August 17 - 21, 2008   Disney's Coronado Springs Resort   Orlando, Florida     Conference    Tutorials        Faculty    Tech Sessions    Symposiums    Sponsors At-A-Glance    Sunday    Monday    Tuesday    Wednesday    Thursday Special Events Accommodations Register Now Become A Sponsor! The opportunity to gain new skills and update your technical knowledge is around every corner at SMTA International. From the exhibition area to the conference, you are sure to find valuable information that will prepare you to succeed in today’s highly competitive market. Many events below are free and some require fees and advance registration. See the registration form for complete information. AIMS (Harsh Environments Workshop) Monday, August 18 (8:00am – 5:00pm) Tuesday, August 19 (8:00am – 11:30am) Note: The AIMS co-located conference has a separate registration fee. This workshop will address the concerns related to harsh environment electronics and the challenges within the electronics community, with an added emphasis on military and space. It is intended to bring together the needs of "end-users" with the capabilities of the research community and the industrial supply base. Specifically, the workshop addresses the challenges of meeting expanding temperature ranges (-55C to +150C/+200C) with increased vibration, higher package density and longer reliability. Next generation requirements for automotive electronics are explored from the system level and potential supply-based solutions are presented. In addition, requirements and solutions for non-automotive vehicles and industrial electronics applications will be addressed. Alternative Energy Symposium NEW EVENT! Monday, August 18 8:00am – 12:30Pm NEW this year! The current world demand for electrical power is in excess of 4 Terrawatts per year. Existing sources, such as oil, are rising in price due to scarcity, and other sources, such as coal and nuclear, are not as environmentally acceptable. This current energy shortage has forced the world to look at alternate energy sources such as wind, wave, fuel cells, and solar cells. This SMTAI special event will focus on two sources that are gaining popularity: fuel cells and solar cells. The papers in this session will explain the technologies and the manufacturing process, as well as put these assembly methods in the context of more traditional high volume electronic assembly methods. It is possible to go from the lab to automated production given today's technology and equipment. FCS1 Alternative Energy: Fuel Cells and Solar Cells Enter High Volume Manufacturing 8:00am – 9:30am FCS2 Alternative Energy: Fuel Cells and Solar Cells Enter High Volume Manufacturing - Continued 10:00am – 11:30am Alternative Energy Keynote Lunch Photovoltaics-The Next Great Electronics Market A Survey of Opportunities Throughout the Photovoltaics Supply Chain 11:45am – 12:30pm Evolving Technologies Summit FREE with VIP or Technical Conference Registration Monday, August 18th 8:00am – 5:00pm Better hold on…as ET shatters old boundaries and enters amazing new dimensions to boldly launch into exciting technology futures. First, we'll hear from international researchers who cover everything from jet-printed electronics to nano-materials. They'll throw in some opto-multichip modules for your enlightenment. Next, veterans from the industry will predict paradigm shifts – it’s "shift or stall"…so get in gear and don’t be left flat. But are you really ready to let go…to part with the past? Then we’ll tell you how to get the solder out…not just the lead. This is true solderless assembly, and we’re not talking about conductive adhesives. After all, solder might be 7,000 years old and ready to retire. We'll also cover some valuable "ready now" topics, like embedded chips and passives. And to bring us back down to planet earth, a diversified panel will make observations and have a go at answering your questions. ET1 University Research: New Processing for Electronic Packaging 8:00am – 9:30am ET2 Time for Paradigm Shifts 10:00am – 11:30am ET Keynote Lunch Solderless Assembly of Electronics – Technical Pipe Dream or Wave of the Future? 