, particularly those that will potentially be used in avionics, military, and space electronics. In response to this need, the second phase of the NASA-DoD Pb-Free Consortium project is providing unprecedented data on the long-term performance of Pb-free interconnections. The scope of these experiments addresses alternative surface finishes as well as the performance of mixed SnPb/Pb-free solder joints and the effects of rework activities. These efforts will be reported upon during the 2010 Lead-Free Soldering Technology Symposium, beginning with an overview of the current project. That overview is followed by presentations that will report the results of the consortium drop test and mechanical shock experiments. The second session of the symposium will complete the NASA-DOD project reports with presentations describing the invaluable data that were obtained from vibration testing, thermal cycling, and combined thermal cycling/vibration environments. The third session of the symposium will step away from reliability and address three pressing issues in Pb-free process development. Those topics are processing high complexity/high component mix assemblies; mitigating pad catering defects; and optimizing wave soldering processes. The 2010 symposium will conclude by returning to the topic of reliability in the fourth and final session. An investigation will be described that studied the effects of cooling rate and solder silver content on the long-term reliability of area-array solder joints. A very interesting presentation will address the solder microstructural changes caused by electromigration and the consequences to the low-cycle fatigue of the solder joint.
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Reproduction in whole or in part without permission is prohibited.
SMTA Headquarters - 5200 Willson Road - Suite 215 - Edina - MN - 55424 - Phone 952.920.7682 - Fax 952.926.1819
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Technical sessions, especially the lead-free were excellent. Attendees represent the key companies and are the most knowledgeable in the industry.
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