Conference At-A-Glance

T1 Advanced Component Packages and Processes
8:30am - 12:00pm
(Room 104)

T2 Electrochemical Migration and CAF Formation
8:30am - 12:00pm
(Room 202C)

T3 Design and Assembly for Flexible and Rigid Flex Circuits
8:30am - 12:00pm
(Room 103A)

T4 Flip Chip Technology and Processing
8:30am - 12:00pm
(Room 103B)

T5 SMT Process Fundamentals for Tin-Lead and Lead-Free Assembly
1:30pm - 5:00pm
(Room 104)

T6 Ball Grid Array: Principles and Practice
1:30pm - 5:00pm
(Room 202C)

T7 The Deadly Sins of SMT and Lead-Free Assembly
1:30pm - 5:00pm
(Room 103A)

T8 3D Packaging, Interconnect and Assembly
1:30pm - 5:00pm
(Room 103B)

T9 SMT Manufacturing: Preventing Production Defects and Failures - Part I
8:30am - 12:00pm
(Room 202C)

T10 Selective Soldering Processing and Manufacturability
8:30am - 12:00pm
(Room 103A)

T11 Design and Assembly Process Challenges for BTCs
8:30am - 12:00pm
(Room 104)

T12 Failure Analysis: Lessons Learned in Manufacturing and Research
8:30am - 12:00pm
(Room 103B)

T16 Soldering Technology for SMT: Achieving High Yields and Reliability
8:30am - 12:00pm
(Room 103B)

T13 Key Issues of High-Speed Digital Design
1:30pm - 5:00pm
(Room 103A)

T14 SMT Manufacturing: Preventing Production Defects and Failures - Part II
1:30pm - 5:00pm
(Room 202C)

T15 DFM: Impacts to Achieving High Yield Process with Today's PCB and Component Packaging
1:30pm - 5:00pm
(Room 104)

T17 Implementing High Reliability Lead-Free Assembly and Test Methodologies
1:30pm - 5:00pm
(Room 201C)

HE1 Thermal Issues with Harsh Environment Electronics
8:30am - 10:15am
(Room 202A)

HE2 Modeling and Predictions in Harsh Operational Environments
10:30am - 12:00pm
(Room 202A)

HE3 Power Electronics Packaging
1:30pm - 3:00pm
(Room 202A)

HE4 Lead-Free for High Reliability Applications
3:30pm - 5:30pm
(Room 202A)

ET1 Printed Electronics Technology Status and Implementation Challenges
10:30am - 12:00pm
(Room 203C)

ET Keynote Lunch
12:15pm - 1:15pm
(Room 203C)

ET2 Materials, Materials, Materials
1:30pm - 3:00pm
(Room 203C)

ET3 Evolving Technologies Panel — FREE!
3:30pm - 5:00pm
(Room 203C)

AAT1 Addressing the Challenges of Emerging Package Technologies
10:30am - 12:30pm
(Room 202B)

MFX1 Challenges and Solutions for Liquid Soldering Processes
10:30am - 12:00pm
(Room 202D)

EMS1 Seamless Sourcing Teams: Best Practices in Information Exchange
10:30am - 1:00pm
(Room 203C)

ENV1 Sustainability and Environmental Regulations
10:30am - 12:00pm
(Room 104)

HE5 Reliability of Pb-Free Electronic Products Subjected to Harsh Field Conditions
2:00pm - 3:30pm
(Room 202A)

AAT2 QFN Package Reliability
2:00pm - 3:30pm
(Room 202B)

MFX2 Advanced Studies in Bumped Component Reliability
2:00pm - 3:30pm
(Room 202D)

SMT1 Process Development for Miniaturized and High Reliability Electronics
2:00pm - 3:30pm
(Room 202C)

HE6 Manufacturing for Harsh Environments
4:00pm - 5:30pm
(Room 202A)

AAT3 Pad Cratering
4:00pm - 5:30pm
(Room 202B)

MFX3 Conformal Coating: The Next Level for High Reliability in Harsh Environments
4:00pm - 5:30pm
(Room 202D)

SMT2 Performance of Stencil Applied Coatings
4:00pm - 5:30pm
(Room 202C)

The sessions below all spotlight some of today's challenges and their solutions. These sessions are FREE to all SMTAI attendees and will be held in the Exhibit Hall Theatre.

