Process/ Manufacturing Engineer with 3+ years Electronics Packaging Experience Posted on: 07/31/2008
MS IN MANUFACTURING TECHNOLOGY WITH 3+ YEARS OF ELECTRONICS MANUFACTURING EXPERIENCE IN PROCESS IMPROVEMENT, PROCESS DEVELOPMENT, FAILURE ANALYSIS AND ASSEMBLY RELIABILITY.
Exploring the possibility of securing a full time position, a Process Engineer, Manufacturing Engineer or a related engineering position, available in an Electronics Manufacturing company. I sincerely appreciate your time and consideration of this letter.
I am currently finishing my Master’s degree in Manufacturing and Mechanical Systems Integration at the Rochester Institute of Technology (RIT), with specialization in Electronics Packaging. I am also an ASQ certified SIX SIGMA Green Belt.
To view my
resume, click here.
To view cover letter
resume, click here.
Process Technology Engineer/ Engineering Technology Manager (Bay Area, CA) Posted on: 07/14/2008
Over fifteen years experience in research, design, development and implementation in the areas of soldering, surface mount and packaging technologies. Works well individually and in a team and has coordinated and completed multiple projects successfully. Extensive knowledge of lead-free/ ROHS and tin-lead soldering technologies with consultation in these and other areas by various electronic companies. Excellent verbal and written communication skills and enjoys presenting to groups. Regularly attended and presented at technical meetings and conferences globally, as well as chairing multiple industry groups and initiatives. BS and MS degrees in Materials Science.
Please view this candidate's resume by clicking here.