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Indium Corporation's Dr. Lee Receives Best Presentation Award at NEPCON China


05/23/2011

Indium Corporation Vice President of Technology Dr. Ning-Cheng Lee was recognized for Best Presentation of Technology Conference One at NEPCON China (Shanghai) 2011 by Surface Mount Technology Association (SMTA) China East.
 
Dr. Lee presented Voiding Control for QFN Assembly, which included the challenges and most effective practices for controlling voids during the QFN assembly process. According to Dr. Lee, "Voiding behavior of the QFN can be controlled by improved design in the thermal pad, thermal via, and reflow profile." A copy of Dr. Lee's paper is available at www.indium.com/techlibrary/whitepapers.  
 
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership.

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