ZESTRON to Present Award Winning Paper at the SMTA's Upper Midwest Chapter Meeting
Manassas, VA - September 7, 2011 - Ravi Parthasarathy, Senior Process Engineer at ZESTRON, the worldwide leading provider of high precision cleaning products and services for the electronics manufacturing industry, will present "Fluid Flow Mechanics – Key to Low Standoff Cleaning" at the SMTA's Upper Midwest Chapter meeting held at the Hennepin Technical College, Eden Prairie Campus, 13100 College View Drive, Eden Prairie, MN 55347, on September 13, 2011.
More than five years ago, ZESTRON first discussed cleaning underneath 4 MIL standoff components. With the emergence of lead-free solder and flux as well as a miniaturization of components and an increase in board densities, the latest challenges include components with less than 1 MIL gaps.
This study was designed to specifically investigate the impact of mechanical vs. chemical energy during the removal of contamination under 1-2 MIL standoff components. To validate the results obtained, extensive experiments were conducted, including actual user case-studies, specifically prepared test assemblies, iterative experimentation, as well as new mechanical innovations that might help customers in the future. These included but were not limited to various flow patterns and industry leading cleaning agents. As a result, the authors also included experimental data that addressed fluid flow mechanics as well as temperature and concentration related effects.
For more information on this topic, please join Mr. Ravi Parthasarathy at the SMTA's Upper Midwest Chapter meeting or contact ZESTRON's Application Technology Department at (703) 393-9880 (www.zestron.com). To register for this event, please visit http://www.smta.org/chapters/chapters_detail.cfm?chapter_id=1#chapter_news.
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