Pan Pacific Microelectronics Symposium
Thank you for attending Pan Pac 2017!
Save the Date for Pan Pac 2018!Plan to join us next year at the Hapuna Beach Prince Hotel on the Big Island of Hawaii.
February 5-8, 2018
Pan Pac 2018 Call for AbstractsAbstracts due July 1, 2017
Start planning now to present your research next year. Abstracts of 500 words should be submitted with title and author contact information.
The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.
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Pan Pac Provides You The Latest Research On
Steering CommitteePhil Isaacs, IBM Corporation, Chair
Denis Barbini Ph.D., Universal Instruments Corporation
Charles E. Bauer, Ph.D., TechLead Corporation
Ross Berntson, Indium Corporation
Dock Brown, DfR Solutions
Dwight Howard, Delphi
Soeren Noerlyng, MICRONSULT
Yasumitsu Orii, Ph.D., NAGASE Group
David Raby, STI Electronics
Roy Starks, Libra Industries
Jing Zhang, IBM Corporation