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SMTAI covers the most important topics in the industry. Discover the latest technologies and techniques, stay current with industry trends and learn from the following respected tutorial instructors.
Please note the  preceding some of the instructor biographies listed below. These internationally respected instructors have been recognized by the SMTA International Technical Committee for consistently receiving exceptionally high ratings from attendees for the specific course they are teaching this year at SMTAI.
Charles E. Bauer, Ph.D., serves as Senior Managing Director of TechLead Corporation, a technology management company specializing in the electronics packaging, interconnection and assembly industry. Dr. Bauer focuses in the areas of strategic technology planning, market analysis and business development, primarily in the international arena. With more than 20 years experience spanning the range from printed circuit board and hybrid fabrication through complex IC metallization, multilayer packaging, multichip modules (MCMs) and flat panel display packaging and assembly he brings tremendous breadth and depth to his work. Dr. Bauer lectures throughout the world on technology, business and market topics as well as serving on several corporate boards and international corporate, government and educational institution advisory councils.
Chuck served ISHM as President of the NW Chapter, Technical Chair of the ISHM National Symposium in Seattle, National Technical Vice President of the Society and President of the Rocky Mountain Chapter. He founded the ISHM/IMAPS Advanced Technology Workshop program and served as General or Technical chair for several ATWs between 1990 and 1998. Dr. Bauer also served on the Board of Directors of the SMTA from 1997 through 2001 when elected President of IMAPS for 2001-2002. He now serves as Chair of the SMTA International Development Committee and remains active internationally with the SMTA, IEEE, IMAPS, JIEP and ASM.
Michael Carano is with OM Group, Inc. The company is a diversified global developer, producer and marketer of value-added specialty chemicals and advanced materials that are essential to complex chemical and industrial processes. Key technology-based end-use applications include affordable energy, portable power, clean air, clean water and proprietary products and services for the microelectronics industry. Headquartered in Cleveland, Ohio, OM Group operates manufacturing facilities in the Americas, Europe, Asia and Africa. Carano has been involved in the printed wiring board industry for over 29 years. His primary focus is on metallization technologies, electroplating, solderable finishes, HDI, selective metal finishing, semiconductor packaging and imaging processes. Carano has published over 65 technical articles and has presented numerous other papers throughout the world. He is the holder of nine U.S. patents and over 20 foreign patents covering a variety of technologies, including plating, metallization processes and pwb fabrication techniques. He is the past chairman of the IPC Suppliers Management Council and currently serves on the IPC Long Range Planning committee.
He holds a Bachelor's degree in Chemistry from Youngstown State University where he has also completed two years of graduate school in polymer chemistry and has earned an MBA in International Marketing from Baker College.
Joseph Fjelstad is an inventor with more than 200 patents issued or pending, author or co-author/editor of several books (most recent is Flexible Circuit Technology, 3rd Edition), electronics industry magazine columnist, occasional consultant and lecturer and 37 year veteran entrepreneur of the electronics interconnection industry. His most recent venture, Verdant Electronics is developing a novel, cost effective and environmentally friendly circuit manufacturing technology. He was the first appointed fellow at CSP pioneer Tessera, IEEE-CPMT Senior Member. IPC President's Award recipient and was identified in poll of PCB industry foll
Ken Gilleo, Ph.D., who served on the SMTA BoD for 6 years, has a PhD in organic chemistry and has applied it to flex materials and processes. He developed new products for over 35 years and holds dozens of US patents. His flex products have received 3 R&D 100 Awards. Ken has authored over 500 papers, presentations and workshops. He has written books on flex, PTF and BGAs. His 8th book, on The Day Niagara Falls Turned Green, is a free web download at ET-Trends.com. Ken gained flex experience while heading R&D at Sheldahl, Poly-Flex Circuits, and Tessera.
James W. Hall is a Principal Consultant and resident Lean Six Sigma Master Black Belt with ITM Consulting (Durham, NH). His area of responsibility includes working with OEM's, Contract Assemblers, and Equipment Manufacturers to solve design and assembly problems, optimize facility operations, as well as teaching basic and new technologies in private and public forums throughout the industry, world-wide. Since joining ITM in 2001, Mr. Hall has helped numerous clients in such areas as:
SMT implementation and assembly facility set-up
Manufacturing yield improvement
Counterfeit Component avoidance and mitigation
Equipment evaluation and selection
Lead-free road-mapping and implementation
SMT manufacturing process audits and process improvement
On-site training for all levels of personnel
Design for Manufacturability (DFM) specification development
Implementation of BGA, CSP and flip-chip
SMT process equipment benchmark testing and evaluation
SMT product development
Process structure and documentation development
Jim is one of the authors of the highly acclaimed SMTA Process Certification Course, along with Dr. Ron Lasky and Phil Zarrow. From its introduction in September 2002, he has served as the program's principal instructor, certifying over 200 engineers in the US, Canada, Mexico, Hong Kong, and China. Mr. Hall, coordinates and implements all updates and improvements to the exams and course materials.