11:30am – 1:00pm ET3 Embedded Technologies: Their Applications and Reliability 1:00pm – 3:00pm ET4 Evolving Technology and Current Issues Panel 3:30pm – 5:00pm Opening Ceremony The Ever-Changing Component - for Better or for Worse! Tuesday, August 19 8:00am – 9:30am FREE to All Attendees! Everyone seems to be pushing for change lately - but beware. Components have been changing ever since the vacuum tube was introduced 100 years ago. Most change has been an orderly evolution, with occasional exciting revolutions - like the move to solid state and surface mount assembly. But, there can be a down side. Component obsolescence is a major challenge for high-longevity products, especially military. And the continuing switch to lead-free creates a dilemma for many products. What about reliability, that often depends on component design and source? Do you really know your sources? Installing counterfeit components can be hazardous to your business and deadly for the end-user. Our first presentation will help you understand the dangers caused by counterfeiters and how to the avoid pitfalls. Next, we'll cover the latest packaging trends and how they can affect assembly. "Leadless" components may be simpler to make, but can pose new concerns for the assembler. We’ll include an overview of the newly released version of IPC-7095 Design and Assembly Process Implementation for BGAs. So get ready for change - but beware! Counterfeit Component Avoidance Don Trenholm, Custom Analytical Services Advanced Packaging Trends Ray Fillion, TechLead Corporation The 2007 SMTA International Conference Award Winners will also be recognized: Best of Conference Presentation: Dave Hillman and Matt Hamand, Rockwell Collins Best of Proceedings Paper: Randy Schueller, Ph.D., Dell Best International Paper: Matt Kelly, IBM (Canada) Wii™ Lounge NEW! "Wii™ would like to play." And we would like you to play, too, in our Nintendo® Wii™ lounge in the SMTA Booth on the exhibit floor. The Wii™ Lounge, new this year, will provide entertaining games for attendees to play. Don't forget to buy raffle tickets for a chance to take home the Nintendo® Wii™ at the end of the conference. Make a little time to have some fun. Bring a friend and bowl a game, play some baseball, practice your golf, create a Mii™! SMTA International Chat Rooms FREE to All Attendees! Real chat! Real rooms!! Real people!!! Participate in this NON-virtual interchange of technology, practices, and information. Join topic-specific round-table discussions to exchange ideas, opinions, and information. Each discussion will be facilitated and notes will be published. Please contact Gayle Jackson at gayle@smta.org if interested in facilitating a chatroom. Sign up to be a facilitator by June 20. Schedule of "Chats" Tuesday, 12:30pm Low/No Silver Bearing Lead-Free Wave Soldering Alloys Tuesday, 3:00pm Evaluating the Through Hole Soldering Process Options (Pin-in-Paste, Wave Soldering, Selective Soldering, etc.) Wednesday, 10:00am Broad Band Printing Developing a solder paste process that will provide the correct volume of solder paste for both miniature and large components used on the same assembly. Wednesday, 3:00pm Considerations in the Development, Verification, Implementation, and Optimization of a Lead-Free Manufacturing Process (Chat to include the process, material, training, and organizational issues required in the implementation of a lead-free manufacturing process) We're setting up tables throughout the SMTAI Orlando show floor. At 12:30PM and 3:00PM on Tuesday and Wednesday, live chat sessions will be held on specific topics. There is no charge to participate. Feel free to walk in, listen, take notes, comment, ask questions, and see what you can learn. Each discussion session is open (no specific agenda) and will be facilitated by an industry expert. A scribe will capture notes (to be shared on SMTA.org) for everyone’s benefit. Live Chat Rooms were launched to facilitate the exchange of real-world information (to and from real practitioners, like you) as well as to help everyone expand his or her personal network. Think of it as an informal tech session that gets you and others with the same interests personally involved. Check the schedule, drop in with a topic-specific question, share a little of your expertise, and make a friend or two. Then, go home and tell your kids all about it. They won’t believe it. Announcing the 4th Annual GLOBAL Technology Awards Global SMT & Packaging is proud to announce the fourth annual GLOBAL Technology Awards. The industry's largest global awards, Global Technology Awards recognize the world's best new innovations in the printed circuit assembly and packaging industries. Winning companies will be presented at a ceremony to be held at noon on Tuesday August 19th, during SMTA International in Orlando, Florida. For 2008, the Global Technology Awards adds the following new categories: ID Systems Pick & Place Equipment - High Volume Pick & Place Equipment - Low/Medium Volume Selective Soldering A complete list of categories is available here. Showcase your products and services Entries are invited from equipment, materials and EMS companies of all sizes. Entries will judged by an independent, international panel based on: Innovation Speed/throughput improvements Quality contribution Cost benefits Environmental consideration Ease of use/implementation