SPOTLIGHT 1 Polymeric Reinforcement of BGAs
9:30am - 11:00am
(Exhibit Hall Theatre)

SPOTLIGHT 2 CAMEST: The Newest Industry Coalition
11:30am - 12:30pm
(Exhibit Hall Theatre)

SPOTLIGHT 3 BGA Pad Cratering in PCB Laminates
1:30pm - 2:30pm
(Exhibit Hall Theatre)

SMT Process Certification
8:30am - 5:00pm
(Room 103A)

SMT Six Sigma Certification
8:30am - 5:00pm
(Room 103B)

AAT4 Development and Optimization of 0.3mm Pitch BGA Packages for Mobile Applications
8:00am - 9:30am
(Room 202B)

MFX 4 Reliability of Low Silver Alternative to SAC Alloys
8:00am - 9:30am
(Room 202D)

SMT3 BGA Profiling and Reballing
8:00am - 9:30am
(Room 202C)

AAT5 Advances in PoP: Process and Reliability
10:30am - 12:30pm
(Room 202B)

MFX5 Alloy Selection and its Influence on Electronic Assembly
10:30am - 12:00pm
(Room 202D)

SMT4 Advances in Reflow Soldering
10:30am - 12:30pm
(Room 202C)

AAT6 Wafer Level and Flip Chip Package Reliability
2:00pm - 3:30pm
(Room 202B)

MFX6 PCB Cavity or Inner Layer Component Assembly
2:00pm - 3:00pm
(Room 202D)

SMT5 BTCs: Voiding, Cleaning and Other Assembly Considerations
2:00pm - 3:30pm
(Room 202C)

AAT7 The Impact of the Process Environment on Solder Defects
4:00pm - 5:30pm
(Room 202B)

SMT6 Advancements in Cleaning Process Controls
4:00pm - 5:30pm
(Room 202C)

The sessions below all spotlight some of today's challenges and their solutions. These sessions are FREE to all SMTAI attendees and will be held in the Exhibit Hall Theatre.

SPOTLIGHT 4 Process and Yield Improvement in SMT
9:30am - 11:00am
(Exhibit Hall Theatre)

SPOTLIGHT 5 Test Engineering Strategies and Systems for Test of PCBAs in Manufacturing
11:30am - 1:00pm
(Exhibit Hall Theatre)

SPOTLIGHT 6 Increasing Product Reliability with Better ESD, SPI, SIR Understanding
1:30pm - 3:00pm
(Exhibit Hall Theatre)

SMT Process Certification
8:30am - 5:00pm
(Room 103A)

SMT Six Sigma Certification
8:30am - 5:00pm
(Room 103B)

PRC3 New Technologies for the Detection of Counterfeit Components
8:30am - 10:00am
(Room 204B)

PRC4 Counterfeit Components and Supply Chain Management
10:30am - 12:00pm
(Room 204B)

LF1 Printed Circuit Board Technology in a Pb-Free Electronics Industry: A Report by the High Density Packaging Users Group (HDPUG) Consortium
8:30am - 10:00am
(Room 204A)

LF2 Lead-Free Alloys, Surface Finishes, and Reliability Impacts
10:30am - 12:00pm
(Room 204A)

LF3 Miniaturization Effects on Pb-Free Process, Reliability, and Reworkability - AREA (Advanced Research in Electronic Assembly) Consortium
1:15pm - 3:00pm
(Room 204A)

LF4 Actively Improving Your Soldering Process
3:30pm - 5:00pm
(Room 204A)

T18 Design for Reliability for PCBs
FREE for Members!
8:30am - 12:00pm
(Room 104)

SMT Process Certification
8:30am - 5:00pm
(Room 103A)

SMT Six Sigma Certification
8:30am - 5:00pm
(Room 103B)