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Lord Corporation's Wang To Speak At International Microelectronics And Packaging Society Symposium


04/23/2012

(Cary, NC) – LORD Corporation – a leading supplier of thermal management materials, adhesives, coatings and encapsulants to the electronics, LED and solar industries –has announced that Larry Wang, Ph.D., staff scientist, Electronic Materials Research and Development at LORD Corporation, will present a paper at the International Microelectronics and Packaging Society (IMAPS) 3rd Advanced Technology Workshop and Tabletop Exhibition on Automotive Microelectronics and Packaging.
 
The paper will be presented on May 22 at Dearborn Inn in Dearborn, Mich. at 4:45 p.m. Wang's paper is titled: "Cooling from Down Under - Thermally Conductive Underfill."
 
In response to the need for protection and heat dissipation of flip chip devices in confined spaces where Thermal Interface Material (TIM) and heat sink is impractical, LORD developed a new class of thermally conductive underfills. This paper describes the key challenges in developing underfill technologies imposed by package geometrics and performance requirements, and discusses the development of a non-anhydride underfill with low viscosity, small particle size filler, high thermal conductivity and reliability. The results will be presented on the underfill material characterization, underfilling process parameter and flip chip device reliability.
 
Wang is responsible for the development and commercialization of new materials for the electronics market. With expertise in various areas including conductive materials, adhesives, underfills, potting and encapsulants, he also leads technical support to Marketing and Sales for the LORD electronics business. Having worked for LORD Corporation for 11 years, Wang has more than 20 years of combined industrial experience focused on adhesives, coatings and potting encapsulants for the electronics industry. Wang earned his Ph.D. in polymer science from Peking University.
 
For more information or to register for the 3rd Advanced Technology Workshop and Tabletop Exhibition on Automotive Microelectronics and Packaging, please visit www.imaps.org/automotive. 
 
About IMAPS
 
IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. Our Society offers chapters around the globe, creating global networks of more than 4,000 members in the United States and an additional 4,000 members throughout Europe and Asia.
 
About LORD Corporation
 
With global reach and extensive technical capabilities, LORD has the ability to work on complex formulations, balancing contradictory property and process requirements to deliver the solutions that meet customer and market demands. For the electronics industry, LORD serves as a diversified technology company providing high value-added materials to niche markets. LORD builds on its more than 80 year history with a track record of successful long-term partnerships with technology leaders in industries ranging from aerospace to automotive, electronics to industrial heavy equipment.  
 
Founded in 1924, LORD Corporation is a privately-held company that designs, manufactures and markets mechanical devices and electromechanical systems to control vibration, motion and noise; formulates, produces and sells general purpose and specialty adhesives, coatings and electronic materials; and develops products and systems utilizing magnetically responsive technologies. With headquarters in Cary, N.C., and sales in excess of $720MM, LORD has manufacturing in nine countries and offices in more than 15 major business centers. LORD Corporation employs more than 2,700 worldwide. Visit www.lord.com for more information.

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