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Poster Session
October 26, 2010
12:00pm - 2:00pm
Show Floor Theatre in the Exhibit Hall
Poster Sessions are an alternate method of disseminating and evaluating research, and provide
a valuable exchange of information with industry professionals. During the scheduled Poster Session, presenters discuss their research, the details of their project's objectives and methodology, and encourage feedback from observers.
Free Lunch!
Everyone is welcome to join us 12-2pm on Tuesday (October 26) for a free lunch on the show floor during the Poster Session.
See the following presentations and engage in stimulating discussion with the authors!
Chip Size 0.5mm Pitch Array Interconnect Solution
Ila Pal, Ironwood Electronics
A Recipe for Success in Implementing Lead-Free Assembly for High Reliability Products
Marie Cole, Matthew Kelly, Larry Pymento, Willie Davis, Celeste Zippetelli; IBM Corporation
New Optical Inspection Technology for Packaging Applications
Wojciech Walechi, Sunrise Optical
Simulation and Statistical Study of Tin Whisker Growth
Jinghu Luo, Binghamton University
Investigation of Temperature Impact on Electronic Nose System
Jinghu Luo, Binghamton University
BGA Rework: Single Ball Reballing Process
Neil O'Brien, Finetech
Damage Accumulation of Lead-Free Solder in Variable Loading Environments
Linlin Yan, Binghamton University
Microstructure Change and Damage Accumulation on Lead-Free Solder in Thermal-Mechanical Environment
Linlin Yan, Binghamton University
Better Acceleration Factors and More Highly Accelerated Testing of Lead-Free Solder Joints
Awni Qasaimeh, Binghamton University
A Practical Guide to Establishing Ionic Cleanliness Requirements
Keith Sellers, Trace Laboratories, Inc.
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I really enjoyed the meaningful presentations specific to real world assembly processes.
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