October 4 - 8, 2009   The Town and Country Resort and Convention Center   San Diego, CA     Conference    Tutorials        Faculty    Tech Sessions    Symposiums    Sponsors At-A-Glance    Sunday    Monday    Tuesday    Wednesday    Thursday Special Events Free Sessions Accommodations Register Now Become A Sponsor! The opportunity to gain new skills and update your technical knowledge is around every corner at SMTA International. From the exhibition area to the conference, you are sure to find valuable information that will prepare you to succeed in today’s highly competitive market. Many events below are free and some require fees and advance registration. See the registration form for complete information. AIMS (Harsh Environments Symposium) Monday, October 5 (8:00am – 5:00pm) Tuesday, October 6 (10:00am – 3:00pm) Note: The AIMS co-located conference has a separate registration fee. This workshop will address the concerns related to harsh environment electronics and the challenges within the electronics community, with an added emphasis on military and space. It is intended to bring together the needs of "end-users" with the capabilities of the research community and the industrial supply base. Specifically, the workshop addresses the challenges of meeting expanding temperature ranges (-55C to +150C/+200C) with increased vibration, higher package density and longer reliability. Next generation requirements for automotive electronics are explored from the system level and potential supply-based solutions are presented. In addition, requirements and solutions for non-automotive vehicles and industrial electronics applications will be addressed. Full details of this workshop are available at smta.org/education/symposia/symposia.cfm#aims. Evolving Technologies Summit FREE with VIP or Technical Conference Registration Monday, October 5 8:00am – 5:00pm The time's right to stimulate your thinking and catalyze new success. Innovation always leads the way so join us as we explore emerging and evolving technologies from around the world. The 2009 ET Summit has the largest array of timely topics we've ever assembled. Learn how to detect and avoid counterfeit electronics - an increasing threat in tough times. Find out how new Nanotech materials and microwave curing are ready to solve packaging and PCB problems. Several experts will cover advanced packaging; System-in-Package (SiP), embedded chips, 3D stacking and Wafer-Level Packaging (WLP) Our international ET Panel will discuss and debate timely topics that include The Next 100 Years, "stretchable electronics", solar energy and extreme density electronics. So bring your questions and ideas as we power ahead into a brighter future. ET1 Counterfeit Electronics- How to Screen for and to Fight! 8:00am – 9:30am ET2 Nano Materials and Microwave Cure 10:00am – 12:00pm ET3 System in Package (SiP) 1:00pm – 2:30pm ET4 Evolving Technology and Current Issues Panel 3:00pm – 5:00pm SMTA's 25th Anniversary Dinner and Celebration Monday, October 5 6:30pm, California Room We hope you will plan to join us for this exciting evening as we "re-live" the past 25 years. The event MC will be Mike Buseman, Plexus (and past SMTA VP Membership). Mike will be introducing a number of luminaries and events that have contributed to 25 years of success for the SMTA. Two presentations will provide a "walk down memory lane" as well as a look to the future. A Funny Thing Happened on the Way to SMT Ken Gilleo, Ph.D., ET-Trends Twenty-five years ago, we were working with thin, floppy, misbehaving printed circuits known as flexible circuitry or just plain "flex" in the tundra land of Minnesota. We were testing Kapton and Mylar, two very different films from beloved DuPont. But none of our floppy flex circuits were very good for assembly with feed-through devices – the 2 or 3 mil thick plastic films easily tore and the cheap Mylar melted during soldering. But we knew that surface mount technology was just what flex needed - SMT & flex could be the perfect marriage. But the union would be full of surprises and mysteries. Why did Kapton circuits explode in the pizza oven? Why did all the SMDs fly off when we used solderless assembly? But success also brought mysteries. How the heck did a US camera manufacturer learn how to wave solder low-melting Mylar circuits? Why was SMT-Flex so much more reliable than rigid PCBs? Find out the answers and hear more zany "war stories" never before told, at the fabulous SMTA 25th. [We hope to show some early SMT assemblies including a 25-year old operational silver circuit – no copper, no solder, and no halogens.] SMT: The Next 25 Years Ron Lasky, Ph.D., Dartmouth College/Indium Corporation What can we expect in SMT assembly and Electronics in the Next 25 years? This light, but hopefully realistic look at the future will rest on several principles: 1. Zapfardt's View on Predictions: a. Near term predictions are almost always to optimistic b. Long term predictions are almost always too pessimistic 2. Products usually drive technology, not vice versa 3. Product Roadmaps will be helpful, but not sufficient We will begin by looking back 25 years and see if we could have predicted what we have today. With this wisdom, we will look forward to the next 25 years. Extrapolation will help some, but a quantum leap or two will be needed for our journey. The burning question of "Will we be soldering in 25 years" will also be answered. Plan now to join your colleagues and SMTA "family" for this night to be remembered. Cost: $75. Opening Session Tuesday, October 6 8:00am – 9:30am FREE to All Attendees! What a Difference 25 Years Makes Phil Marcoux, TPL Group Pb-free Solder and Beyond: Trends and Challenges Paul Vianco, Ph.D., Sandia National Laboratories The 2008 SMTA International Conference Award Winners will also be recognized: Best of Conference Presentation: Gregory Henshall, Ph.D., Hewlett-Packard Best of Proceedings Paper: Pradeep Lall, Ph.D., Auburn University Best International Paper: Isabel de Sousa, IBM (Canada) Processes and Six Sigma Greenbelt Certification Get the recognition you deserve with the industry's most respected sign of approval October 5-7 (Processes) October 6-8 (Six Sigma/Green Belt) Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination. For more details visit the certification page. Contract Manufacturing Symposium Organized by Mike Buetow, UP Media Group/Circuits Assembly Magazine and Sue Mucha, Powell-Mucha Consulting, Inc. Wednesday, October 7 1:30pm – 5:00pm FREE with VIP or Technical Conference Registration! As outsourcing continues to be a growing trend in the electronics manufacturing industry, SMTA International provides the skills and information that you need to form profitable relationships. Whether you are a contract manufacturer, a customer, or an investor, you'll benefit from the Contract Manufacturing Symposium. SMTA Annual Meeting/Keynote Luncheon "NASA’s Missions - Achieving Success" Peter Barry, Jet Propulsion Laboratory (JPL) Wednesday, October 7 11:30am - 1:30pm Recall NASA's Apollo Program, a sequence of missions to the Moon! NASA has many successful human and robotic missions and programs. NASA is now planning to return astronauts to the Moon and also possibly to Mars through the Constellation Program. NASA's Jet Propulsion Laboratory (JPL), the preeminent national laboratory in robotic exploration of the universe - including successful missions from Voyager to the Mars Exploration Rovers (Spirit and Opportunity) - will play a role in the success of this exciting program. To assure mission success at JPL, a Mission Assurance team independently assesses risks in collaboration with flight projects to eliminate or mitigate risk. The mission assurance team is comprised of specialists from EEE parts, packaging, hardware/software quality assurance, reliability, system safety, and environmental engineering. Join Peter Barry at the SMTA Annual Meeting and Awards Ceremony at SMTA International, October 7, 2009, where he will present an overview of NASA's missions, current and future, and the role mission assurance plays to achieve success. Peter Barry works on the Diviner Lunar Radiometer Experiment that is launching June 2009 on board the Lunar Reconnaissance Orbiter (LRO); he is also the MAM for Space Technology 7 (ST-7), and the International Space Station-to -CEV Communications Adaptor (ICCA). Peter holds a BS in Industrial Technology from California State University at Los Angeles. He has worked at JPL for 22 years, and his past assignments have been with the EEE Parts Engineering Group, the Hardware Quality Assurance Office, and the JPL Office of the Management System. 3rd Annual SMTAI Golf Tournament Come…to golf with friends Come…to entertain customers Join us for the 3rd Annual SMTAI Golf Tournament at Riverwalk Golf Club in San Diego, CA on Thursday, October 8, 2009. The course is just across the street from the Town and Country Resort and Convention Center. We guarantee that you will enjoy yourself and have a challenging game! The tournament begins with a shotgun start at 8:00am and ends with a delicious awards luncheon. Ted Robinson and Ted Robinson Jr. designed this 27-Hole Championship Course featuring undulating fairways, waterfalls and well protected bent grass greens. The San Diego River and one of the four lakes comes into play at 13 of the 27 holes. Conveniently located in Mission Valley, Riverwalk is just minutes from Sea World, the world famous San Diego Zoo and the beautiful beaches of Southern California. See more about Riverwalk Golf Club at: www.riverwalkgc.com LOCATION: Riverwalk Golf Club 1150 Fashion Valley Rd San Diego, California 92108 TIME: 8AM Shotgun Start Thursday, October 8, 2009 View the score card here. Cost: $125/player, $500/team before September 25 $150/player, $600/team after September 25 Contact: Gayle Jackson gayle@smta.org 540-763-2191 Sponsorships Available: smta.org/smtai/sponsorinfo.cfm Lead-Free Soldering Technology Symposium Organized by Paul Vianco, Ph.D., Sandia National Laboratories and Matt Kelly, IBM Corporation Thursday, October 8 8:00am – 5:00pm Free With VIP or Technical Conference Registration Lead-free soldering technology continues to experience a broad range of research, development, and implementation activities worldwide. It is critical that fundamental information be shared across the electronics industry in order to assure successful product cycles from design, through manufacturing, and finally reliable service performance. At the present time, topics of particular technical interest are the influx of alternative solder alloys and, secondly, assessing the long-term reliability of Pb-free solder interconnections. This year’s Lead-Free Soldering Technology Symposium will begin with an overview of Pb-free processing and reliability investigations underway at England’s National Physical Laboratory (NPL). The NPL has been clearly one of the leading institutions in Pb-free technology within the EU. The second session will examine the performance variables of new Pb-free solder alloys. The iNEMI consortium has an extensive alternate alloys study underway; the results of those efforts will be reported upon at the symposium. Similarly, papers from Siemens AG and U. of Rostock will describe important reliability studies being performed on alternative solders. The ever-popular case studies session will follow the alternative alloys papers. Case studies will be featured that describe the challenges facing producers tasked with implementing Pb-free solders on high-reliability assemblies having a high mix of component types. The symposium will conclude with a very interesting reliability session. This year’s symposium session includes two papers that examine dwell time effects on the thermal fatigue results of Pb-free solders. A review will also be presented describing data obtained from “mild” thermal fatigue tests (-20/80C) performed as part of the JCAA/JG-PP Lead-Free Solder Project. The closing paper will address one of the most important issues facing Pb-free reliability testing – determination of acceleration factors. Home | Top Copyright © 1999-2009 SMTA, All rights reserved. Reproduction in whole or in part without permission is prohibited. SMTA Headquarters - 5200 Willson Road - Suite 215 - Edina - MN - 55424 - Phone 952.920.7682 - Fax 952.926.1819