As ITM's resident Lean Six Sigma Master Black Belt, Jim is a strong proponent of in-process data capture and analysis for all assembly and related operations and other continuous improvement techniques. He participates as an instructor in the Lean – Six Sigma programs offered at Dartmouth College, presenting units on subjects including:
LEAN
FMEA
DFM
TRIZ
Cost Estimating
Failure Analysis
Tear-Down Analysis
Mr. Hall, one of the pioneers of reflow technology, has been actively involved in electronic assembly technology for over 26 years. Jim's expertise lies in process development and integration, fluid and thermodynamics, and computer control systems. He has delivered numerous papers and workshops on surface mount technology at technical seminars around the world including those for NEPCON, IMAPS and SMTA. Jim is also the co-host of Circuitnet/Circuitmart's "BoardTalk" audio program.
Jennie Hwang, Ph.D., has contributed to SMT manufacturing since its inception and conducted pioneering lead-free R&D and hands-on production implementation. She has served as an advisor to major OEMs, EMS companies and the U.S. government, providing solutions to challenging problems in production defects, field failure and reliability issues. She has held executive positions with Lockheed Martin, Sherwin Williams, SCM Corp. and IEM Corp. Her formal education includes Harvard Business School Executive Program, Ph.D., M.S., M.A. and B.S degrees in materials science and engineering, chemistry, and liquid crystal science, respectively. Dr. Hwang has received numerous honors and awards, including citations by the U.S. Congress, Honorary Doctoral degree, induction into WITI International Hall of Fame, named "R&D Star-to-Watch" by Industry Week; YWCA Women of Achievement Award; election to the National Academy of Engineering, etc. She is the author of 300+ publications including several textbooks, and a speaker in innumerable international and national events. She serves on the boards of many companies, civic groups and universities and is also an invited distinguished adj. professor for the engineering school of Case Western Reserve University and serving on its Board of Trustees.
Andrew Mawer is currently a Senior Member of the Technical Staff and the manager of the Packaging Applications and Analysis Labs within the Worldwide Quality organization at Freescale Semiconductor in Austin, Texas. Freescale was formerly the Semiconductor Products Sector of Motorola until becoming an independent company in 2004. Andrew has been with Freescale/Motorola for a total of 16 years. His primary areas of interest there are new packaging technology assessment and implementation, resolution of customer assembly issues and array packaging interconnect reliability characterization. Prior to joining Freescale/Motorola, Andrew spent four years at Compaq Computer where he was involved with the implementation of some of the first high pin count Plastic BGAs in the industry. He has been active in authoring and presenting on many aspects of packaging and reliability at a variety of conferences, symposia, and in industry publications including two book chapters. Mr. Mawer is an active member of SMTA and serves on the Technical Committee of the SMTA International Conference, the Review Board of the SMTA Journal and as the Vice President of the Central Texas SMTA chapter. Andrew received his B.Sc. degree in Mechanical Engineering from the University of Texas at Austin, in 1987 and an M.Sc. degree in Mechanical Engineering from Rice University in Houston, Texas, in 1989.
Herbert J. Neuhaus, Ph.D., serves as Director of Operations of TechLead Corporation, where he supports clients around the world in the areas of intellectual property management and valuation, technical cost modeling, and develops of strategic planning tools. Active since 1980 in the development and characterization of electronic materials and associated manufacturing processes for a wide variety of applications including flip-chip for RFIDs and Smart Cards, LED assembly, chip interconnect and passivation, multichip modules, printed wiring boards, and flat panel displays, Dr. Neuhaus synthesized a unique perspective on electronics packaging, interconnection and assembly industry.
Dr. Neuhaus received his Ph.D. degree in Physics from the Massachusetts Institute of Technology and the prestigious distinction of Fellow of the Society of the International Microelectronics and Packaging Society (IMAPS). He currently chairs the materials subcommittee of the IMAPS National Technical Committee and serves on the Board Vyta Corp.
