SMTA International  

Conference: Sep. 27 - Oct. 1, 2015  
Exhibition: Sep. 29 - 30, 2015  

Donald Stephens Convention Center  
Rosemont, IL  
 

Call for Papers

Be Part of the Solution...
Participate in the industry's best technical conference

Rob Rowland, SMTAI Conference Director
On behalf of the SMTA International Technical Committee, I invite you to submit an abstract for the 2015 conference. Short course (1/2 day - 3.5 hours) proposals are also being solicited.

Materials must be original, unpublished and non-commercial in nature. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data.

There are many benefits to participating!

You will:
1. Make a contribution to our industry by sharing your work.
2. Network with industry colleagues and showcase your company's position in the industry as an author and speaker,
3. Receive a discount on your conference registration.
4. Be eligible for $1,000 cash awards for the 'Best of Conference', 'Best of Proceedings', and 'Best International' papers.
5. $500 award for the best student paper.

We look forward to reviewing your abstract!
Rob Rowland
SMTAI Committee Chair
Axiom Electronics

Abstracts Due: February 13, 2015
Acceptance: April 28, 2015 | Final Papers Due: July 13, 2015

Choose the Submit Abstract button below and fill out all information on the following form.
Emailed abstracts will not be accepted, they must be submitted online.

IMPORTANT: Please be sure to obtain approval to both write and present your paper prior to submitting an abstract. When a paper is accepted by the Technical Committee, it is our expectation that you have budget approval for travel costs and conference registration which is required for speakers.

The Technical Committee is soliciting abstracts in the following categories:

Component Packaging Technology:
  • 0.3mm Pitch
  • 2.5/3D Packaging and Integration
  • BGA/CSP
  • Biomedical Packaging
  • Component Storage
  • CU Pillars
  • Copper Wire Bonding
  • Direct Chip Attach
  • Embedded and Miniature Passives
  • Environmental Testing
  • Failure Analysis Techniques
  • Fine Pitch BGA
  • Flip Chip
  • Hermetic Packaging
  • High Temperature Packaging
  • Lead Finishes
  • MEMS and Sensors
  • Moisture Sensitive Devices (MSD)
  • Package on Package (PoP)
  • Photonics
  • Photovoltaics and Solar
  • Reliability
  • Stacked Die
  • System in Package (SiP)
  • Through Silicon Vias (TSVs)
  • Tin Whiskers
  • Wafer Level Packaging (WLP)


  • Assembly:
  • 01005 Component and Assembly
  • Additive Manufacturing
  • Adhesives
  • Alternate Alloys
  • BGA/CSP Assembly
  • Bottom Terminated Components
  • Cleaning
  • Conformal Coating and Potting
  • Connector Technology
  • DFX/Design for Six Sigma
  • Dispensing
  • Equipment Selection
  • Facility Layout
  • Flux and Solder
  • Halogen and Halogen-Free
  • Head on Pillow Defect/Warpage Induced Solder Joint Defects
  • High Melting Point Solder
  • Leadless Packages (LGA/QFN/BTC)
  • Lead-Free Soldering/Reliability
  • Lean Manufacturing
  • Low Temperature Processing
  • Low Volume/Prototype
  • Medical Electronics
  • Non-Wet Open Defects
  • Part Obsolescence
  • Placement
  • Printing
  • Reflow Soldering
  • Rework and Repair of QFNs
  • RFID Assembly
  • Selective Soldering
  • Set Up Reduction
  • Solder Paste
  • Solder Voids
  • Supplier Engineering
  • Underfill/ Corner Glue/ Other Polymeric Reinforcements
  • Vapor Phase Reflow
  • Wave Soldering
  • Yield Improvement


  • Business/Supply Chain:
  • Capacity Modeling
  • Conflict Minerals
  • Contract Manufacturing
  • Counterfeit Parts
  • Doing Business in Asia
  • Environmental Issues
  • Lean Manufacturing
  • Onshoring
  • Operations Management
  • Part Obsolescence
  • Remaining Competitive
  • RoHS/REACH Compliance
  • Supplier Management
  • Technology Roadmaps


  • Emerging Technologies:
  • 0201/01005 Components/Assembly
  • 3D Printing
  • Advanced Packaging
  • Alternate Alloys
  • Cavity Assembly
  • Consumer Applications
  • Embedded Active Technology
  • Embedded Passive Technology
  • Flexible Electronics
  • LED Technology/Assembly/Reliability
  • MEMS/RF/MOEMS
  • Microsystems Packaging / Modular Microsystems
  • Nanotechnology, Materials, & Electronics
  • New Materials and Processes
  • Optoelectronics
  • Power Electronics
  • Power or Thermal Management
  • Printed Electronics Technology
  • Reliability of Nanodevices
  • Resin Reinforcement Solder Pastes
  • Sensors and Manufacturing
  • Smart Manufacturing Systems
  • Nanomaterials
  • Solar Technology
  • Solid State Lighting
  • System in a Package
  • Thermal Interface Materials
  • Touch Screen Technologies
  • Wearable Electronics
  • Wireless Applications


  • Harsh Environment Applications:
  • Alternate Energy
  • Components and Reliability
  • Copper Corrosion
  • COTS
  • High Temperature Electronics
  • Lead-free Issues
  • Micro-Computed Tomography
  • Non-Destructive Inspection
  • Substrates and Finishes
  • Thermal Management
  • Tin Whiskers
  • Using ISO 71.04 in robust designs


  • PCB Technology:
  • Black Pad and Surface Finish Defects
  • Creep Corrosion
  • Embedded Passive/Active Components
  • Halogen Free
  • HDI
  • High Power PCBs
  • Microvias (including filled/unfilled)
  • Moisture Sensitivity
  • New Laminate Materials
  • New Surface Finishes
  • Pad Cratering
  • Soldermask
  • Substrate Reliability
  • Substrate Solderability
  • Surface Finish


  • Inspection Technologies:
  • 2D/3D X-Ray
  • Acoustic Imaging (C-SAM)
  • AOI
  • CIM
  • In-Circuit Test
  • Process Modeling
  • Software
  • Solder Paste Inspection
  • Test Strategies




  • Thanks and the SMTAI Technical Committee looks forward to hearing from you!

    SMTAI Conference Chair, Rob Rowland, Axiom Electronics
    SMTA VP Technical Programs, Raiyo Aspandiar, Ph.D., Intel Corporation
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    CEO, Libra Industries

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