Maintainability/repairability Winners will receive a crystal award, publicity through Global SMT & Packaging's print & online magazines, winner's logo and more. Learn more at the GLOBAL Technology Awards website. FREE Events Each Day! Troubleshooting Yield Problems in a Lead-Free World Tuesday, August 19 10:00am – 11:30am Speaker: Raiyo Aspandiar, Intel Corporation FREE to All Attendees! SMT has been in use in high volume since 1985 and BGA has been in use in high volume since 1995. But even after all these years of high volume experience, less than 10% of companies have yield over 90%. That means 90% of companies are doing too much rework. The electronic assembly, if done correctly, produces high quality assemblies at a very high speed. But when something goes wrong, and something does go wrong, and will go wrong as long as humans are involved, the same line will produce scrap at the same high speed. And the problem is further compounded with the advent of lead-free soldering technology and finer pitch BGAs, micro BGAs and QFNs and other leadless packages. This free session focuses on three major areas of defects in SMT: design, assembly and the quality of incoming materials, including surface finishes, reflow and some issues in lead-free wave soldering and their root causes. Raiyo will also discuss the root causes of defects in BGA including types of voids as updated in the latest revision (April 2008) of IPC-7095B “Design and Assembly Process Implementation for BGA”. You are also encouraged to bring the photos/slides of your pesky defects for discussion and root cause analysis. Counterfeit Electronics Tuesday, August 19 1:30pm – 3:00pm Speaker: Don Trenholm, Custom Analytical Services FREE to All Attendees! Counterfeit electronic components which pose severe performance and reliability threats are finding their way into commercial, military and medical assemblies, and are causing a huge economic impact in these Industries. This presentation provides information relating to the electronic fraudulent/counterfeit components problem, and offers detection and prevention methods. Counterfeit electronic parts are items whose performance or characteristics have been falsely stated or knowingly altered. The biggest source is previously used parts that have been salvaged from disposed assemblies and refurbished to look new. Sometimes defective parts have been scrapped by the original manufacturer or components have been erased, blacktopped, and remarked to disguise the item’s original characteristics. Sometimes parts that have been scrapped by the manufacturer at final test and falsely reflect a new and authentic part. The people most often responsible for refurbishing these components have taken the tasks related to refurbishing and raised it to a level of art. Unless you know where to look, they are very difficult to detect. We will describe the various contributory factors, show a variety of counterfeit part examples, and present a strategy for the prevention and detection of counterfeit parts. We will be displaying contributing causes, detection techniques and the actions being taken by manufacturers, distributors, brokers, test labs and users. The session includes presentations on numerous cases of counterfeit components; the details of their occurrence and failures; detection methods used to identify them; analysis methods for finding fakes; and suggested procurement management practices for future avoidance. iNEMI Roadmap Speaker: Chuck Richardson, iNEMI Tuesday, August 19 3:30pm – 4:30pm FREE to All Attendees! Since the first roadmap in 1994, iNEMI (International Electronics Manufacturing Initiative) has enjoyed increasingly greater support and participation from industry. The effort reaches beyond iNEMI membership to involve a broad range of organizations from the global electronics industry. In the latest roadmap cycle, iNEMI held regional workshops in Europe and Asia (as well as North America) to assure that these regions were well represented in the roadmapping effort. The most recent 2007 cycle included over 560 participants from more than 265 companies, universities and associations in 17 different countries. iNEMI also coordinates with numerous other roadmapping organizations to: synchronize timelines (assuring consistency in how far into the future each roadmap projects); agree on product sector definitions; identify common elements; facilitate cross-functional groups; and co-ordinate roadmap schedules. Direct links with other roadmaps and other organizations include SIA, IPC, OIDA, INSIC, USDC, SCC, IMAPS, IEEE-CPMT and SMTA. The 2009 iNEMI Roadmap covers at least 20 TWG (Technical Working Group) chapters grouped into five technology groups: Semiconductor Technology, Business