Root Cause Failure Analysis of Printed Circuit Board Assemblies Through Analysis of Product and Tooling DesignPresenter: Dale Lee
Company: Plexus Corporation
Date Published: 5/2/2010
With today's component packaging technology decreased size (length, width, thickness), increased interconnection density per unit area (thinner PCBs, smaller lines & spaces), increased functional performance (thermal, mechanical, electrical) at the same time as assembly processes are changing to lead-free assembly and other legislated requirements, root cause failure analysis of printed circuit board assemblies is critical to achieving a high first pass yield manufacturing process. This presentation and discussion will introduce the element of root cause failure analysis through the correlation of product and tooling design with assembly defects. The presentation will include examples of actual product design, manufacturing tooling design, and SMT & PTH assembly process issues matched to actual product failures.
failure analysis, product design, tooling design, SMT, PTH
Members: $0.00 (Log on to receive the member rate)