Ray Prasad is the founder of Ray Prasad Consultancy Group. Before starting his consulting practice in 1994, Mr. Prasad held key technology positions at Boeing and Intel for 15 years. He was the SMT Program Manager at Intel responsible for developing and implementing SMT for the system products. He also developed and taught DFM and SMT manufacturing courses to Intel engineers. For establishing the SMT infrastructure at Intel he was recognized by Intel CEO Andy Grove. He also managed the Intel PentiumProTM package program for Intel and introducing SMT into Boeing airplanes when he served as a lead engineer at that company.
Author of the text book Surface Mount Technology: Principles and Practice published by Walter Kluwer Academic Publishers and over 100 papers, Mr. Prasad holds two patents in BGA and is a popular workshop leader for in depth SMT, BGA/CSP and Lead free professional courses at national and international conferences and in major OEM and EMS companies.
A long time member of IPC, he is currently the chairman of BGA committee IPC-7095 "Design and Assembly Process Implementation for BGA". He is the past chairman of the Surface Mount Land Pattern (IPC-SM-782) and Package Cracking (J-STD-020) committees.
Mr. Prasad is the recipient of SMTA's Member of Distinction Award and IPC President's award for his contribution to the advancement of electronics industry and recipient of Intel's highest award – Intel Achievement Award. He is a columnist for the SMT magazine and also serves on its advisory board.
Mr. Prasad received his BS in Metallurgical Engineering from the Regional Institute of Technology, Jamshedpur in India and MS in Materials Science and Engineering and MBA from the University of California at Berkeley, USA. He is a registered Professional Metallurgical Engineer.
S. Manian Ramkumar, Ph.D., is a Professor at the Rochester Institute of Technology (RIT) and is the Director for the Center for Electronics Manufacturing & Assembly (CEMA). He teaches courses in surface mount electronics packaging and manufacturing automation. He was instrumental in developing the Center at RIT. This Center is equipped with assembly and failure analysis equipment, to support hands-on training and applied research projects for industry. Dr. Ramkumar has been the principal investigator for several applied research projects. He has presented technical papers at the SMTA, APEX, IMAPS, ASME and IEEE conferences. He also teaches Surface Mount Technology (SMT) and Advanced Packaging courses at the IPC-APEX and SMTA shows and for various companies on-site.
Rob Rowland is currently the Supplier Engineering Manager at RadiSys Corporation in Hillsboro, Oregon. Rob has more than 20 years of experience with surface mount manufacturing technology. He is an active member of the Surface Mount Technology Association (SMTA), where he served 2 terms as a chapter president and multiple terms as technical director of SMTA International. In 1999 he received the Founders Award from the SMTA and in 2005 and 2008 he received Distinguished Committee Service Awards from the IPC for his contributions to IPC-7095. He was also a member of the IPC/EIA Surface Mount Council for nine years. Rob is a frequent author and speaker at industry trade events. He also writes a manufacturing column for SMT Magazine in addition to serving on the editorial advisory board. Rob is the co-author of the book Applied Surface Mount Assembly. He received a Bachelor of Science Degree in Manufacturing Engineering from Weber State University.
Randy Schueller, Ph.D., received his advanced degree in Materials Science Engineering from the University of Virginia in 1992 and then spent 7 years at 3M leading a team in the development of numerous flex based IC packages. He then joined Extreme Devices Inc. where he spent 4 years as IC Packaging and Engineering Director. Randy moved to Dell in 2003 to assist in the lead-free transition of Dell products. As Sr. Manager of Dell's Component Engineering and Failure Analysis Groups, Randy has spent the past 5 years at the forefront of successfully guiding Dell to lead-free on all their products, including class A servers. He recently joined DfR Solutions as a Sr. Member of Technical Staff and Minneapolis Office Manager. Randy has 15 patents and has authored and presented over 30 papers for the electronics industry.
Chrys Shea has been analyzing circuit assembly processes for nearly 20 years, and is well known for her common-sense, practical approach to resolving processing issues. She has been sharing her research findings and observations for the past decade, authoring numerous technical articles and regular magazine columns on a variety of PCB assembly-related topics. Chrys earned her Bachelor's Degree in Mechanical Engineering from the University of Massachusetts and her Master's Degree in Manufacturing Engineering from the University of Rhode Island. She is the founder and owner of Shea Engineering Services.