Processes/Technologies, Design Technologies, Manufacturing Technologies and Component/Subsystem Technologies. Within the groups are the 20 chapter designations – including two new TWGs (Solid State Illumination and Photovoltaics). The roadmap also includes five product sector (PEG) chapters with associated product emulators. The presentation will go into what makes up the individual chapters and how the process works to culminate in a complete document. The latest roadmap forecasts from 2009 out 10 years into the future, looking for any gaps in projected needs of the OEM "Product Emulator Groups", and the projected technical capabilities of the service providers tasked with supplying the requested capabilities. Once the gaps are identified, "Technical Implementation Groups" (TIGS within iNEMI)) are formed to address and hopefully solve these limitations and close the gaps. iNEMI also generates an “R&D Priorities Document” that is provided to government, industry and academic entities for the purpose of helping target R&D funds to the prioritized technical areas identified as gaps and unable to be addressed within iNEMI. Chuck Richardson will present the iNEMI Roadmap process overview as well as some highlighted issues being addressed by the selected chapters from 2007, as well as the 2009 Roadmap (released to the industry in March 2009), that will likely help drive the electronics industry for the next several years. Join with us and see what the future may hold! Welcome Reception Tuesday, August 19 5:00pm – 6:30pm, Exhibit Floor FREE to All Attendees! Join us on Tuesday evening for a Mexican Fiesta! This is your opportunity to network with your colleagues and meet new friends. Enjoy hors d'oeuvres and a drink. This is a great opportunity to continue unfinished business, or just relax and unwind after a busy day at the conference or in the exhibit hall. DFM: What Can No Longer Be Ignored in Today's Electronic Designs Wednesday, August 20 8:00am – 9:30am Speakers: Dale Lee and Denis Jean, Plexus Corporation FREE to All Attendees! Component packaging technology continues to decrease in size (length, width, thickness), interconnection density per unit area is increasing (thinner PCB’s, smaller lines and spaces), and functional performance is increasing (thermal, mechanical, electrical) at the same time assembly processes are changing to lead-free assembly and other legislated requirements. Due to these evolutionary changes in technology, many of elements in the product design and assembly process that use to be ignored can no longer be ignored. This course will highlight examples of several elements within product design process (PCB and assembly), manufacturing tooling design, SMT and PTH assembly, cleaning, SMT and PTH rework, and inspection/test opportunities that may impact process deployment and yield improvement. Join us as we tackle what you can no longer ignore! Panel Discussion - 3D Stacked Packages: Which Way to Go Moderator: Gail Flower, PennWell Corporation Co-Chair: Meredith Courtemanche, PennWell Corporation Wednesday, August 19 10:00am – 11:30am FREE to All Attendees! Consumers (or consumer markets) are demanding smaller, lighter electronic devices with higher performance and more features. The continuous pressure to reduce size, weight, power consumption, and cost, while increasing the functionality of portable products or advanced ICs, has driven innovative, small, cost-effective 3D-IC concepts with through-silicon via interconnects. Accordingly, there are different motivations for the development of 3D-IC solutions; (i) form factor to increase density (i.e., achieving the highest capacity per volume ratio); TSV interconnect is the ultimate solution to overcome the space limitations of POP and SiP packages, (ii) increased electrical performances to shorten interconnect length, to improve electrical performances (reducing electrical parasitics due to RC delays in RF and DRAM applications) and to strongly reduce power consumption, (iii) heterogeneous integration to integrate different functional layers (RF, memory, logic, MEMS, imagers, exotic substrate material, etc.) based on different optimized process nodes, and (iv) cost; ultimately 3D integration is expected to be cheaper than furthermore shrinking 2D design rules. Join us as key industry experts share their thoughts on "which way to go". Panelists will include: Jean-Christophe Eloy, Yole Development Scott Kennedy, Rogers Corporation Paul Siblerud, Semitool, Inc. Lee Smith, Amkor Technology Rao Tummala, Ph.D., Georgia Institute of Technology Benchmarking - What Can You Gain From It? Speakers: Emmanuel Siméus, John Martinez, and Denise Tepe Raytheon Missile Systems; Charlie Minter, BPM/COE/Willcor, Inc. Wednesday, August 20 