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NOVELLUS, ATMI AND ENTHONE INTRODUCE ENHANCED ELECTROCHEMICAL DEPOSITION PROCESS FOR COPPER

Three-Way Collaboration Advances Copper Interconnect Technology for 32 Nanometers and Beyond
03/17/2009

DANBURY, Conn. - March 17, 2009 – Novellus Systems (NASDAQ: NVLS), ATMI, Inc. (NASDAQ:ATMI), and Enthone Inc. today introduced ViaForm® Extreme Pura™, a new copper deposition process and chemistry for manufacturing advanced copper interconnects at 32 nanometers (nm) and beyond. This new process technology provides a high degree of process control, enables a more robust interconnect fill capability, and ensures greater device reliability.

The process was developed through a three-way partnership among Novellus, a provider of advanced process equipment for the global semiconductor industry, ATMI, and Enthone, a manufacturer and developer of high performance semiconductor products. Through an agreement with Enthone, ATMI markets and distributes ViaForm Extreme Pura worldwide for exclusive use on Novellus' market leading SABRE® Electrochemical Deposition product line. ViaForm Extreme Pura is available for immediate use.

In 2003, ATMI and Enthone formed a partnership to develop and distribute state-of-the-art electrochemistries to meet the developing need for manufacturing advanced copper interconnects. Since then, the ViaForm family of plating chemistries and the Novellus SABRE system has consistently met the stringent performance, uniformity, and device yield parameters required by the world’s leading manufacturers of copper chips.

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