Bob Willis has been involved with the introduction and implementation of lead-free process technology for the last seven years. He recently received A SOLDERTEC/Tin Technology Global Lead-Free Award for his contribution to the industry to help the implementation of the technology. He was responsible for co-ordination and introduction of the first series of hands-on lead-free training workshops in Europe for Cookson Electronics during 1999-2001. These events were run in France, Italy and the UK and involved lead-free theory, hands-on paste printing, reflow, wave and hand soldering exercises. Each non commercial event provided the first opportunity for engineers to get first hand experience in the use of lead-free production processes and money raised from the events was presented to local charity. More recently he co-ordinated the SMART Group Lead-Free Hands On Experience at Nepcon Electronics 2003. This gave the opportunity for over 150 engineers to process four different PCB solder finishes, with two different lead-free pastes through convection and vapour phase reflow. He also ran the Experience 2 & 3 in 2004/2005. 2006 sees Nepcon back at Birmingham and Bob will again be organising the features. Bob was recently presented with awards from the SMTA and IPC for his industry support.
Bob has also run training workshops with research groups like ITTF, SINTEF, NPL & IVF in Europe. Bob has organised and run three lead-free production lines at international exhibitions Productronica, Hanover Fair and Nepcon Electronics in Germany and England to provide an insight to the practical use of lead-free soldering on BGA Ball Grid Array, CSP Chip Scale Package, 0210 chip and through hole intrusive reflow connectors. This has resulted in technical papers being published in Germany, USA and the United Kingdom. Bob also defined the process and assisted with the set-up and running of the first Simultaneous Double Sided Lead-Free Reflow process using tin/silver/copper for reflow of through hole and surface mount products. This year 2005, he will be running a Lead-Free Production and Seminar feature at Productonica in Munich Geramany with Global SMT magazine.Bob also had the pleasure of contributing a small section to the first Lead-Free Soldering text book "Environment - Friendly Electronics: Lead-Free Technology" written by Jennie Hwang in 2001. The section provided examples of the type of lead-free defects companies may experience in production. Further illustrations of lead-free joints have been featured in here most recent publication "Implementing Lead-Free Electronics" 2005.
Phil Zarrow has been involved with PCB fabrication and assembly for more than thirty years. His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies. In addition to his background in automated assembly and cleaning, Mr. Zarrow is recognized for his expertise in surface mount reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems. Having held key technical and management positions with Vitronics Corporation, Excellon-Micronetics and Universal Instruments Corporation, he has extensive hands-on experience with set-up and troubleshooting through-hole and SMT processes throughout the world.
In 1991, Phil began working for GSS/Array Technology, an EMS provider located in San Jose, CA. During his tenure as Director of Technology Development for GSS/Array Technology, Mr. Zarrow was responsible for specifying and setting up medium- and high-speed assembly lines, as well as investigating and implementing emerging and leading-edge technologies, equipment and processes.
Since forming ITM in 1993, Phil Zarrow has helped numerous clients in such areas as:
EMS/Supplier Process and Quality Assessment Audits
Counterfeit Component Avoidance and Interception Programs
SMT Implementation and Assembly facility set-up
Lead-free Process Implementation and Optimization
Manufacturing yield improvement
Equipment Evaluation and Selection
No-clean and lead-free solder paste evaluation and process implementation
SMT Manufacturing Process Audits and process improvement
On-site training for all levels of personnel
Design for Manufacturability (DFM) specification development
Reflow of Through-hole feasibility, development and implementation
Implementation of BGA, CSP and Flip-Chip
SMT process equipment benchmark testing and evaluation
SMT product development
Technical evaluations related to business acquisitions and mergers
Technical assistance in legal disputes
Mr. Zarrow is a popular speaker and workshop instructor. He has chaired and instructed at numerous seminars and conferences in North America, Europe, and the Pacific Rim. He has published many technical papers and magazine articles as well as contributed a number of chapters to industry books. He is co-author of the book, "SMT Glossary- Terms and Definitions".
Phil is a member of IPC, SME, IMAPS, a co-founder of ITM Incorporated, and is a past national level officer and national director of the Surface Mount Technology Association (SMTA). He was also Chairman of the Reflow Committee for SMEMA. He was the recipient of the SMTA's Member of Distinction Award (1995) and Founders' Award (2000). Mr. Zarrow has served on the Editorial Advisory Board for Circuits Assembly Magazine and won awards for his writings "On the Forefront" and "Better Manufacturing" columns. He is currently producer and co-host of Circuitnet/Circuitmart's "Boardtalk" audio program.
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