1:30pm – 3:00pm FREE to All Attendees! Webster Collegiate Dictionary defines benchmark as "Something that serves as a standard by which others may be measured". Benchmarking is a management tool aimed at improving the results, processes and products of a given company through the identification of industry best practices. Benchmarking has been formally used in the United States since the 1960's and hundreds of benchmarking visits take place daily across companies worldwide The internal and external benefits of benchmarking can be achieved via partnership, collaboration, information and knowledge sharing. The comprehensive evaluation of best-in-class companies can lead to innovation, revenue growth and performance, process and quality improvement. Benchmarking as a process, can be used in any industry or environment and usually requires organizational leadership or a champion for it to be effective and successful. Presentations will give you the components of a successful benchmarking effort, provide examples of benchmarking processes, share process pitfalls, lessons learned and identify benefits that your company can achieve. Join us for the opportunity to begin a benchmarking strategic partnership with other SMTA members and participate in this interactive learning experience with one of the most powerful and effective improvement tools you can use. Board Talk Speakers: Phil Zarrow and Jim Hall, ITM Consulting Wednesday, August 20 3:30pm – 5:00pm FREE to All Attendees! Your attendance provides funds to the Hutchins Educational Grant Even though some cringe when they hear our name, it’s time for Board Talk. With us, Pick & Place, the Assembly Brothers. And we’re here, with you, to talk about electronic assembly, electronic assembly problems, and related matters. The purpose of this forum is to cut through the marketing hype, the platitudes, and incompetent, unscientific baloney. To rise to an ethereal level of honesty and openness. To share our darkest fears and our greatest hopes. And, hopefully, to further the technical levels of our industry by being totally frank and honest. We are constantly dealing with materials, products and requirements that have never existed until…well maybe not until 10 minutes ago. We have to take chances, we have to brainstorm, we have to try “weird” things; we have to go for it. If we waited for thorough, analytical analysis of every new problem we would still be soldering with kerosene torches! For this sixth SMTAI edition of Board Talk, the SMTA Board will make a $10 donation to the Charles Hutchins Educational Grant for each person attending. We pay, you spend a fun 90 minutes learning, and the students benefit! Well…you've squandered another 5 minutes reading this Board Talk promo. But we hope you will join us anyway at SMTAI in August (and then you can squander a perfectly good 90 minutes.) And remember…"don't solder like my brother"….and keep the kids away from the flux pot! Contract Manufacturing Symposium Organized by Mike Buetow, UP Media Group/Circuits Assembly Magazine and Sue Mucha, Powell-Mucha Consulting, Inc. Wednesday, August 20 1:30pm – 5:00pm FREE with VIP or Technical Conference Registration! As outsourcing continues to be a growing trend in the electronics manufacturing industry, SMTA International provides the skills and information that you need to form profitable relationships. Whether you are a contract manufacturer, a customer, or an investor, you’ll benefit from the Contract Manufacturing Symposium. SMTA Annual Meeting/Keynote Luncheon "Big Green Innovations -- Innovation that Matters..." Dr. Sharon Nunes, IBM Corporation Big Green Innovations is a new program in IBM that was commissioned by the chairman at the end of 2006. Its mission is to use information technology to address critical environmental problems around the world. Big Green Innovations is focused on water management, carbon management and alternative energy (photovoltaics). In this presentation Dr. Nunes will discuss IBM's approach to this new topic, and highlight ways that IBM is helping to tackle some of these important issues. Dr. Nunes is currently Vice President of Big Green Innovations in IBM Systems & Technology Group (STG). This is a new organization created to identify and launch new businesses for IBM, focused on using IBM's information technology expertise as well as IBM's materials & processing expertise to solve critical problems around environmental issues. IBM's approach to this initiative is focused on collaborative innovation, highlighting the need for multiple parties to come together to solve the world's important problems. Dr. Nunes has held numerous executive positions leading new growth initiatives in IBM such as the Cell BE ecosystem development, Emerging Businesses in IBM Research and Life Sciences solutions. She spent one year on special assignment in CHQ as Vice President of Technology, working with IBM's Chairman and the senior executive team to set the technical agenda for the company. She has held many management positions in IBM in Research and Development, as well as positions in hardware development, software development, networking and sales. Sharon was responsible for the launch of IBM's Computational Biology Center in 1997, and played a key role in developing IBM's business opportunities in the Life Sciences market in the early years of the business. 2nd Annual SMTAI Golf Tournament NEW! Celebration Golf Club Celebration, Florida Thursday, August 21, 2008 Come…to golf with friends Come…to entertain customers Join us for the 2nd Annual SMTAI Golf Tournament at Celebration Golf Club in Celebration, Florida on Thursday, August 21. The course is just minutes away from Disney's Coronado Springs Resort and Convention Center, the site for SMTA International. We guarantee that you will enjoy yourself and have a challenging game! The tournament begins with a shotgun start at 8:00am and ends with a delicious awards luncheon. The renowned father-son team of Robert Trent Jones, Sr. and Jr. sculpted a park-like atmosphere within the natural wetland environment, creating a truly serene golf experience. The course boasts rolling terrain that weaves through a series of pristine lakes and periodic clusters of native oak, pine and magnolia. Designed with shot-making strategy in mind, the championship caliber course demands accurate approach shots and consistent putting. Featuring strategic hazards and challenging greens, and sporting five sets of tees on every hole, the course invites competition for many skill levels. Host to prestigious events and now the 2nd Annual SMTAI Golf Tournament! See more about Celebration Golf Club at: www.celebrationgolf.com/welcome.htm LOCATION:Celebration Golf Club Celebration, Florida TIME: 8AM Shotgun Start SPONSORSHIPS: Hole sponsors, $250 (18 spots available) Closest to the Pin, $250 (4 spots available) Longest Drive (Men) $250 (1 sponsor) Longest Drive (Women) $250 (1 sponsor) Drink Cart $350 (2 spots) To learn more about sponsorship opportunities, please click here. CONTACT: About registering: Contact the SMTA at 952-920-7682 About the tournament: Contact Eileen Hibbler at 866-452-5828 (toll free) About Sponsorship opportunities: Gayle Jackson 540-639-0439 or by email at gayle@smta.org COST: $125 before August 1 $150 after August 1 Lead-Free Soldering Technology Symposium Organized by Paul Vianco, Ph.D., Sandia National Laboratories Thursday, August 21 8:00am – 5:00pm Free With VIP or Technical Conference Registration The experience base continues to expand with respect to Pb-free solutions within the electronics community. Successful assembly processes are being used by a growing number of original equipment manufactures (OEMs) and contract manufacturing services (CMSs) in the US as well as overseas. Moreover, Pb-free finishes and assembly processes are now being investigated by many companies in the “high-end” segment of the industry, which includes medical, military and space electronics. In the latter case, solder joint reliability continues to be the major hurdle for Pb-free implementation. That is not to say that the consumer electronics sector does not have its reliability issues, specifically, the drop test requirement that is being placed on hand-held electronics. In fact, this latter requirement has led to the development of new solder alloys. The Lead-Free Soldering Technology Symposium will begin with a full session describing the latest consortium activities by the iNEMI group. Of particular interest will be a discussion of methodologies to evaluate the many new alloy compositions for different product applications. The second and third sessions are devoted to the very popular topic of case-studies. The six papers will describe the actual experiences of companies that are currently at the forefront of implementing a Pb-free solder solution for consumer and high-reliability products. The fourth session of the symposium will provide the attendee with state-of-the-art information pertaining to Pb-free interconnection reliability. Specific topics will range from the latest test data on the thermal cycling and shock testing of various alloy compositions and package designs, to forwards and backwards compatibility issues that remain as a significant concern for companies making high-reliability products. Attendees will find all of these presentations to be timely and extremely informative. Home | Top Copyright © 1999-2008 SMTA, All rights reserved. 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